Patents by Inventor Matthew L. Fisher
Matthew L. Fisher has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20110117696Abstract: Disclosed are etching compositions and processes of using the same for etching the surface of CdTe-containing layers.Type: ApplicationFiled: November 18, 2010Publication date: May 19, 2011Applicant: Air Liquide Electronics U.S. LPInventor: Matthew L. FISHER
-
Patent number: 7498295Abstract: This disclosure discusses cleaning of semiconductor wafers after the Chemical-Mechanical Planarization (CMP) of the wafer during the manufacturing of semiconductor devices. Disclosed is an alkaline chemistry for the post-CMP cleaning of wafers containing metal, particularly copper, interconnects. Residual slurry particles, particularly copper or other metal particles, are removed from the wafer surface without significantly etching the metal, leaving deposits on the surface, or imparting significant contamination to the wafer while also protecting the metal from oxidation and corrosion. Additionally, at least one strong chelating agent is present to complex metal ions in solution, facilitating the removal of metal from the dielectric and preventing re-deposition onto the wafer.Type: GrantFiled: July 31, 2007Date of Patent: March 3, 2009Assignee: Air Liquide Electronics U.S. LPInventors: Matthew L. Fisher, Ashutosh Misra
-
Patent number: 7435712Abstract: This disclosure discusses cleaning of semiconductor wafers after the Chemical-Mechanical Planarization (CMP) of the wafer during the manufacturing of semiconductor devices. Disclosed is an alkaline chemistry for the post-CMP cleaning of wafers containing metal, particularly copper, interconnects. Residual slurry particles, particularly copper or other metal particles, are removed from the wafer surface without significantly etching the metal, leaving deposits on the surface, or imparting significant contamination to the wafer while also protecting the metal from oxidation and corrosion. Additionally, at least one strong chelating agent is present to complex metal ions in solution, facilitating the removal of metal from the dielectric and preventing re-deposition onto the wafer.Type: GrantFiled: October 1, 2004Date of Patent: October 14, 2008Assignee: Air Liquide America, L.P.Inventors: Ashutosh Misra, Matthew L. Fisher
-
Publication number: 20080142375Abstract: Compositions and methods suitable for the electrochemical mechanical planarization of a conductive material layer on a semiconductor workpiece. Compositions contain a phosphonic acid based electrolyte, a corrosion inhibitor, a chelating agent, a pH adjusting agent, and a solvent as the remainder.Type: ApplicationFiled: September 28, 2007Publication date: June 19, 2008Inventors: Francois Doniat, Matthew L. Fisher, Alan D. Zdunek, Alexandro A. Barajas, Ian Suni, Xiangfeng Chu, Abhinav Tripathi, Yuzhuo Li
-
Publication number: 20080125341Abstract: This disclosure discusses cleaning of semiconductor wafers after the Chemical-Mechanical Planarization (CMP) of the wafer during the manufacturing of semiconductor devices. Disclosed is an acidic chemistry for the post-CMP cleaning of wafers containing metal, particularly copper, interconnects. Residual slurry particles, particularly copper or other metal particles, are removed from the wafer surface without significantly etching the metal, leaving deposits on the surface, or imparting significant organic (such as carbon) contamination to the wafer while also protecting the metal from oxidation and corrosion. Additionally, at least one strong chelating agent is present to complex metal ions in solution, facilitating the removal of metal from the dielectric and preventing re-deposition onto the wafer. Using acidic chemistry, it is possible to match the pH of the cleaning solution used after CMP to that of the last slurry used on the wafer surface.Type: ApplicationFiled: October 25, 2007Publication date: May 29, 2008Applicant: Air Liquide America L.P.Inventors: Ashutosh MISRA, Matthew L. Fisher
-
Patent number: 7297670Abstract: This disclosure discusses cleaning of semiconductor wafers after the Chemical-Mechanical Planarization (CMP) of the wafer during the manufacturing of semiconductor devices. Disclosed is an acidic chemistry for the post-CMP cleaning of wafers containing metal, particularly copper, interconnects. Residual slurry particles, particularly copper or other metal particles, are removed from the wafer surface without significantly etching the metal, leaving deposits on the surface, or imparting significant organic (such as carbon) contamination to the wafer while also protecting the metal from oxidation and corrosion. Additionally, at least one strong chelating agent is present to complex metal ions in solution, facilitating the removal of metal from the dielectric and preventing re-deposition onto the wafer. Using acidic chemistry, it is possible to match the pH of the cleaning solution used after CMP to that of the last slurry used on the wafer surface.Type: GrantFiled: June 9, 2006Date of Patent: November 20, 2007Assignee: Air Liquide America L.P.Inventors: Ashutosh Misra, Matthew L. Fisher
