Patents by Inventor Matthew James Holcomb

Matthew James Holcomb has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11135643
    Abstract: A mould-forming and sacrificial materials are printed into a plurality of layers. The sacrificial material is removed to leave a void defined by a mould structure formed by the mould-forming material. The void is filled with a part-forming material to form the part defined by the shape of the mould structure. The mould structure is removed from the part to free the part from the mould structure. According to a further method, the part-forming material serves the purpose of supporting the mould-forming material and then forming the part. In this case, the part-forming material can be printed together with a mould-forming material as described above and are then heated to a temperature of approximately 700° C. to activate a binder and then heated to a temperature that melts the part-forming material.
    Type: Grant
    Filed: February 4, 2019
    Date of Patent: October 5, 2021
    Assignee: GRID LOGIC INCORPORATED
    Inventors: Matthew James Holcomb, Ira James Holcomb, Jr.
  • Publication number: 20190240724
    Abstract: A mould-forming and sacrificial materials are printed into a plurality of layers. The sacrificial material is removed to leave a void defined by a mould structure formed by the mould-forming material. The void is filled with a part-forming material to form the part defined by the shape of the mould structure. The mould structure is removed from the part to free the part from the mould structure. According to a further method, the part-forming material serves the purpose of supporting the mould-forming material and then forming the part. In this case, the part-forming material can be printed together with a mould-forming material as described above and are then heated to a temperature of approximately 700° C. to activate a binder and then heated to a temperature that melts the part-forming material.
    Type: Application
    Filed: February 4, 2019
    Publication date: August 8, 2019
    Applicant: Grid Logic Incorporated
    Inventors: Matthew James Holcomb, Ira James Holcomb, JR.