Patents by Inventor Matthew J. Gasch

Matthew J. Gasch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8409491
    Abstract: A tough ultra-high temperature ceramic (UHTC) composite comprises grains of UHTC matrix material, such as HfB2, ZrB2 or other metal boride, carbide, nitride, etc., surrounded by a uniform distribution of acicular high aspect ratio reinforcement ceramic rods or whiskers, such as of SiC, is formed from uniformly mixing a powder of the UHTC material and a pre-ceramic polymer selected to form the desired reinforcement species, then thermally consolidating the mixture by hot pressing. The acicular reinforcement rods may make up from 5 to 30 vol % of the resulting microstructure.
    Type: Grant
    Filed: August 22, 2011
    Date of Patent: April 2, 2013
    Assignee: The United States of America as Represented by the Administrator of the National Aeronautics & Space Administration (NASA)
    Inventors: Margaret M Stackpoole, Matthew J Gasch, Michael W Olson, Ian W. Hamby, Sylvia M Johnson
  • Patent number: 7077991
    Abstract: Densified composites of silicon nitride, silicon carbide, and boron nitride that exhibit high creep resistance are obtained by sintering a mixture of amorphous powders of silicon nitride, silicon carbide, and boron nitride in the presence of an electric field under high pressure. The grain size in the resulting composite is less than 100 nanometers for all components of the composite, and the composite exhibits high creep resistance.
    Type: Grant
    Filed: February 6, 2004
    Date of Patent: July 18, 2006
    Assignee: The Regents of the University of California
    Inventors: Julin Wan, Amiya K. Mukherjee, Matthew J. Gasch
  • Patent number: 7029613
    Abstract: Densified composites of silicon nitride and silicon carbide that exhibit high creep resistance are obtained by mechanically activating a mixture of amorphous powders of silicon nitride and silicon carbide and sintering the mechanically activated mixture in the presence of an electric field under high pressure. The grain size in the resulting composite is less than 100 nanometers for all components of the composite, and the composite exhibits high creep resistance.
    Type: Grant
    Filed: September 8, 2003
    Date of Patent: April 18, 2006
    Assignee: The Regents of the University of California
    Inventors: Julin Wan, Matthew J. Gasch, Amiya K. Mukherjee
  • Publication number: 20040179969
    Abstract: Densified composites of silicon nitride and silicon carbide that exhibit high creep resistance are obtained by mechanically activating a mixture of amorphous powders of silicon nitride and silicon carbide and sintering the mechanically activated mixture in the presence of an electric field under high pressure. The grain size in the resulting composite is less than 100 nanometers for all components of the composite, and the composite exhibits high creep resistance.
    Type: Application
    Filed: September 8, 2003
    Publication date: September 16, 2004
    Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA, a California corporation
    Inventors: Julin Wan, Matthew J. Gasch, Amiya K. Mukherjee