Patents by Inventor Matthew Meitl

Matthew Meitl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160381789
    Abstract: In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.
    Type: Application
    Filed: March 29, 2016
    Publication date: December 29, 2016
    Inventors: John A. ROGERS, Matthew MEITL, Yugang SUN, Heung Cho KO, Andrew CARLSON, Won Mook CHOI, Mark STOYKOVICH, Hanqing JIANG, Yonggang HUANG, Ralph G. NUZZO, Zhengtao ZHU, Etienne MENARD, Dahl-Young KHANG
  • Publication number: 20160365702
    Abstract: According to an embodiment, a crystalline color-conversion device includes an electrically driven first light emitter, for example a blue or ultraviolet LED, for emitting light having a first energy in response to an electrical signal. An inorganic solid single-crystal direct-bandgap second light emitter having a bandgap of a second energy less than the first energy is provided in association with the first light emitter. The second light emitter is electrically isolated from, located in optical association with, and physically connected to the first light emitter so that in response to the electrical signal the first light emitter emits first light that is absorbed by the second light emitter and the second light emitter emits second light having a lower energy than the first energy.
    Type: Application
    Filed: August 24, 2015
    Publication date: December 15, 2016
    Inventors: Christopher Bower, Matthew Meitl, Ronald S. Cok
  • Publication number: 20160365026
    Abstract: A distributed charge-pump power-supply system includes a system substrate with a plurality of separate electronic elements spatially distributed over the system substrate. Each electronic element includes first and second sub-elements requiring first and second different operating voltage connections. A plurality of separate charge-pump circuits are also spatially distributed over the system substrate. Each charge-pump circuit has a common charge-pump power supply connection and provides the first and second voltage connection supplying operating electrical power to the first and second sub-elements. The electronic elements are arranged in groups of one or more electronic elements and the first and second voltage connections for each group are provided by a charge-pump circuit.
    Type: Application
    Filed: August 24, 2015
    Publication date: December 15, 2016
    Inventors: Christopher Bower, Matthew Meitl, Robert R. Rotzoll
  • Patent number: 9520537
    Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 ?m to 50 ?m), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.
    Type: Grant
    Filed: June 18, 2015
    Date of Patent: December 13, 2016
    Assignee: X-Celeprint Limited
    Inventors: Christopher Bower, Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg, Alin Fecioru, Carl Prevatte
  • Publication number: 20160351539
    Abstract: An inorganic-light-emitter display includes a display substrate and a plurality of spatially separated inorganic light emitters distributed on the display substrate in a light-emitter layer. A light-absorbing layer located on the display substrate in the light-emitter layer is in contact with the inorganic light emitters. Among other things, the disclosed technology provides improved angular image quality by avoiding parallax between the light emitters and the light-absorbing material, increased light-output efficiency by removing the light-absorbing material from the optical path, improved contrast by increasing the light-absorbing area of the display substrate, and a reduced manufacturing cost in a mechanically and environmentally robust structure using micro transfer printing.
    Type: Application
    Filed: August 4, 2015
    Publication date: December 1, 2016
    Inventors: Christopher Bower, Willem Den Boer, Matthew Meitl, Ronald S. Cok
  • Publication number: 20160343772
    Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 ?m to 50 ?m), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.
    Type: Application
    Filed: August 2, 2016
    Publication date: November 24, 2016
    Inventors: Christopher Bower, Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg, Alin Fecioru, Carl Prevatte
  • Publication number: 20160343771
    Abstract: A small-aperture-ratio display includes a display substrate and a plurality of spatially separated pixel elements distributed over the display substrate. Each pixel element includes one or more light emitters. An active electrical component is electrically connected to each of the pixel elements and each active electrical component is located on the display substrate at least partly between the pixel elements. The display substrate has a contiguous display substrate area that includes the pixel elements, the light emitters each have a light-emissive area, and the substrate area is greater than or equal to one-quarter the combined light-emissive areas of the light emitters.