-
Patent number: 7087564Abstract: This disclosure discusses cleaning of semiconductor wafers after the Chemical-Mechanical Planarization (CMP) of the wafer during the manufacturing of semiconductor devices. Disclosed is an acidic chemistry for the post-CMP cleaning of wafers containing metal, particularly copper, interconnects. Residual slurry particles, particularly copper or other metal particles, are removed from the wafer surface without significantly etching the metal, leaving deposits on the surface, or imparting significant organic (such as carbon) contamination to the wafer while also protecting the metal from oxidation and corrosion. Additionally, at least one strong chelating agent is present to complex metal ions in solution, facilitating the removal of metal from the dielectric and preventing re-deposition onto the wafer. Using acidic chemistry, it is possible to match the pH of the cleaning solution used after CMP to that of the last slurry used on the wafer surface.Type: GrantFiled: October 1, 2004Date of Patent: August 8, 2006Assignee: Air Liquide America, L.P.Inventors: Ashutosh Misra, Matthew L. Fisher
-
Patent number: 6943878Abstract: Provided are methods and systems for controlling the concentration of a component in a composition, and semiconductor processing methods and systems. One exemplary method of controlling the concentration of a component in a composition involves: providing a composition which has a liquid portion, wherein the liquid portion contains a component to be monitored; performing an absorption spectroscopy measurement on a sample of the composition; and controlling the concentration of the component in the composition based on the absorption spectroscopy measurement using a feedback control loop. The invention allows for controlling the concentration of a component in a composition, for example, a corrosion inhibitor in a chemical planarization (CMP) chemical, as well as in pre- and post-CMP storage/treatment chemicals, and can provide real time, accurate process control in a simple and robust manner.Type: GrantFiled: May 25, 2004Date of Patent: September 13, 2005Assignee: Air Liquide Electronics U.S. LPInventors: Matthew L. Fisher, David L. Snyder, Ashutosh Misra
-
Publication number: 20040218173Abstract: Provided are methods and systems for controlling the concentration of a component in a composition, and semiconductor processing methods and systems. One exemplary method of controlling the concentration of a component in a composition involves: providing a composition which has a liquid portion, wherein the liquid portion contains a component to be monitored; performing an absorption spectroscopy measurement on a sample of the composition; and controlling the concentration of the component in the composition based on the absorption spectroscopy measurement using a feedback control loop. The invention allows for controlling the concentration of a component in a composition, for example, a corrosion inhibitor in a chemical planarization (CMP) chemical, as well as in pre- and post-CMP storage/treatment chemicals, and can provide real time, accurate process control in a simple and robust manner.Type: ApplicationFiled: May 25, 2004Publication date: November 4, 2004Inventors: Matthew L. Fisher, David L. Snyder, Ashutosh Misra
-
Publication number: 20040166584Abstract: A method and apparatus for performing online monitoring of a chemical state of a process material. A request to provide a process chemical to a processing tool is received. The process chemical is transported through a chemical transport unit, based upon the request, to the processing tool. An online monitoring of a chemical state of the process chemical is performed. The online monitoring of the process chemical includes analyzing a resultant of a radiation signal sent through the process chemical to determine a refractive index to determine whether the chemical state of the process chemical is within a predetermined level of tolerance.Type: ApplicationFiled: December 11, 2003Publication date: August 26, 2004Inventors: Ashutosh Misra, Matthew L. Fisher
-
