Abstract: A device for analysis of mechanical and thermal loading of structures can include: a first member comprising first material; a second member comprising second material; and a third member comprising the first material. The second member can be fastened at least partially between the first and third members. The device can be configured to mechanically load the first, second, and third members by applying equal and opposite force to protruding ends of the first, second, and third members. A device for analysis of mechanical and thermal loading of structures can include: a first member comprising first material; and a second member comprising second material. The first member can be fastened at least partially between portions of the second member. The device can be configured to mechanically load the first and second members by applying equal and opposite force to protruding ends of the first and second members.

Abstract: Methods of designing a structure taking into account thermal loads are presented. A method to analyze thermal build-up in a joint is presented. Physical testing between a first material and a second material is performed to determine physical data comprising at least one of stiffness, strain, load, and displacement. The physical data is analyzed. A closed form equation is generated based on the analysis to calculate the thermal build-up in the joint.