Abstract: In various embodiments, a tissue thickness compensator can comprise one or more capsules and/or pockets comprising at least one medicament therein. In at least one embodiment, staples can be fired through the tissue thickness compensator to rupture the capsules. In certain embodiments, a firing member, or knife, can be advanced through the tissue thickness compensator to rupture the capsules.

Abstract: Disclosed are barrier coatings for fused silica components used in semiconductor processing. In particular, the present disclosure concerns protective substrate-barrier coatings composed of corrosion-resilient metal compounds which provide superior resistance to erosion/corrosion when a coated substrate is subjected to the acidic environments at elevated temperatures typical for semiconductor processing.

Abstract: The system and method for forming an ignition sequencer comprising two inseparable portions (a body and an armature) where an armature is articulable with respect to a body to allow for the existence of no less than two distinct stages of the ignition sequence through the articulating motion of the additively-manufactured armature. The ignition sequencer assembly architecture allows for installation of an internal energetic compound while all components are assembled and interconnected. The ignition sequencer assembly architecture allows for installation into a next higher-level assembly using a single, uniaxial, force.

Abstract: The system and method for forming an ignition sequencer comprising two inseparable portions (a body and an armature) where an armature is articulable with respect to a body to allow for the existence of no less than two distinct stages of the ignition sequence through the articulating motion of the additively-manufactured armature. The ignition sequencer assembly architecture allows for installation of an internal energetic compound while all components are assembled and interconnected. The ignition sequencer assembly architecture allows for installation into a next higher-level assembly using a single, uniaxial, force.

Abstract: Disclosed are barrier coatings for fused silica components used in semiconductor processing. In particular, the present disclosure concerns protective substrate-barrier coatings composed of corrosion-resilient metal compounds which provide superior resistance to erosion/corrosion when a coated substrate is subjected to the acidic environments at elevated temperatures typical for semiconductor processing.

Abstract: The present disclosure relates generally to optical media and/or encapsulant precursors and optical media encapsulants produced therefrom, the optical media and/or encapsulants configurable for use in lighting devices. Specifically, the optical media and/or encapsulant precursors comprises at least one chemically functionalized silsesquioxane moiety. Methods of reducing degradation from heat and/or optical flux exposure using the optical media and/or encapsulant comprising chemically functionalized silsesquioxane are disclosed.