Patents by Inventor Matthew Julian Thompson

Matthew Julian Thompson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250197193
    Abstract: A MEMS accelerometer includes a proof mass that rotates about an in-plane axis in response to a linear acceleration such that a portion of the proof mass moves out of plane along an out-of-plane axis in a direction of a bump stop. When the proof mass becomes stuck to the bump stop, a signal is applied to one or more anti-stiction electrodes in a manner that moves the proof mass along a movement axis in order to release the proof mass from the bump stop.
    Type: Application
    Filed: December 13, 2024
    Publication date: June 19, 2025
    Inventors: Roberto Martini, Matthew Julian Thompson, Luca Coronato
  • Publication number: 20250197192
    Abstract: A proof mass of a MEMS sensor is located above one or more bump stops that extend in the direction of the proof mass from a base substrate, and that are intended to prevent high-impact collisions between the proof mass and base substrate such as when the sensor is dropped or experiences other substantial external forces. A portion of the proof mass located above the bump stop is patterned at the same time that the functional features of the MEMS layer such as springs and masses are fabricated. The patterning reduces stiction between the proof mass and the bump stop, allowing the MEMS sensor to resume operation promptly after an event that results in contact between the proof mass and the bump stop.
    Type: Application
    Filed: December 13, 2024
    Publication date: June 19, 2025
    Inventors: Sarah Nitzan, Matthew Julian Thompson, Mostafa Baghdadi
  • Publication number: 20250060392
    Abstract: A MEMS device incorporates a first sensor and a second sensor to receive an external excitation and respectively output signals to processing circuitry. The processing circuitry combines the first and second signals to create a third signal, which includes an output from the first sensor when the external excitation is between a first and second frequency relatively close to DC and an output from the second sensor when the external excitation is between a third and fourth frequency at a higher frequency range.
    Type: Application
    Filed: October 31, 2023
    Publication date: February 20, 2025
    Inventors: Matthew Julian Thompson, Joseph Seeger, Gavin Ho
  • Publication number: 20240426867
    Abstract: A MEMS sensor may include multiple sense electrodes located relative to respective portions of one or more proof masses of a MEMS layer of the sensor. Individual sense electrodes are capable of individual calibration within the drive and/or sense path for the sense electrode. A distance between each individual sense electrode relative to a proof mass is determined for the at-rest state of the sensor. Calibration values are determined based on these distances, and individual drive and/or sense signals associated with each sense electrode are modified to adjust for changes in distance, such as are caused by shifting, tilting, or bending of the MEMS layer or substrate.
    Type: Application
    Filed: June 26, 2023
    Publication date: December 26, 2024
    Inventors: Matthew Julian Thompson, Roberto Martini
  • Publication number: 20240425354
    Abstract: A microelectromechanical system (MEMS) accelerometer incorporates deformation sensing with a plurality of sense electrodes positioned to facilitate determining a deformation pattern (e.g., asymmetric or symmetric) of an underlying substrate layer relative to a MEMS layer. The deformation pattern of the substrate layer contributes to offset and/or sensitivity of the accelerometer, so the determination of the deformation pattern enables processing circuitry to compensate and improve offset and/or sensitivity stability. Tilt sense electrodes and/or comparison electrodes may be incorporated alongside the plurality of sense electrodes to monitor deformation of the substrate layer relative to a fixed portion of the MEMS layer.
    Type: Application
    Filed: June 26, 2023
    Publication date: December 26, 2024
    Inventors: Roberto Martini, Luca Coronato, Matthew Julian Thompson
  • Publication number: 20240351864
    Abstract: An actuator layer of a MEMS sensor is be fabricated to include multi-level features, such as additional sense electrodes, vertical bump stops, or weighted proof masses. A sacrificial layer is deposited on the actuator layer such that locations are provided for the multi-level features to extend vertically from the actuator layer. After the multi-layer features are fabricated on the actuator layer the sacrificial layer is removed. Additional processing such as patterning of the actuator layer may be performed to provide desired functionality and electrical signals to portions of the actuator layer, including to the multi-level features.
