Patents by Inventor Matthew J. Pirih

Matthew J. Pirih has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12028978
    Abstract: An elongate, three dimensional, conductive, micro lattice truss structure has parallel layers of resilient strands so that the truss structure maintains structural integrity during end-to-end compression which shortens its uncompressed length. The resiliency of the micro lattice truss structure enables the truss structure to return to substantially its uncompressed length when the compression is removed. The truss structure is adapted to provide a resilient electrical connection between two opposing conductive areas on parallel spaced-apart printed circuit boards when the distal ends of the truss structure engage and are compressed between the two areas.
    Type: Grant
    Filed: August 9, 2021
    Date of Patent: July 2, 2024
    Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: Matthew J. Pirih, Steven J. Mass, Andrew Yurko
  • Publication number: 20210368622
    Abstract: An elongate, three dimensional, conductive, micro lattice truss structure has parallel layers of resilient strands so that the truss structure maintains structural integrity during end-to-end compression which shortens its uncompressed length. The resiliency of the micro lattice truss structure enables the truss structure to return to substantially its uncompressed length when the compression is removed. The truss structure is adapted to provide a resilient electrical connection between two opposing conductive areas on parallel spaced-apart printed circuit boards when the distal ends of the truss structure engage and are compressed between the two areas.
    Type: Application
    Filed: August 9, 2021
    Publication date: November 25, 2021
    Inventors: Matthew J. Pirih, Steven J. Mass, Andrew Yurko
  • Patent number: 11129277
    Abstract: An elongate, three dimensional, conductive, micro lattice truss structure has parallel layers of resilient strands so that the truss structure maintains structural integrity during end-to-end compression which shortens its uncompressed length. The resiliency of the micro lattice truss structure enables the truss structure to return to substantially its uncompressed length when the compression is removed. The truss structure is adapted to provide a resilient electrical connection between two opposing conductive areas when the distal ends of the truss structure engage and are compressed between the two areas.
    Type: Grant
    Filed: August 31, 2018
    Date of Patent: September 21, 2021
    Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: Matthew J. Pirih, Steven J. Mass, Andrew Yurko
  • Patent number: 10753346
    Abstract: A microwave electrothermal thruster (MET) and its control system is disclosed and claimed. The MET control system uses a dielectric resonator oscillator (DRO) in series with a GaN MMIC-based Solid State Power Amplifier (SSPA) to generate microwave energy, transfer it to a thrust chamber, and heat a propellant that exits a nozzle, providing thrust. The control system uses feedback to provide autonomous control of the MET. A wide variety of propellants may be used, including, for example, hydrazine, ammonia, and water.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: August 25, 2020
    Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: Daniel R. Sherman, Edward Lukas, Brandon Quon, Kurt Shaffer, Jonathan H. Dang, Matthew J. Pirih
  • Publication number: 20180376595
    Abstract: In an exemplary method, three dimensional printing forms a micro lattice truss structure with a first end formed in contact with a conductive area on a PCB so that the truss structure is adhered to the conductive area due to the three dimensional printing. The truss structure extends outward from the PCB and has a distal end. The truss structure is formed with resiliency so that the truss structure maintains structural integrity during end-to-end compression. The resiliency of the micro lattice truss structure enables the truss structure to return to substantially its uncompressed length when the compression is removed. The truss structure is conductive so that a resilient electrical connection can be formed between the conductive area of the PCB and another spaced apart surface parallel with the PCB when the distal end of the truss structure is in contact with and compressed by the other surface.
    Type: Application
    Filed: August 31, 2018
    Publication date: December 27, 2018
    Inventors: Matthew J. Pirih, Steven J. Mass, Andrew Yurko
  • Patent number: 10104773
    Abstract: In an exemplary method, three dimensional printing forms a micro lattice truss structure with a first end formed in contact with a conductive area on a PCB so that the truss structure is adhered to the conductive area due to the three dimensional printing. The truss structure extends outward from the PCB and has a distal end. The truss structure is formed with resiliency so that the truss structure maintains structural integrity during end-to-end compression. The resiliency of the micro lattice truss structure enables the truss structure to return to substantially its uncompressed length when the compression is removed. The truss structure is conductive so that a resilient electrical connection can be formed between the conductive area of the PCB and another spaced apart surface parallel with the PCB when the distal end of the truss structure is in contact with and compressed by the other surface.
    Type: Grant
    Filed: January 27, 2016
    Date of Patent: October 16, 2018
    Assignee: Northrop Grumman Systems Corporation
    Inventors: Matthew J. Pirih, Steven J. Mass, Andrew Yurko
  • Publication number: 20170215286
    Abstract: In an exemplary method, three dimensional printing forms a micro lattice truss structure with a first end formed in contact with a conductive area on a PCB so that the truss structure is adhered to the conductive area due to the three dimensional printing. The truss structure extends outward from the PCB and has a distal end. The truss structure is formed with resiliency so that the truss structure maintains structural integrity during end-to-end compression. The resiliency of the micro lattice truss structure enables the truss structure to return to substantially its uncompressed length when the compression is removed. The truss structure is conductive so that a resilient electrical connection can be formed between the conductive area of the PCB and another spaced apart surface parallel with the PCB when the distal end of the truss structure is in contact with and compressed by the other surface.
    Type: Application
    Filed: January 27, 2016
    Publication date: July 27, 2017
    Inventors: Matthew J. Pirih, Steven J. Mass, Andrew Yurko