Patents by Inventor Matthew LANGLEY

Matthew LANGLEY has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ARRANGEMENT FOR JOINING AND SEALING A METALLIC HYDROGEN SEPARATION MEMBRANE TO A METALLIC CONNECTOR
    Publication number: 20260001041
    Abstract: The present invention provides a joining and sealing arrangement for joining and sealing together a hydrogen separation membrane to a metallic connector comprising: a metallic hydrogen separation membrane mounted on or against a connector formation of the connector about a longitudinal axis, the connector being formed of a different metal to the hydrogen separation membrane, the hydrogen separation membrane having an outer diameter (D) about the longitudinal axis, the hydrogen separation membrane and the connector formation contacting at a connection interface in which an end face of the hydrogen separation membrane is proximate to, substantially abuts or overlaps an adjoining face of the connector formation; a connection that connects the hydrogen separation membrane and the connector formation about the connection interface; and a constriction collar configured to extend from at least the connection interface and extend axially over the hydrogen separation membrane relative to the longitudinal axis, the
    Type: Application
    Filed: July 6, 2023
    Publication date: January 1, 2026
    Inventors: David Michael Viano, Matthew Langley, Sandy Edwards, Mark Andrew Kochanek
  • Method of forming a Pd—Au alloy layer on a substrate
    Patent number: 12168199
    Abstract: A method for preparing a palladium-gold alloy layer on a substrate by electrodepositing said coating surface with an aqueous electroplating solution comprising of an aqueous solution of a soluble palladium compound and a soluble gold complex, wherein the ratio of gold to palladium to in the solution is from 5 to 40 w/w %. Also taught is a substrate such as a vanadium or vanadium alloy gas separation membrane coated with a palladium-gold alloy layer.
    Type: Grant
    Filed: July 1, 2022
    Date of Patent: December 17, 2024
    Assignee: Commonwealth Scientific and Industrial Research Organisation
    Inventors: Matthew Langley, David Viano, Michael Dolan
  • METHOD OF FORMING A PD-AU ALLOY LAYER ON A SUBSTRATE
    Publication number: 20220403541
    Abstract: A method for preparing a palladium-gold alloy layer on a substrate by electrodepositing said coating surface with an aqueous electroplating solution comprising of an aqueous solution of a soluble palladium compound and a soluble gold complex, wherein the ratio of gold to palladium to in the solution is from 5 to 40 w/w %. Also taught is a substrate such as a vanadium or vanadium alloy gas separation membrane coated with a palladium-gold alloy layer.
    Type: Application
    Filed: July 1, 2022
    Publication date: December 22, 2022
    Applicant: COMMONWEALTH SCIENTIFIC AND INDUSTRIAL RESEARCH ORGANISATION
    Inventors: Matthew LANGLEY, David VIANO, Michael DOLAN
  • METHOD OF FORMING A PD-AU LAYER ON A SUBSTRATE
    Publication number: 20190127870
    Abstract: A method for preparing a palladium-gold alloy layer on a substrate by electrodepositing said coating surface with an aqueous electroplating solution comprising of an aqueous solution of a soluble palladium compound and a soluble gold complex, wherein the ratio of gold to palladium to in the solution is from 5 to 40 w/w %. Also taught is a substrate such as a vanadium or vanadium alloy gas separation membrane coated with a palladium-gold alloy layer.
    Type: Application
    Filed: June 6, 2017
    Publication date: May 2, 2019
    Applicant: COMMONWEALTH SCIENTIFIC AND INDUSTRIAL RESEARCH ORGANISATION
    Inventors: Matthew LANGLEY, David VIANO, Michael DOLAN