    Type: Application
    Filed: April 19, 2023
    Publication date: October 24, 2024
    Inventors: Roberto Martini, Matthew Julian Thompson, Giacomo Gafforelli, Luca Coronato, Luigi Esposito
  • Publication number: 20240069061
    Abstract: A microelectromechanical system device is described. The microelectromechanical system device can comprise: a proof mass coupled to an anchor via a spring, wherein the proof mass moves in response to an imposition of an external load to the proof mass, and an overtravel stop comprising a first portion and a second portion.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Inventors: Matthew Julian Thompson, Robert Walmsley
  • Patent number: 11846648
    Abstract: A microelectromechanical system device is described. The microelectromechanical system device can comprise: a proof mass coupled to an anchor via a spring, wherein the proof mass moves in response to an imposition of an external load to the proof mass, and an overtravel stop comprising a first portion and a second portion.
    Type: Grant
    Filed: January 7, 2022
    Date of Patent: December 19, 2023
    Assignee: INVENSENSE, INC.
    Inventors: Matthew Julian Thompson, Robert Walmsley
  • Publication number: 20230365397
    Abstract: A MEMS sensor includes at least one anchor that extends into a MEMS layer and a proof mass suspended from the at least one anchor. Each anchor is coupled to the proof mass via two compliant springs that are oriented perpendicular to each other and attached to a respective anchor. The compliant springs absorb non-measured external forces such as shear forces that are applied to the sensor packaging, preventing these forces from modifying the relative location and operation of the proof mass.
    Type: Application
    Filed: May 10, 2022
    Publication date: November 16, 2023
    Inventors: Mrigank Sharma, Varun Subramaniam Kumar, Luca Coronato, Giacomo Laghi, Matthew Julian Thompson
  • Patent number: 11761977
    Abstract: A MEMS sensor includes a central anchoring region that maintains the relative position of an attached proof mass relative to sense electrodes in the presence of undesired forces and stresses. The central anchoring region includes one or more first anchors that rigidly couple to a cover substrate and a base substrate. One or more second anchors are rigidly coupled to only the cover substrate and are connected to the one or more first anchors within the MEMS layer via an isolation spring. The proof mass in turn is connected to the one or more second anchors via one or more compliant springs.
    Type: Grant
    Filed: April 29, 2022
    Date of Patent: September 19, 2023
    Assignee: InvenSense, Inc.
    Inventors: Varun Subramaniam Kumar, Mrigank Sharma, Giacomo Laghi, Luca Coronato, Matthew Julian Thompson
  • Patent number: 11738994
    Abstract: An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.
    Type: Grant
    Filed: December 13, 2022
    Date of Patent: August 29, 2023
    Assignee: InvenSense, Inc.
    Inventors: David deKoninck, Varun Subramaniam Kumar, Matthew Julian Thompson, Vadim Tsinker, Logeeswaran Veerayah Jayaraman, Sarah Nitzan, Houri Johari-Galle, Jongwoo Shin, Le Jin
  • Publication number: 20230221345
    Abstract: A microelectromechanical system device is described. The microelectromechanical system device can comprise: a proof mass coupled to an anchor via a spring, wherein the proof mass moves in response to an imposition of an external load to the proof mass, and an overtravel stop comprising a first portion and a second portion.
    Type: Application
    Filed: January 7, 2022
    Publication date: July 13, 2023
    Inventors: Matthew Julian Thompson, Robert Walmsley
  • Publication number: 20230107211
    Abstract: An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.
    Type: Application
    Filed: December 13, 2022
    Publication date: April 6, 2023
    Inventors: David deKoninck, Varun Subramaniam Kumar, Matthew Julian Thompson, Vadim Tsinker, Logeeswaran Veerayah Jayaraman, Sarah Nitzan, Houri Johari-Galle, Jongwoo Shin, Le Jin
  • Patent number: 11548780
    Abstract: An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.
    Type: Grant
    Filed: November 1, 2021
    Date of Patent: January 10, 2023
    Assignee: InvenSense, Inc.