    Type: Application
    Filed: June 29, 2015
    Publication date: November 24, 2016
    Inventors: Christopher Bower, Robert R. Rotzoll, Matthew Meitl, Ronald S. Cok
  • Publication number: 20160336488
    Abstract: The present invention provides structures and methods that enable the construction of micro-LED chiplets formed on a sapphire substrate that can be micro-transfer printed. Such printed structures enable low-cost, high-performance arrays of electrically connected micro-LEDs useful, for example, in display systems. Furthermore, in an embodiment, the electrical contacts for printed LEDs are electrically interconnected in a single set of process steps. In certain embodiments, formation of the printable micro devices begins while the semiconductor structure remains on a substrate. After partially forming the printable micro devices, a handle substrate is attached to the system opposite the substrate such that the system is secured to the handle substrate. The substrate may then be removed and formation of the semiconductor structures is completed. Upon completion, the printable micro devices may be micro transfer printed to a destination substrate.
    Type: Application
    Filed: May 15, 2015
    Publication date: November 17, 2016
    Inventors: Christopher Bower, Matthew Meitl, David Gomez, Carl Prevatte, Salvatore Bonafede
  • Publication number: 20160293794
    Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
    Type: Application
    Filed: March 29, 2016
    Publication date: October 6, 2016
    Inventors: Ralph G. NUZZO, John A. ROGERS, Etienne MENARD, Keon Jae LEE, Dahl-Young KHANG, Yugang SUN, Matthew MEITL, Zhengtao ZHU
  • Publication number: 20160284544
    Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
    Type: Application
    Filed: March 29, 2016
    Publication date: September 29, 2016
    Inventors: Ralph G. NUZZO, John A. ROGERS, Etienne MENARD, Keon Jae LEE, Dahl-Young KHANG, Yugang SUN, Matthew MEITL, Zhengtao ZHU
  • Patent number: 9450043
    Abstract: The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
    Type: Grant
    Filed: January 14, 2014
    Date of Patent: September 20, 2016
    Assignee: THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ILLINOIS
    Inventors: Ralph G. Nuzzo, John A. Rogers, Etienne Menard, Keon Jae Lee, Dahl-Young Khang, Yugang Sun, Matthew Meitl, Zhengtao Zhu
  • Patent number: 9443883
    Abstract: Methods of forming integrated circuit devices include forming a sacrificial layer on a handling substrate and forming a semiconductor active layer on the sacrificial layer. The semiconductor active layer and the sacrificial layer may be selectively etched in sequence to define an semiconductor-on-insulator (SOI) substrate, which includes a first portion of the semiconductor active layer. A multi-layer electrical interconnect network may be formed on the SOI substrate. This multi-layer electrical interconnect network may be encapsulated by an inorganic capping layer that contacts an upper surface of the first portion of the semiconductor active layer. The capping layer and the first portion of the semiconductor active layer may be selectively etched to thereby expose the sacrificial layer.
    Type: Grant
    Filed: May 11, 2015
    Date of Patent: September 13, 2016
    Assignee: Semprius, Inc.
    Inventors: Christopher Bower, Etienne Menard, Matthew Meitl, Joseph Carr
  • Patent number: 9444015
    Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 ?m to 50 ?m), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.
    Type: Grant
    Filed: June 18, 2015
    Date of Patent: September 13, 2016
    Assignee: X-Celeprint Limited
    Inventors: Christopher Bower, Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg, Alin Fecioru, Carl Prevatte
  • Patent number: 9434150
    Abstract: In an aspect, a system and method for assembling a semiconductor device on a receiving surface of a destination substrate is disclosed. In another aspect, a system and method for assembling a semiconductor device on a destination substrate with topographic features is disclosed. In another aspect, a gravity-assisted separation system and method for printing semiconductor device is disclosed. In another aspect, various features of a transfer device for printing semiconductor devices are disclosed.
    Type: Grant
    Filed: July 20, 2015
    Date of Patent: September 6, 2016
    Assignee: X-Celeprint Limited
    Inventors: Christopher Bower, Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg
  • Patent number: 9437782
    Abstract: The disclosed technology provides micro-assembled micro-LED displays and lighting elements using arrays of micro-LEDs that are too small (e.g., micro-LEDs with a width or diameter of 10 ?m to 50 ?m), numerous, or fragile to assemble by conventional means. The disclosed technology provides for micro-LED displays and lighting elements assembled using micro-transfer printing technology. The micro-LEDs can be prepared on a native substrate and printed to a display substrate (e.g., plastic, metal, glass, or other materials), thereby obviating the manufacture of the micro-LEDs on the display substrate. In certain embodiments, the display substrate is transparent and/or flexible.
