Abstract: A directional coupler includes a substrate, an output line formed on a top of the substrate, and an input line formed on the top of the substrate and including a transmission region. The coupler also includes a lower input line formed on a bottom of the substrate below at least a portion of the transmission region, and one or more vias passing through the substrate and electrically coupling the input line and the lower input line.

Abstract: The concepts, systems and methods described herein are directed towards a connectorless radio frequency (RF) interface between an antenna and RF processor. An RF interconnect is provided having a housing having a ridged waveguide portion provided therein, an upper cavity formed in an upper portion of the housing, a lower cavity formed in a lower portion of the housing, a first suspended air stripline (SAS) transmission line disposed in the lower cavity such that at least a portion of the first SAS transmission line crossed a slot formed by the ridged waveguide and a second SAS transmission line disposed in the upper cavity such that at least a portion of the second SAS transmission line crosses the slot formed by the ridged waveguide.

Abstract: A directional coupler includes a substrate, an output line formed on a top of the substrate, and an input line formed on the top of the substrate and including a transmission region. The coupler also includes a lower input line formed on a bottom of the substrate below at least a portion of the transmission region, and one or more vias passing through the substrate and electrically coupling the input line and the lower input line.

Abstract: A flat plate assembly is provided from at least a pair of plates with at least one surface of one plate have one or more relief channels provided therein around epoxy bonded signal channels. The relief channels are provided having a size and shape selected to control the flow of a liquid bonding adhesive. Adhesive location can thus be controlled through geometry of the relief channels rather than through process controls. Thus, this approach reduces dependence on adhesive process control, reduces wicking of adhesive into signal channels and reduces the number of voids in a bond line of a bonded flat plate assembly.

Abstract: The concepts, systems and methods described herein are directed towards a connectorless radio frequency (RF) interface between an antenna and RF processor. An RF interconnect is provided having a housing having a ridged waveguide portion provided therein, an upper cavity formed in an upper portion of the housing, a lower cavity formed in a lower portion of the housing, a first suspended air stripline (SAS) transmission line disposed in the lower cavity such that at least a portion of the first SAS transmission line crossed a slot formed by the ridged waveguide and a second SAS transmission line disposed in the upper cavity such that at least a portion of the second SAS transmission line crosses the slot formed by the ridged waveguide.

Abstract: A flat plate assembly is provided from at least a pair of plates with at least one surface of one plate have one or more relief channels provided therein around epoxy bonded signal channels. The relief channels are provided having a size and shape selected to control the flow of a liquid bonding adhesive. Adhesive location can thus be controlled through geometry of the relief channels rather than through process controls. Thus, this approach reduces dependence on adhesive process control, reduces wicking of adhesive into signal channels and reduces the number of voids in a bond line of a bonded flat plate assembly.