Abstract: An end effector includes a body, a first tine, and a second tine. The body includes first, second, and third substrate support pads, the first substrate support pad defines a first height, the second substrate support pad defines a second height less than the first height, and the third substrate support pad defines a third height equal to the first height. The first tine includes fourth and fifth substrate support pads, the fourth substrate support pad defines a fourth height equal to the second height, and the fifth substrate support pad defines a fifth height equal to the first and third heights. The second tine includes sixth and seventh substrate support pads, the sixth substrate support pad defines a sixth height equal to the first, third, and fifth heights, the seventh substrate support pad defines a seventh height equal to the second and fourth heights.

Abstract: An end effector includes a body, a first tine, and a second tine. The body includes first, second, and third substrate support pads, the first substrate support pad defines a first height, the second substrate support pad defines a second height less than the first height, and the third substrate support pad defines a third height equal to the first height. The first tine includes fourth and fifth substrate support pads, the fourth substrate support pad defines a fourth height equal to the second height, and the fifth substrate support pad defines a fifth height equal to the first and third heights. The second tine includes sixth and seventh substrate support pads, the sixth substrate support pad defines a sixth height equal to the first, third, and fifth heights, the seventh substrate support pad defines a seventh height equal to the second and fourth heights.

Abstract: An end effector includes first, second, third, fourth, fifth, sixth, and seventh substrate support pads. A method of handling a substrate with the end effector in a substrate processing system includes engaging a peripheral edge of the substrate with the second, fifth, and sixth substrate support pads. The method also includes moving the end effector a first distance into a processing chamber of the substrate processing system. The method further includes disengaging the peripheral edge of the substrate from the second, fifth, and sixth substrate support pads. The method additionally includes moving the end effector a second distance into the processing chamber of the substrate processing system, and engaging the peripheral edge of the substrate with the first, third, fourth, and seventh substrate support pads.

Abstract: Provided herein are high coefficient of friction contact surfaces for transfer of substrates including semiconductor wafers. In certain implementations, the contact surfaces include microstructures that exploit intermolecular surface forces for increased adhesion and friction in the x-y direction during substrate transfer, while allowing easy release in the z-direction without tilting the substrate. Also provided are robot end effectors including the contact surfaces and related high-throughput transfer systems and methods.

Abstract: An end effector includes first, second, third, fourth, fifth, sixth, and seventh substrate support pads. A method of handling a substrate with the end effector in a substrate processing system includes engaging a peripheral edge of the substrate with the second, fifth, and sixth substrate support pads. The method also includes moving the end effector a first distance into a processing chamber of the substrate processing system. The method further includes disengaging the peripheral edge of the substrate from the second, fifth, and sixth substrate support pads. The method additionally includes moving the end effector a second distance into the processing chamber of the substrate processing system, and engaging the peripheral edge of the substrate with the first, third, fourth, and seventh substrate support pads.

Abstract: A wafer handling traction control system is provided that is able to detect slippage of a semiconductor wafer with respect to an end effector and is able to adjust the end effector's movement in order to minimize further slippage. Upon the detection of relative motion of the semiconductor wafer with respect to the end effector past a threshold amount, the end effector's movements are adjusted to minimize slippage of the semiconductor wafer. The wafer handling traction control system may include a sensor that detects relative motion between the semiconductor wafer and the end effector.

Abstract: A wafer handling traction control system is provided that is able to detect slippage of a semiconductor wafer with respect to an end effector and is able to adjust the end effector's movement in order to minimize further slippage. Upon the detection of relative motion of the semiconductor wafer with respect to the end effector past a threshold amount, the end effector's movements are adjusted to minimize slippage of the semiconductor wafer. The wafer handling traction control system may include a sensor that detects relative motion between the semiconductor wafer and the end effector.

Abstract: An apparatus is provided for lifting a substrate. The apparatus comprises a first piece and a second piece. The apparatus further comprises a set of first contact points in a plane and a set of second contact points, where at least one contact point from each set is present on the first piece and the second piece. The apparatus also comprises an actuator that translates the first piece, substantially parallel to the plane, between a first position and a second position relative to the second piece. Additionally, the first position arranges the set of first contact points so that all of the contact points of the set of first contact points are able to engage the substrate, and the second position arranges the set of second contact points so that all of the contact points of the second set of contact points are able to engage the substrate.

Abstract: A wafer handling traction control system is provided that is able to detect slippage of a semiconductor wafer with respect to an end effector and is able to adjust the end effector's movement in order to minimize further slippage. Upon the detection of relative motion of the semiconductor wafer with respect to the end effector past a threshold amount, the end effector's movements are adjusted to minimize slippage of the semiconductor wafer. The wafer handling traction control system may include a sensor that detects relative motion between the semiconductor wafer and the end effector.

Abstract: A wafer handling traction control system is provided that is able to detect slippage of a semiconductor wafer with respect to an end effector and is able to adjust the end effector's movement in order to minimize further slippage. Upon the detection of relative motion of the semiconductor wafer with respect to the end effector past a threshold amount, the end effector's movements are adjusted to minimize slippage of the semiconductor wafer. The wafer handling traction control system may include a sensor that detects relative motion between the semiconductor wafer and the end effector.

Abstract: Provided herein are high coefficient of friction contact surfaces for transfer of substrates including semiconductor wafers. In certain implementations, the contact surfaces include microstructures that exploit intermolecular surface forces for increased adhesion and friction in the x-y direction during substrate transfer, while allowing easy release in the z-direction without tilting the substrate. Also provided are robot end effectors including the contact surfaces and related high-throughput transfer systems and methods.

Abstract: Systems, methods, and computer programs are presented for an end effector with a dual optical sensor. One end effector includes an arm, a mapping sensor, and a load sensor. The arm has one end connected to a pivoting joint, and a light signal is routed around the arm through a single light path. The mapping sensor is used for identifying the presence of the wafer when the wafer is not loaded on the end effector. The load sensor is used for identifying presence of the wafer on the end effector when the wafer is loaded on the end effector. The load sensor is defined by a second segment in the single light path such that the wafer intersects the second segment and interferes with the single light path when the wafer is loaded. A control module determines if an interruption in the single light path corresponds to an interruption of the single light path in the mapping sensor or the load sensor. As a result, one single light sensor is used to sense for two different conditions in the end effector.

Abstract: An apparatus is provided for lifting a substrate. The apparatus comprises a first piece and a second piece. The apparatus further comprises a set of first contact points in a plane and a set of second contact points, where at least one contact point from each set is present on the first piece and the second piece. The apparatus also comprises an actuator that translates the first piece, substantially parallel to the plane, between a first position and a second position relative to the second piece. Additionally, the first position arranges the set of first contact points so that all of the contact points of the set of first contact points are able to engage the substrate, and the second position arranges the set of second contact points so that all of the contact points of the second set of contact points are able to engage the substrate.

Abstract: Systems, methods, and computer programs are presented for an end effector with a dual optical sensor. One end effector includes an arm, a mapping sensor, and a load sensor. The arm has one end connected to a pivoting joint, and a light signal is routed around the arm through a single light path. The mapping sensor is used for identifying the presence of the wafer when the wafer is not loaded on the end effector. The load sensor is used for identifying presence of the wafer on the end effector when the wafer is loaded on the end effector. The load sensor is defined by a second segment in the single light path such that the wafer intersects the second segment and interferes with the single light path when the wafer is loaded. A control module determines if an interruption in the single light path corresponds to an interruption of the single light path in the mapping sensor or the load sensor. As a result, one single light sensor is used to sense for two different conditions in the end effector.