Abstract: An apparatus for conveying and applying a discrete part to a substrate includes a plurality of transfer puck assemblies, a drive assembly, and a translation mechanism. The plurality of transfer puck assemblies is adapted to convey the discrete part to the substrate, and each transfer puck assembly includes at least one puck segment. The drive assembly is configured to rotate each transfer puck assembly about a drive axis. The translation mechanism is configured to translate the at least one puck segment in an axial direction as the plurality of transfer puck assemblies are being rotated about the drive axis to move the discrete part to a profiled configuration prior to application of the profiled discrete part to the substrate.

Abstract: An apparatus for conveying and applying a discrete part to a substrate includes a plurality of transfer puck assemblies, a drive assembly, and a translation mechanism. The plurality of transfer puck assemblies is adapted to convey the discrete part to the substrate, and each transfer puck assembly includes at least one puck segment. The drive assembly is configured to rotate each transfer puck assembly about a drive axis. The translation mechanism is configured to translate the at least one puck segment in an axial direction as the plurality of transfer puck assemblies are being rotated about the drive axis to move the discrete part to a profiled configuration prior to application of the profiled discrete part to the substrate.

Abstract: The present disclosure provides for an apparatus for using continuous, preferably smooth, bandsaw blades to cut a substrate. The current disclosure also discloses using the same for preparing a safe and efficient method for cutting substrates into rolls.