    Type: Grant
    Filed: June 18, 2015
    Date of Patent: September 6, 2016
    Assignee: X-Celeprint Limited
    Inventors: Christopher Bower, Matthew Meitl, David Gomez, Salvatore Bonafede, David Kneeburg, Alin Fecioru, Carl Prevatte
  • Publication number: 20160254253
    Abstract: A method for producing a plurality of semiconductor components and a semiconductor component are disclosed. In an embodiment the method includes applying a semiconductor layer sequence on a substrate, structuring the semiconductor layer sequence by forming trenches thereby separating the semiconductor layer sequence into a plurality of semiconductor bodies and applying an insulating layer covering the trenches and vertical surfaces of the plurality of semiconductor bodies. The method further includes forming a plurality of tethers by structuring the insulating layer in regions covering the trenches, locally detaching the substrate from the plurality of semiconductor bodies, wherein the tethers remain attached to the substrate and selectively picking up each semiconductor body by separating the tethers from the substrate, wherein each semiconductor body comprises a portion of the semiconductor layer sequence.
    Type: Application
    Filed: January 28, 2016
    Publication date: September 1, 2016
    Inventors: Matthew Meitl, Christopher Bower, Tansen Varghese
  • Publication number: 20160225953
    Abstract: A method for producing a plurality of semiconductor components and a semiconductor component is disclosed. In some embodiment, the method includes forming a semiconductor layer sequence, structuring the semiconductor layer sequence by forming trenches thereby structuring semiconductor bodies, applying an auxiliary substrate on the semiconductor layer sequence, so that the semiconductor layer sequence is arranged between the auxiliary substrate and the substrate and removing the substrate from the semiconductor layer sequence.
    Type: Application
    Filed: January 28, 2016
    Publication date: August 4, 2016
    Inventors: Matthew Meitl, Christopher Bower, Tansen Varghese
  • Publication number: 20160190091
    Abstract: A method of printing transferable components includes pressing a stamp including at least one transferable semiconductor component thereon on a target substrate such that the at least one transferable component and a surface of the target substrate contact opposite surfaces of a conductive eutectic layer. During pressing of the stamp on the target substrate, the at least one transferable component is exposed to electromagnetic radiation that is directed through the transfer stamp to reflow the eutectic layer. The stamp is then separated from the target substrate to delaminate the at least one transferable component from the stamp and print the at least one transferable component onto the surface of the target substrate. Related systems and methods are also discussed.
    Type: Application
    Filed: October 9, 2015
    Publication date: June 30, 2016
    Inventors: Etienne Menard, Matthew Meitl, John A. Rogers
  • Patent number: 9368683
    Abstract: A method of making an inorganic semiconductor structure suitable for micro-transfer printing includes providing a growth substrate and forming one or more semiconductor layers on the growth substrate. A patterned release layer is formed on the conductor layer(s) and bonded to a handle substrate. The growth substrate is removed and the semiconductor layer(s) patterned to form a semiconductor mesa. A dielectric layer is formed and then patterned to expose first and second contacts and an entry portion of the release layer. A conductor layer is formed on the dielectric layer, the first contact, and the second contact and patterned to form a first conductor in electrical contact with the first contact and a second conductor in electrical contact with the second contact but electrically separate from the first conductor. At least a portion of the release layer is removed.
    Type: Grant
    Filed: July 23, 2015
    Date of Patent: June 14, 2016
    Assignee: X-Celeprint Limited
    Inventors: Matthew Meitl, Ronald S. Cok
  • Patent number: 9362113
    Abstract: In a method for fabricating an engineered substrate for semiconductor epitaxy, an array of seed structures is assembled on a surface of the substrate. The seed structures in the array have substantially similar directional orientations of their crystal lattices, and are spatially separated from each other. Semiconductor materials are selectively epitaxially grown on the seed structures, such that a rate of growth of the semiconductor materials on the seed structures is substantially higher than a rate of growth of the semiconductor materials on regions of the surface. The semiconductor materials assume a lattice constant and directional orientation of crystal lattice that are substantially similar or identical to those of the seed structures. Related devices and methods are also discussed.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: June 7, 2016
    Assignee: Semprius, Inc.
    Inventors: Matthew Meitl, Scott Burroughs