Publication number: 20040159399Abstract: A method and apparatus for performing online monitoring of a physical characteristic of a process material. A request to provide a slurry to a processing tool is received. The slurry is transported through a slurry transport unit, based upon the request, to the processing tool. An online monitoring of a physical characteristic of the slurry is performed. The online monitoring of the slurry includes analyzing an optical signal sent through the slurry to determine whether the physical characteristic of the slurry is within a predetermined level of tolerance.Type: ApplicationFiled: December 11, 2003Publication date: August 19, 2004Inventors: Ashutosh Misra, Matthew L. Fisher
-
Patent number: 6762832Abstract: Provided are methods and systems for controlling the concentration of a component in a composition, and semiconductor processing methods and systems. One exemplary method of controlling the concentration of a component in a composition involves: providing a composition which has a liquid portion, wherein the liquid portion contains a component to be monitored; performing an absorption spectroscopy measurement on a sample of the composition; and controlling the concentration of the component in the composition based on the absorption spectroscopy measurement using a feedback control loop. The invention allows for controlling the concentration of a component in a composition, for example, a corrosion inhibitor in a chemical planarization (CMP) chemical, as well as in pre- and post-CMP storage/treatment chemicals, and can provide real time, accurate process control in a simple and robust manner.Type: GrantFiled: June 21, 2002Date of Patent: July 13, 2004Assignee: Air Liquide America, L.P.Inventors: Matthew L. Fisher, David L. Snyder, Ashutosh Misra
-
Patent number: 6749691Abstract: Methods of removing discoloration from a metal surface of an electronic device are presented the methods comprising the steps of exposing a metallic surface of an electronic device to a first composition comprising an organic reagent, the metallic surface having discoloration thereon, under conditions sufficient to form a first intermediate metallic surface substantially devoid of non-ionic residues; a second step of contacting the first intermediate metallic surface with a second composition comprising an acid under conditions sufficient to form a second intermediate metallic surface substantially devoid of non-ionic residues, oxides, hydroxides and the like; and rinsing the second intermediate metallic surface with deionized water.Type: GrantFiled: February 14, 2002Date of Patent: June 15, 2004Assignee: Air Liquide America, L.P.Inventors: Ashutosh Misra, Matthew L. Fisher
-
Publication number: 20030020907Abstract: Provided are methods and systems for controlling the concentration of a component in a composition, and semiconductor processing methods and systems. One exemplary method of controlling the concentration of a component in a composition involves: providing a composition which has a liquid portion, wherein the liquid portion contains a component to be monitored; performing an absorption spectroscopy measurement on a sample of the composition; and controlling the concentration of the component in the composition based on the absorption spectroscopy measurement using a feedback control loop. The invention allows for controlling the concentration of a component in a composition, for example, a corrosion inhibitor in a chemical planarization (CMP) chemical, as well as in pre- and post-CMP storage/treatment chemicals, and can provide real time, accurate process control in a simple and robust manner.Type: ApplicationFiled: June 21, 2002Publication date: January 30, 2003Inventors: Matthew L. Fisher, David L. Snyder, Ashutosh Misra
-
Publication number: 20020108633Abstract: Methods of removing discoloration from a metal surface of an electronic device are presented the methods comprising the steps of exposing a metallic surface of an electronic device to a first composition comprising an organic reagent, the metallic surface having discoloration thereon, under conditions sufficient to form a first intermediate metallic surface substantially devoid of non-ionic residues; a second step of contacting the first intermediate metallic surface with a second composition comprising an acid under conditions sufficient to form a second intermediate metallic surface substantially devoid of non-ionic residues, oxides, hydroxides and the like; and rinsing the second intermediate metallic surface with deionized water.Type: ApplicationFiled: February 14, 2002Publication date: August 15, 2002Applicant: American Air Liquide, Inc.Inventors: Ashutosh Misra, Matthew L. Fisher
-
Publication number: 20020094579Abstract: A method of determining a concentration of a component of a slurry includes the step of measuring change in refractive index associated with changes in concentration of the component of interest in the slurry.Type: ApplicationFiled: December 20, 2001Publication date: July 18, 2002Applicant: Air Liquide America CorporationInventors: Ashutosh Misra, Matthew L. Fisher