Patents by Inventor Matthew Mrakovich
Matthew Mrakovich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10340424Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.Type: GrantFiled: October 24, 2013Date of Patent: July 2, 2019Assignee: GE Lighting Solutions, LLCInventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac
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Patent number: 10309587Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.Type: GrantFiled: May 3, 2013Date of Patent: June 4, 2019Assignee: GE Lighting Solutions, LLCInventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac, Stanton Earl Weaver, Jr., Thomas F. Soules
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Patent number: 10244616Abstract: One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.Type: GrantFiled: May 25, 2016Date of Patent: March 26, 2019Assignee: GE LIGHTING SOLUTIONS LLCInventors: Jeffrey Nall, Matthew Mrakovich
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Patent number: 10091867Abstract: One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.Type: GrantFiled: January 11, 2017Date of Patent: October 2, 2018Assignee: GE LIGHTING SOLUTIONS LLCInventors: Jeffrey Nall, Matthew Mrakovich
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Publication number: 20180080614Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.Type: ApplicationFiled: May 3, 2013Publication date: March 22, 2018Inventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac, Stanton Earl Weaver, JR., Thomas F. Soules
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Patent number: 9872377Abstract: One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100 ° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.Type: GrantFiled: October 25, 2013Date of Patent: January 16, 2018Assignee: GE Lighting Solutions, LLCInventors: Jeffrey Nall, Matthew Mrakovich
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Publication number: 20170122543Abstract: One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.Type: ApplicationFiled: January 11, 2017Publication date: May 4, 2017Applicant: GE Lighting Solutions LLCInventors: Jeffrey Nall, Matthew Mrakovich
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Patent number: 9585239Abstract: One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.Type: GrantFiled: May 2, 2014Date of Patent: February 28, 2017Assignee: GE LIGHTING SOLUTIONS, LLCInventors: Jeffrey Nall, Matthew Mrakovich
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Publication number: 20160270207Abstract: One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.Type: ApplicationFiled: May 25, 2016Publication date: September 15, 2016Applicant: GE LIGHTING SOLUTIONS LLCInventors: Jeffrey Nall, Matthew Mrakovich
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Publication number: 20140328046Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.Type: ApplicationFiled: May 3, 2013Publication date: November 6, 2014Inventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac
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Publication number: 20140237814Abstract: One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.Type: ApplicationFiled: May 2, 2014Publication date: August 28, 2014Applicant: GE LIGHTING SOLUTIONS LLCInventors: Jeffrey Nall, Matthew Mrakovich
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Patent number: 8770802Abstract: One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.Type: GrantFiled: February 11, 2013Date of Patent: July 8, 2014Assignee: GE Lighting Solutions LLCInventors: Jeffrey Nall, Matthew Mrakovich
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Patent number: 8756801Abstract: One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.Type: GrantFiled: November 23, 2011Date of Patent: June 24, 2014Assignee: GE Lighting Solutions, LLCInventors: Jeffrey Nall, Matthew Mrakovich
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Publication number: 20140049968Abstract: One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100 ° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.Type: ApplicationFiled: October 25, 2013Publication date: February 20, 2014Applicant: GE LIGHTING SOLUTIONS LLCInventors: Jeffrey Nall, Matthew Mrakovich
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Publication number: 20140049965Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.Type: ApplicationFiled: October 24, 2013Publication date: February 20, 2014Applicant: GE LIGHTING SOLUTIONS, LLCInventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac
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Publication number: 20130155681Abstract: One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.Type: ApplicationFiled: February 11, 2013Publication date: June 20, 2013Applicant: GE LIGHTING SOLUTIONS LLCInventors: Jeffrey NALL, Matthew MRAKOVICH
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Patent number: 8465175Abstract: One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.Type: GrantFiled: November 29, 2005Date of Patent: June 18, 2013Assignee: GE Lighting Solutions, LLCInventors: Jeffrey Nall, Matthew Mrakovich
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Patent number: 8436380Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially tills an interior volume defined by the light-transmissive cover and the printed circuit board.Type: GrantFiled: September 17, 2010Date of Patent: May 7, 2013Assignee: GE Lighting Solutions, LLCInventors: Srinath K. Aanegola, Emil V. Radkov, James Reginelli, Larry R. Stadelman, Matthew Mrakovich, Tomislav J. Stimac
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Patent number: 8398261Abstract: In a lighting strip (8, 80, 380), a flexible electrically insulated cable (10, 110, 410) includes spaced apart parallel electrical conductors (12, 14, 112, 114, 118, 412, 414, 4181, 4182, 4183, 4184) bound together by electrical insulation (16, 116, 416) as a cable. The electrical conductors include power conductors (12, 14, 112, 114, 412, 414). A plurality of lighting units (20, 120, 220, 320, 420) secured to and spaced apart along the flexible electrically insulated cable each include: (i) one or more light emitting devices (24, 124a, 124b, 124c, 124d, 224b1, 224b2, 224b3, 224c1, 224c2, 224c3, 224d1, 224d2, 224d3, 4241, 4242, 4243, 4244); (ii) power regulating electrical circuitry (40, 140, 240, 340, 440); and (iii) insulation displacing conductors (28, 30, 128a, 128b, 128c, 128d, 130a, 130b, 130c, 130d, 391, 392, 393, 500, 550, 600) connecting the lighting unit with at least the power conductors. The insulation displacing conductors (500, 550, 600) may be interchangeable.Type: GrantFiled: December 30, 2005Date of Patent: March 19, 2013Assignee: GE Lighting Solutions LLCInventors: Jeffrey Nall, Tomislav Stimac, Chenyang Li, Matthew Mrakovich, Ronald Brengartner
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Patent number: 8371723Abstract: One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.Type: GrantFiled: November 23, 2011Date of Patent: February 12, 2013Assignee: GE Lighting Solultions LLCInventors: Jeffrey Nall, Matthew Mrakovich