Abstract: A method of operating a wire bonding machine is provided. The method includes: (a) operating a wire bonding machine during at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation, wherein a bonding force is applied during the operation of the wire bonding machine; and (b) monitoring an accuracy of the bonding force of the wire bonding machine during the at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation.

Abstract: A method of operating a wire bonding machine is provided. The method includes: (a) operating a wire bonding machine during at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation, wherein a bonding force is applied during the operation of the wire bonding machine; and (b) monitoring an accuracy of the bonding force of the wire bonding machine during the at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation.

Abstract: A method of operating a wire bonding machine is provided. The method includes: (a) operating a wire bonding machine during at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation, wherein a bonding force is applied during the operation of the wire bonding machine; and (b) monitoring an accuracy of the bonding force of the wire bonding machine during the at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation.

Abstract: A method of operating a wire bonding machine is provided. The method includes: (a) operating a wire bonding machine during at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation, wherein a bonding force is applied during the operation of the wire bonding machine; and (b) monitoring an accuracy of the bonding force of the wire bonding machine during the at least one of (i) an automatic wire bonding operation and (ii) a dry cycle wire bonding operation.

Abstract: A method of teaching bonding locations of a semiconductor device on a wire bonding machine is provided. The method includes (1) providing the wire bonding machine with position data for (a) bonding locations of a first component of the semiconductor device, and (b) bonding locations of a second component of the semiconductor device; and (2) teaching the bonding locations of the first component of the semiconductor device and the second component of the semiconductor device using a pattern recognition system of the wire bonding machine to obtain more accurate position data for at least a portion of the bonding locations of the first component and the second component. The teaching step is conducted by teaching the bonding locations in the order in which they are configured to be wire bonded on the wire bonding machine.

Abstract: Methods and systems for capacity planning of server resources are described wherein fixed resources of a server cluster are used in comparison to similar server cluster benchmarks to determine the maximum load—requests per second—that can be handled by the server cluster. The maximum load is used to determine utilization of server resources and to provide estimates of server resource utilization for hypothetical loads. A recommendation as to changes to server resources to handle the hypothetical loads is displayed to the user.

Abstract: A methods and systems for capacity planning of server resources are described wherein a load simulation tool is used to use actual data gathered from a server cluster during operation to simulate server cluster operation in which the load (requests per second) can be increased, and the effects on the utilization of resources can be observed. Plans containing recommendations are then presented to a system user so the user can make decisions necessary regarding whether to change configuration hardware to meet expected load increases in the future.

Abstract: A methods and systems for capacity planning of server resources are described wherein a load simulation tool is used to use actual data gathered from a server cluster during operation to simulate server cluster operation in which the load (requests per second) can be increased, and the effects on the utilization of resources can be observed. Plans containing recommendations are then presented to a system user so the user can make decisions necessary regarding whether to change configuration hardware to meet expected load increases in the future.