Patents by Inventor Matthew J. Schaenzer

Matthew J. Schaenzer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic packaging apparatus and method
    Patent number: 7672132
    Abstract: An electronic assembly includes a substrate, a device attached to the substrate, and a thermally conductive heat spreader covering the device and at least a portion of the substrate. A metal substantially fills the space between the device and the thermally conductive heat spreader. A method includes attaching at least one die to a substrate, placing a thermally conductive heat spreader over the die, and injecting a molten metal material into the space between the thermally conductive heat spreader and the die.
    Type: Grant
    Filed: December 5, 2006
    Date of Patent: March 2, 2010
    Assignee: Intel Corporation
    Inventors: Thomas J Fitzgerald, Carl L. Deppisch, Manjit Dhindsa, Mark Norwil, Matthew J. Schaenzer
  • Thermally coupling an integrated heat spreader to a heat sink base
    Publication number: 20080156457
    Abstract: The base of a heat sink may be selectively plated with a solder wetting material and soldered to an integral heat spreader also selectively plated with gold. In another embodiment, the solder may be applied in the form of an insert made up of an electrical heating wire sandwiched between indium foil which acts as solder when heated by the intervening wire.
    Type: Application
    Filed: March 12, 2008
    Publication date: July 3, 2008
    Inventors: Matthew J. Schaenzer, Thomas J. Fitzgerald, Tim A. Renfro, Manjit Dhindsa, Vaibhav P. Trivedi
  • Thermally coupling an integrated heat spreader to a heat sink base
    Patent number: 7364063
    Abstract: The base of a heat sink may be selectively plated with a solder wetting material and soldered to an integral heat spreader also selectively plated with gold. In another embodiment, the solder may be applied in the form of an insert made up of an electrical heating wire sandwiched between indium foil which acts as solder when heated by the intervening wire.
    Type: Grant
    Filed: August 9, 2004
    Date of Patent: April 29, 2008
    Assignee: Intel Corporation
    Inventors: Matthew J. Schaenzer, Thomas J. Fitzgerald, Tim A. Renfro, Manjit Dhindsa, Vaibhav P. Trivedi
  • Electronic packaging apparatus and method
    Patent number: 7160758
    Abstract: An electronic assembly includes a substrate, a device attached to the substrate, and a thermally conductive heat spreader covering the device and at least a portion of the substrate. A metal substantially fills the space between the device and the thermally conductive heat spreader. A method includes attaching at least one die to a substrate, placing a thermally conductive heat spreader over the die, and injecting a molten metal material into the space between the thermally conductive heat spreader and the die.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: January 9, 2007
    Assignee: Intel Corporation
    Inventors: Thomas J Fitzgerald, Carl L. Deppisch, Manjit Dhindsa, Mark Norwil, Matthew J. Schaenzer
  • Data cartridge corner roller with stepped bore
    Patent number: 5765772
    Abstract: A corner roller for a belt-driven tape cartridge consists of an outer wall which contacts a drive belt in the cartridge and an inner wall attached to the outer wall. The inner wall includes a stepped axial bore which engages a shaft attached to a baseplate of the cartridge. A small diameter region of the axial bore forms a journal bearing surface for the shaft, and this surface preferably has a length and orientation with respect to the cartridge baseplate sufficient to symmetrically distribute on the journal bearing surface a load exerted on the corner roller by the cartridge belt.
    Type: Grant
    Filed: March 17, 1997
    Date of Patent: June 16, 1998
    Assignee: Imation Corp.
    Inventors: Randy S. Bay, James L. Albrecht, Matthew J. Schaenzer, Mary R. Hable, David L. Tussey
  • Write protect slide
    Patent number: D376589
    Type: Grant
    Filed: November 30, 1994
    Date of Patent: December 17, 1996
    Assignee: Imation Corp.
    Inventors: Claude E. Cybulski, James J. Evanoff, Arthur V. Lang, Vern E. Radewald, Dean E. Sitz, Matthew J. Schaenzer