Patents by Inventor Matthew K. Smith

Matthew K. Smith has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11938738
    Abstract: In some examples, an apparatus can include a syringe body including an electrical interface at a side surface of the syringe body, an interface at an end of the syringe body including an output at a distal surface of the syringe body, a print material particles reservoir located in the syringe body, and a structure to adapt a volume of the print material particles reservoir to move print material particles out of the print material particles reservoir through the output, where in response to the volume adapting structure moving from a first position to a second position, a signal is transmitted by the electrical interface.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: March 26, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Andrew P. Chick, Kenneth K. Smith, Jiwon Moon, Minul Lee, Matthew James Storey, An Tran, Bennett Alexander Nadeau, Zackary Thomas Hickman
  • Patent number: 11365336
    Abstract: In order to provide a thermally conductive polymer-based resin that may be molded using a range of thermoplastic manufacturing techniques, a composition includes a thermoplastic polymer and/or elastomer, a polymer fiber, a binding agent, and a thermally conductive filler. The composition includes from 40 to 80 volume percentage of a thermoplastic polymer and/or a thermoplastic elastomer, from 5 to 30 volume percentage of a polymer fiber, from 0.1 to 20 volume percentage of a binding agent, and from 10 to 40 volume percentage of a thermally conductive filler. The polymer fibers and thermally conductive fillers are combined to create a hybrid thermally conductive particle for better feeding in standard plastic processing methods. The polymer fiber has an aspect ratio greater than 10. The filler has a thermal conductivity greater than or equal to 10 W/m-K. The composition is characterized by a thermal conductivity of at least 1 W/m-K.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: June 21, 2022
    Assignee: Georgia Tech Research Corporation
    Inventors: Thomas L. Bougher, Matthew K. Smith, Baratunde Cola, Kyriaki Kalaitzidou
  • Publication number: 20200131419
    Abstract: In order to provide a thermally conductive polymer-based resin that may be molded using a range of thermoplastic manufacturing techniques, a composition includes a thermoplastic polymer and/or elastomer, a polymer fiber, a binding agent, and a thermally conductive filler. The composition includes from 40 to 80 volume percentage of a thermoplastic polymer and/or a thermoplastic elastomer, from 5 to 30 volume percentage of a polymer fiber, from 0.1 to 20 volume percentage of a binding agent, and from 10 to 40 volume percentage of a thermally conductive filler. The polymer fibers and thermally conductive fillers are combined to create a hybrid thermally conductive particle for better feeding in standard plastic processing methods. The polymer fiber has an aspect ratio greater than 10. The filler has a thermal conductivity greater than or equal to 10 W/m-K. The composition is characterized by a thermal conductivity of at least 1 W/m-K.
    Type: Application
    Filed: October 25, 2019
    Publication date: April 30, 2020
    Inventors: Thomas L. Bougher, Matthew K. Smith, Baratunde Cola, Kyriaki Kalaitzidou