Patents by Inventor Matthew J. SPITZNER
Matthew J. SPITZNER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210219417Abstract: Indium-based interface systems, structures, and methods for forming the same are provided. The disclosed indium-based interfaces may be formed as solid structures between two solid surfaces by providing a solid indium-based material between the two surfaces, and heating the indium-based material above its melting point while in contact with each of the two surfaces to cause the indium-based material to reflow or otherwise liquefy between the two surfaces. The indium-based material may then be cooled below its melting point to form a solid interface material structure that is positioned between and in contact with each of the surfaces.Type: ApplicationFiled: March 29, 2021Publication date: July 15, 2021Inventors: Matthew J. Spitzner, Fernando Ortiz
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Patent number: 10973114Abstract: Indium-based interface systems, structures, and methods for forming the same are provided. The disclosed indium-based interfaces may be formed as solid structures between two solid surfaces by providing a solid indium-based material between the two surfaces, and heating the indium-based material above its melting point while in contact with each of the two surfaces to cause the indium-based material to reflow or otherwise liquefy between the two surfaces. The indium-based material may then be cooled below its melting point to form a solid interface material structure that is positioned between and in contact with each of the surfaces.Type: GrantFiled: October 29, 2018Date of Patent: April 6, 2021Assignee: L3 Technologies, Inc.Inventors: Matthew J. Spitzner, Fernando Ortiz
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Publication number: 20200137876Abstract: Indium-based interface systems, structures, and methods for forming the same are provided. The disclosed indium-based interfaces may be formed as solid structures between two solid surfaces by providing a solid indium-based material between the two surfaces, and heating the indium-based material above its melting point while in contact with each of the two surfaces to cause the indium-based material to reflow or otherwise liquefy between the two surfaces. The indium-based material may then be cooled below its melting point to form a solid interface material structure that is positioned between and in contact with each of the surfaces.Type: ApplicationFiled: October 29, 2018Publication date: April 30, 2020Inventors: Matthew J. Spitzner, Fernando Ortiz
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Patent number: 10608356Abstract: Multiple node bus bar contacts for high-power electronic assemblies are disclosed. The electronic assembly includes a plurality of circuit card assemblies (CCAs) for an electronic assembly, a plurality of socket connectors coupled within the plurality of CCAs, and a bus bar contact. The bus bar contact includes a rod positioned to extend through two or more socket connectors within two or more CCAs where the rod is in electrical contact with the two or more socket connectors, and the bus bar contact includes a bar coupled to the rod and having a first portion routed to an outer edge of the electronic assembly. In addition, the bar can also include a second portion with a connector, and the connector can be coupled to a bus bar providing electrical current for the electronic assembly. Further, a plurality of bus bar contacts can also be included within the electronic assembly.Type: GrantFiled: August 30, 2018Date of Patent: March 31, 2020Assignee: L-3 Technologies, Inc.Inventor: Matthew J. Spitzner
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Publication number: 20200076100Abstract: Multiple node bus bar contacts for high-power electronic assemblies are disclosed. The electronic assembly includes a plurality of circuit card assemblies (CCAs) for an electronic assembly, a plurality of socket connectors coupled within the plurality of CCAs, and a bus bar contact. The bus bar contact includes a rod positioned to extend through two or more socket connectors within two or more CCAs where the rod is in electrical contact with the two or more socket connectors, and the bus bar contact includes a bar coupled to the rod and having a first portion routed to an outer edge of the electronic assembly. In addition, the bar can also include a second portion with a connector, and the connector can be coupled to a bus bar providing electrical current for the electronic assembly. Further, a plurality of bus bar contacts can also be included within the electronic assembly.Type: ApplicationFiled: August 30, 2018Publication date: March 5, 2020Inventor: Matthew J. Spitzner
