Abstract: A conduit array configured to route in-floor tubing includes a plurality of elbow conduits. A webbing is positioned between each of the elbow conduits in the plurality of elbow conduits to connect the plurality of elbow conduits. The webbing is configured to allow for separation of at least one of the plurality of elbow conduits from the conduit array, thus allowing for the conduit array to be scaleable or sizeable.

Abstract: A conduit array configured to route in-floor tubing includes a plurality of elbow conduits. A webbing is positioned between each of the elbow conduits in the plurality of elbow conduits to connect the plurality of elbow conduits. The webbing is configured to allow for separation of at least one of the plurality of elbow conduits from the conduit array, thus allowing for the conduit array to be scaleable or sizeable.

Abstract: A conduit array configured to route in-floor tubing includes a plurality of elbow conduits. A webbing is positioned between each of the elbow conduits in the plurality of elbow conduits to connect the plurality of elbow conduits. The webbing is configured to allow for separation of at least one of the plurality of elbow conduits from the conduit array, thus allowing for the conduit array to be scaleable or sizeable.

Abstract: A conduit array configured to route in-floor tubing includes a plurality of elbow conduits. A webbing is positioned between each of the elbow conduits in the plurality of elbow conduits to connect the plurality of elbow conduits. The webbing is configured to allow for separation of at least one of the plurality of elbow conduits from the conduit array, thus allowing for the conduit array to be scaleable or sizeable.

Abstract: An apparatus for containing objects, such as electronic circuit cards, and a method for making the same, the apparatus having a housing; at least one case disposed within the housing, the case adapted to confine the objects to different locations within the housing and comprising a frame, the region within the frame divided into two regions by a first partition, each of the two regions divided into a plurality of sections by a plurality of second partitions, each of the second partitions thermally coupled to the frame and the first partition, each of the sections divided into a plurality of slots, each slot having an object disposed therein for thermal contact between the first partition, a second partition, and one of a second partition and the frame; and at least one heat sink adapted to absorb heat from the case, the heat sink thermally coupled to the case and the housing.

Abstract: Method and systems for clamping at least one circuit card within a case are provided. The method includes compressing axially at least one resilient element between a head of a shaft and a nut disposed on the shaft so that the at least one resilient element bulges generally perpendicularly to the axial direction and into engagement with the at least one circuit card, exerting a force on the at least one circuit card using the at least one resilient element and maintaining the force on the at least one circuit card using the at least one resilient element.

Abstract: A housing for circuit cards is provided. The housing has a shell. A thermally conductive liner integral with the shell lines an interior of the shell. A protrusion of the liner extends through the shell and contacts the shell to form a pressure seal between the liner and the shell. A heat sink is disposed on an exterior surface of the shell and is thermally coupled to the protrusion of the liner. A case is disposed within the liner and is thermally coupled to the liner. The case is adapted to receive a plurality of circuit cards so that the plurality of circuit cards is thermally coupled to the case.

Abstract: A housing for circuit cards is provided. The housing has a shell. A thermally conductive liner integral with the shell lines an interior of the shell. A protrusion of the liner extends through the shell and contacts the shell to form a pressure seal between the liner and the shell. A heat sink is disposed on an exterior surface of the shell and is thermally coupled to the protrusion of the liner. A case is disposed within the liner and is thermally coupled to the liner. The case is adapted to receive a plurality of circuit cards so that the plurality of circuit cards is thermally coupled to the case.