Abstract: Surfaces for electromagnetic shielding, retaining electrostatic charge and indeed collecting ion current in EHD fluid mover designs may be formed as or on surfaces of other components and/or structures in an electronic device. In this way, dimensions may be reduced and packing densities increased. In some cases, electrostatically operative portions of an EHD fluid mover are formed as or on surfaces of an enclosure, an EMI shield, a circuit board and/or a heat pipe or spreader. Depending on the role of these electrostatically operative portions, dielectric, resistive and/or ozone robust or catalytic coatings or conditioning may be applied.

Abstract: An electronic system enclosure houses a plurality of electronic components together presenting one or more surfaces coated with ozone reducing material. An EHD air mover positioned remote from an outlet ventilation boundary of the enclosure motivates air flow through the enclosure along a flow path past the one or more surfaces coated with ozone destructive material over heat transfer surfaces and out through an outlet ventilation boundary of the enclosure.

Abstract: Surfaces for electromagnetic shielding, retaining electrostatic charge and indeed collecting ion current in EHD fluid mover designs may be formed as or on surfaces of other components and/or structures in an electronic device. In this way, dimensions may be reduced and packing densities increased. In some cases, electrostatically operative portions of an EHD fluid mover are formed as or on surfaces of an enclosure, an EMI shield, a circuit board and/or a heat pipe or spreader. Depending on the role of these electrostatically operative portions, dielectric, resistive and/or ozone robust or catalytic coatings or conditioning may be applied.

Abstract: In one aspect, an electronic assembly includes an interconnection substrate, a component, and a discontinuity compensator. The interconnection substrate includes a signal conductor and a ground conductor. The component includes a device having a signal line and a ground conductor, a package, and a signal lead. The signal lead is electrically coupled to an internal signal path of the package and has an external portion extending from the package to the signal conductor of the interconnection substrate. The discontinuity compensator electrically couples a ground path of the package to the ground conductor of the interconnection substrate. The discontinuity compensator includes an electrically conducting planar surface that is oriented in a plane intersecting the interconnection substrate and forms with at least a substantial part of the external portion of the signal lead a transmission line structure having an impedance substantially matching the nominal impedance over the specified bandwidth.

Abstract: A monolithic bail-delatch mechanism is provided for a module plugged into a cage. The bail-delatch mechanism is a single monolithic unit that includes a living hinge connecting a bail and a delatch clip. The living hinge, the bail, and the delatch clip may be made of a single injection molded plastic part. The bail may include cantilever hooks for securing the bail against the module in a latched position. The delatch clip may include a spring mechanism having two spring arms for locking the bail-delatch mechanism to the module, and a delatch fork having tines with wedges for releasing a post of the module from a latch tab of the cage.

Abstract: A fiber optic module includes a first housing insert molded with an electromagnetic interference (EMI) shield, an optoelectronic subassembly mounted in the first housing, and a second housing mounted to the first housing to enclose the optoelectronic subassembly. The EMI shield includes a conductive mesh and conductive contact fingers. The first housing includes a non-conductive housing floor, non-conductive housing sidewalls, and a non-conductive nose defining at least one connector receptacle, wherein the housing floor and the housing sidewalls are injection molded through the mesh of the EMI shield to be integral with the nose and so that the fingers at least partially surround the nose.

Abstract: A mechanical device is used for releasing and extracting a fiber optic module from a cage.

Abstract: A surface mountable coaxial solder interconnect. The invention provides a small, low-cost, passively self-aligning, high-frequency electronic interconnect adapted to mass production and method. The invention includes a substrate, a signal conductor, and an annular conductor. The substrate incorporates an annular pad and a signal pad substantially centered within the annular pad. The signal conductor includes reflowed solder and is wetted to the signal pad. Similarly, the annular conductor includes reflowed solder and is wetted to the annular pad. The invention may also provide a second substrate substantially parallel to the first substrate that includes a second annular pad and a second signal pad substantially centered within the second annular pad. In such a case, the signal conductor is also wetted to the second signal pad, and, similarly, the annular conductor is also wetted to the second annular pad. The method of the invention includes obtaining a mask and a substrate.

Abstract: The invention provides an improved donor substrate for the formation and transfer of solder bumps useful in IC packaging and related interconnect applications. The donor substrate is improved by shaping the solder paste containment region (cavity) so that during reflow, the solder bump is urged to protrude significantly above the surface of the donor substrate, enabling proximity transfer of the solder bump to a receiving substrate.

Abstract: A surface mountable high frequency electronic package consisting of substrates stacked on top of each other, with arbitrarily-shaped solder structures such as balls and walls connecting them together; forming a fully-shielded, environmentally-sealed, sandwich in which smaller electronic components and devices are placed. In addition to providing electronic and mechanical interconnection to a mother substrate, the solder structures also provide electromagnetic isolation and shielding, controlled-impedance transmission line structures, and an environmental seal. The entire package is fabricated from conventional materials and components assembled together with automated processes.

Abstract: A mask support device including two communicating elements, a first element having ferromagnetic shunts, and a second element containing permanent magnets, and wherein the elements are rotatable about a central axis and assume fixed positions in the rotation. The mask support device in one position attracts a ferromagnetic metal mask. In a second position, owing to the shunt redirecting the magnetic field, releases the metal mask.

Abstract: A solder bump is stenciled onto a substrate, providing bumped substrate at pitches below 400 microns. The solder is applied through stencil/mask and paste method; the mask, however, remains attached to the substrate during reflow. Pitches of greater than 400 microns may also be obtained through the invention. The invention further provides for generation of uniform, controllable volume metal balls.

Abstract: A solder bump is stenciled onto a substrate, providing bumped substrate at pitches below 400 microns. The solder is applied through stencil/mask and paste method; the mask, however, remains attached to the substrate during reflow. Pitches of greater than 400 microns may also be obtained through the invention. The invention further provides for generation of uniform, controllable volume metal balls.

Abstract: A solder bump is stenciled onto a substrate, providing bumped substrate at pitches below 400 microns. The solder is applied through stencil/mask and paste method; the mask, however, remains attached to the substrate during reflow. Pitches of greater than 400 microns may also be obtained through the invention. The invention further provides for generation of uniform, controllable volume metal balls.

Abstract: A solder bump is stenciled into a substrate, providing bumped substrate at pitches below 400 microns. The solder is applied through stencil/mask and paste method; the mask, however, remains attached to the substrate during reflow. Pitches of greater than 400 microns may also be obtained through the invention.