    Inventors: David deKoninck, Varun Subramaniam Kumar, Matthew Julian Thompson, Vadim Tsinker, Logeeswaran Veerayah Jayaraman, Sarah Nitzan, Houri Johari-Galle, Jongwoo Shin, Le Jin
  • Patent number: 11287443
    Abstract: A MEMS accelerometer includes a suspended spring-mass system that has a frequency response to accelerations experienced over a range of frequencies. The components of the suspended spring-mass system such as the proof masses respond to acceleration in a substantially uniform manner at frequencies that fall within a designed bandwidth for the MEMS accelerometer. Digital compensation circuitry compensates for motion of the proof masses outside of the designed bandwidth, such that the functional bandwidth of the MEMS accelerometer is significantly greater than the designed bandwidth.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: March 29, 2022
    Assignee: INVENSENSE, INC.
    Inventors: Sriraman Dakshinamurthy, Vadim Tsinker, Matthew Julian Thompson
  • Patent number: 11255876
    Abstract: A method of measuring noise of an accelerometer can comprise exposing the accelerometer comprising a micro-electro-mechanical system (MEMS) component coupled to an application specific integrated circuit component (ASIC), to an external environmental input, with the MEMS component being configured to provide a first output to the ASIC based on the external environmental input. The method can further comprise estimating a first noise generated by operation of the MEMS component, and replacing the first output provided to the ASIC from the MEMS component, with a second output generated by a MEMS emulator component, with the second output comprising the first noise. Further, the method can include generating an output of the accelerometer based on the second output processed by the ASIC.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: February 22, 2022
    Assignee: INVENSENSE, INC.
    Inventors: Sriraman Dakshinamurthy, Matthew Julian Thompson, Vadim Tsinker
  • Publication number: 20220048760
    Abstract: An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.
    Type: Application
    Filed: November 1, 2021
    Publication date: February 17, 2022
    Inventors: David deKoninck, Varun Subramaniam Kumar, Matthew Julian Thompson, Vadim Tsinker, Logeeswaran Veerayah Jayaraman, Sarah Nitzan, Houri Johari-Galle, Jongwoo Shin, Le Jin
  • Patent number: 11231441
    Abstract: Exemplary embodiment of a tilting z-axis, out-of-plane sensing MEMS accelerometers and associated structures and configurations are described. Disclosed embodiments facilitate improved offset stabilization. Non-limiting embodiments provide exemplary MEMS structures and apparatuses characterized by one or more of having a sensing MEMS structure that is symmetric about the axis orthogonal to the springs or flexible coupling axis, a spring or flexible coupling axis that is aligned to one of the symmetry axes of the electrodes pattern, a different number of reference electrodes and sense electrodes, a reference MEMS structure having at least two symmetry axes, one which is along the axis of the springs or flexible coupling, and/or a reference structure below the spring or flexible coupling axis.
    Type: Grant
    Filed: April 7, 2020
    Date of Patent: January 25, 2022
    Assignee: INVENSENSE, INC.
    Inventors: Giacomo Laghi, Matthew Julian Thompson, Luca Coronato, Roberto Martini
  • Patent number: 11186479
    Abstract: An exemplary microelectromechanical device includes a MEMS layer, portions of which respond to an external force in order to measure the external force. A substrate layer is located below the MEMS layer and an anchor couples the substrate layer and MEMS layer to each other. A plurality of temperature sensors are located within the substrate layer to identify a temperature gradient being experienced by the MEMS device. Compensation is performed or operations of the MEMS device are modified based on temperature gradient.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: November 30, 2021
    Assignee: INVENSENSE, INC.
    Inventors: David deKoninck, Varun Subramaniam Kumar, Matthew Julian Thompson, Vadim Tsinker, Logeeswaran Veerayah Jayaraman, Sarah Nitzan, Houri Johari-Galle, Jongwoo Shin, Le Jin
  • Patent number: 11174153
    Abstract: A microelectromechanical (MEMS) device may be coupled to a dielectric material at an upper planar surface or lower planar surface of the MEMS device. One or more temperature sensors may be attached to the dielectric material layer. Signals from the one or more temperature sensors may be used to determine a thermal gradient along on axis that is normal to the upper planar surface and the lower planar surface. The thermal gradient may be used to compensate for values measured by the MEMS device.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: November 16, 2021
    Assignee: INVENSENSE, INC.
    Inventors: Ilya Gurin, Matthew Julian Thompson, Vadim Tsinker