Abstract: Methods, systems, and apparatus, including medium-encoded computer program products, for collaboration and view sharing between users when performing editing operations over a shared document. A first portion of a shared document is displayed to a first user in a user interface of a first instance of a collaboration application of a first user. The displayed first portion comprises a first location of the first user within the shared document. In the user interface, an indication specifying a relative locational direction from the first location towards a second location of a second user within the shared document is provided. A second portion of the shared document is being displayed to the second user through a second instance of the collaboration application during a conference call between a set of users, where the displayed second portion includes the second location of the second user within the shared document.

Abstract: The present invention is addressed to a cradle for a musical instrument, which consists of a support having a figure-8 configuration including a pair of loops adapted to support the musical instrument without the use of any fastening device. The cradle also consists of a strap having a pair of ends, each of which is connected to a loop of the support. A buckle may be provided to adjust the length of the strap. In use, a musical instrument is positioned in the inventive cradle with the loops supporting the instrument. The strap is secured about a user so that the musical instrument is supported in a substantially horizontal position by the loops. Thereafter, the instrument is removed by lifted the instrument from the support.

Abstract: An apparatus for polishing a semiconductor wafer is provided comprising a wafer carrier to provide a force against a wafer and a rotating polishing pad during the polishing operation and a polishing slurry distributor device disposed to provide a spray of the slurry on the polishing pad. The wafer is polished using less slurry than a conventional polishing apparatus while still maintaining the polishing rates and polishing uniformity of the prior art polishing apparatus. A preferred spraying means is a closed elongated tube having a plurality of openings which tube is positioned over at least one-half the diameter of the polishing pad and a polishing slurry under pressure is directed onto the surface of the pad, preferably in a substantially transverse spray stream.

Abstract: Disclosed is an improved apparatus and method for polishing a semiconductor wafer, which involves mounting the wafer to a carrier assembly. The wafer carrier assembly has been split into two plates which are joined by springs around the peripheries. The wafer carrier assembly is universally mounted on a rotation shaft which rotates the wafer carrier assembly during cleaning. An adjustment screw tilts the upper plate relative to the lower plate. The adjustment screw can be located at any predetermined point on a circle around the rotation shaft. Since the bottom plate is forced relatively flat by contact with a polishing pad, the net effect of the wafer carrier assembly is to apply increased pressure to the wafer edge under the screw. This provides for an even polishing action to compensate for otherwise non-uniform radial polishing action on the wafer surface.