Abstract: A system and method to generate a website for a user system. A set of static assets associated with the website are generated. A first document of a first data record is transformed from a first schema to a second schema to generate a first transformed document. A data graph associated with the user system is generated, where the data graph includes the first transformed document and a portion of HTML, content of a data record received via a first data stream of a set of data streams. A web page including the portion of HTML content is rendered. The set of static assets and the web page of the website are provisioned to the user system.

Abstract: A system and method to generate a website for a user system. The system and method generating, in a first phase, a set of static assets associated with the website of the user system. In a second phase, a set of web pages based on one or more data streams including data associated with the user system is generated. The system and method provision the set of static assets and the set of web pages of the website to the user system.

Abstract: A system and method to generate a website for a user system. The system and method generating, in a first phase, a set of static assets associated with the website of the user system. In a second phase, a set of web pages based on one or more data streams including data associated with the user system is generated. The system and method provision the set of static assets and the set of web pages of the website to the user system.

Abstract: The present invention relates to a chemical mechanical polishing (CMP) machine and method in which at least one polishing device is provided with a vertically-oriented polishing surface and a slurry delivery mechanism. As a result, the footprint of the machine is greatly reduced and the prevention of contaminants embedding in the polishing device can be promoted.

Abstract: A desired reagent is delivered to a workpiece undergoing a chemical mechanical polishing process with a chemical mechanical planarization apparatus. A slurry and polishing pad are provided for the polishing process. Reagent containing microcapsules are also provided, the microcapsules encapsulating a desired reagent. The workpiece is polished with a combination of the slurry, the polishing pad, and the microcapsules, wherein the encapsulated reagents are controllably released during the polishing step via manipulation of a polishing parameter. In one embodiment, the microcapsules are included in the slurry. In an alternate embodiment, the microcapsules are embedded within the polishing pad.