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Patent number: 10206294Abstract: An electronic apparatus comprising: 1) a first circuit board; 2) a second circuit board substantially parallel to the first circuit board; and 3) an electrical assembly coupled between the first and second boards. The electrical assembly comprises: i) a housing; ii) a plurality of pogo pin connectors disposed within and projecting from the housing and configured to make electrical contact with the first and second circuit boards; and iii) a plurality of capacitors disposed within the housing and configured to form electrical connections with selected ones of the plurality of pogo pin connectors.Type: GrantFiled: March 3, 2017Date of Patent: February 12, 2019Assignee: L3 Technologies Inc.Inventors: David Nail, Matthew J. Spitzner, Joel B. Gorman
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Publication number: 20180255653Abstract: An electronic apparatus comprising: 1) a first circuit board; 2) a second circuit board substantially parallel to the first circuit board; and 3) an electrical assembly coupled between the first and second boards. The electrical assembly comprises: i) a housing; ii) a plurality of pogo pin connectors disposed within and projecting from the housing and configured to make electrical contact with the first and second circuit boards; and iii) a plurality of capacitors disposed within the housing and configured to form electrical connections with selected ones of the plurality of pogo pin connectors.Type: ApplicationFiled: March 3, 2017Publication date: September 6, 2018Applicant: L3 Technologies Inc.Inventors: David NAIL, Matthew J. SPITZNER, Joel B. GORMAN
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Patent number: 9935347Abstract: An electronic circuit assembly comprising: i) a circuit card assembly (CCA) having circuits integrated on a circuit surface; ii) a housing having an upper surface and a lower surface disposed on the CCA circuit surface, the housing comprising a via extending from the lower surface to the upper surface; and iii) a waveguide assembly disposed in the via. The waveguide assembly comprises: a) a first waveguide having a first dielectric value, a contact end of the first waveguide configured to make contact with the CCA circuit surface; b) a second waveguide having a second dielectric value, wherein the first dielectric value is greater than the second dielectric value; and c) a carrier for holding the first waveguide in contact with the second waveguide. The electronic circuit assembly further comprises: iv) a wave washer disposed in the via on a support surface of the carrier; and v) a third waveguide having a third dielectric value that is less than the second dielectric value.Type: GrantFiled: November 23, 2015Date of Patent: April 3, 2018Assignee: L-3 Communications CorporationInventor: Matthew J. Spitzner
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Publication number: 20170146273Abstract: An evaporator apparatus comprising a liquid distribution chamber and a vapor production chamber. The vapor production chamber comprises a media wick that absorbs heat from a source external to the vapor production chamber. The vapor production chamber is configured to receive liquid coolant from the liquid distribution chamber and to direct the received liquid coolant onto a surface of the media wick. The media wick distributes the received liquid coolant from the surface of the media wick throughout a body of the media wick. The heat absorbed by the media wick vaporizes the liquid coolant distributed throughout the body of the media wick. The coolant vapor flows from the media wick into the vapor production chamber.Type: ApplicationFiled: November 23, 2015Publication date: May 25, 2017Applicant: L-3 Communications CorporationInventors: Matthew J. SPITZNER, John Michael RODGERS, Richard M. WEBER
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Publication number: 20170149114Abstract: An electronic circuit assembly comprising: i) a circuit card assembly (CCA) having circuits integrated on a circuit surface; ii) a housing having an upper surface and a lower surface disposed on the CCA circuit surface, the housing comprising a via extending from the lower surface to the upper surface; and iii) a waveguide assembly disposed in the via. The waveguide assembly comprises: a) a first waveguide having a first dielectric value, a contact end of the first waveguide configured to make contact with the CCA circuit surface; b) a second waveguide having a second dielectric value, wherein the first dielectric value is greater than the second dielectric value; and c) a carrier for holding the first waveguide in contact with the second waveguide. The electronic circuit assembly further comprises: iv) a wave washer disposed in the via on a support surface of the carrier; and v) a third waveguide having a third dielectric value that is less than the second dielectric value.Type: ApplicationFiled: November 23, 2015Publication date: May 25, 2017Applicant: L-3 Communications CorporationInventor: Matthew J. SPITZNER