Patents by Inventor Matthew J. Swass

Matthew J. Swass has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of hermetically self-sealing a flip chip
    Patent number: 5699611
    Abstract: A package containing an integrated circuit has all of its I/O contacts on one of the package faces. The periphery of that face is processed to be wettable with solder. The substrate to which the package is to be attached has corresponding contacts and has a solder wettable ring comparable to the ring at the periphery at the package face. When the package is positioned on the substrate it is hermetically sealed therearound by soldering the two rings together, such as by reflow soldering.
    Type: Grant
    Filed: August 16, 1995
    Date of Patent: December 23, 1997
    Assignee: Hughes Electronics
    Inventors: Garrett Isao Kurogi, Matthew J. Swass
  • Hermetically self-sealing flip chip
    Patent number: 5578874
    Abstract: A package containing an integrated circuit has all of its I/O contacts on one of the package faces. The periphery of that face is processed to be wettable with solder. The substrate to which the package is to be attached has corresponding contacts and has a solder wettable ring comparable to the ring at the periphery at the package face. When the package is positioned on the substrate it is hermetically sealed therearound by soldering the two rings together, such as by reflow soldering.
    Type: Grant
    Filed: June 14, 1994
    Date of Patent: November 26, 1996
    Assignee: Hughes Aircraft Company
    Inventors: Garrett I. Kurogi, Matthew J. Swass