Patents by Inventor Matthew P. Kirk

Matthew P. Kirk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200017952
    Abstract: Method to increase the wettability of a substrate by providing the substrate at least partially with a conductive, metal free, hydrophilic carbon based coating. The carbon based coating is doped with nitrogen and has an electrical resistivity lower than 108 ohm-cm. An adhesion promoting layer is applied on the substrate before the application of the carbon based coating. The adhesion promoting layer includes at least one element of the group consisting of silicon and of the elements of group IVB, the elements of group VB and the elements of Group VIB of the periodic table, wherein the carbon based coating includes a nitrogen doped diamond-like carbon (DLC) coating of amorphous hydrogenated carbon (a-C:H) and a nitrogen doped diamond-like nanocomposite (DLN) coating comprising C, H, O and Si.
    Type: Application
    Filed: September 23, 2019
    Publication date: January 16, 2020
    Applicant: OERLIKON SURFACE SOLUTIONS AG, PFAEFFIKON
    Inventors: Erik DEKEMPENEER, Matthew P. KIRK, Roland GROENEN, Cyndi L. ACKERMAN, Chandra VENKATRAMAN
  • Publication number: 20090142599
    Abstract: The invention relates to a method to increase the wettability of a substrate by providing said substrate at least partially with a conductive, metal free, hydrophilic carbon based coating. The carbon based coating is doped with nitrogen and has an electrical resistivity lower than 108 ohm-cm. The invention further relates to a substrate coated at least partially with a conductive metal free, hydrophilic carbon based coating.
    Type: Application
    Filed: May 31, 2007
    Publication date: June 4, 2009
    Inventors: Erik Dekempeneer, Matthew P. Kirk, Roland Groenen, Cyndi L. Ackerman, Chandra Venkatraman
  • Patent number: 7300461
    Abstract: An intravascular stent (26) has a surface coated with a biocompatible layer. The layer contains a diamond like nanocomposite material. This nanocomposite material comprises carbon, hydrogen, silicon and oxygen as constituent elements. The layer has a stress which is less than 150 MPa in order to ensure a high degree of flexibility and a complete expandability. This lower stress is obtained by the inclusion of relatively large amounts of Si:O bonds. In a preferable embodiment the layer with diamond like nanocomposite material covers the stent (26) for 100%. This is obtained by allowing the stent to move freely along a wire during CAVD deposition.
    Type: Grant
    Filed: July 17, 2001
    Date of Patent: November 27, 2007
    Assignee: Blue Medical Devices B.V.
    Inventors: Matthew P. Kirk, Chandra Venkatraman
  • Patent number: 7019399
    Abstract: The invention relatse to a copper diffusion barrier which includes a diamond-like material includes carbon, hydrogen, silicon, oxygen and a metal and is a copper diffusion barrier. Another aspect of the invention relates to an integrated circuit which includes a copper interconnect, a dielectric material and the copper diffusion barrier.
    Type: Grant
    Filed: January 22, 2002
    Date of Patent: March 28, 2006
    Assignee: N.V. Bekaert S.A.
    Inventors: Chandra Venkatraman, Cyndi L Brodbeck, Matthew P. Kirk
  • Publication number: 20040124531
    Abstract: The invention relatse to a copper diffusion barrier which includes a diamond-like material includes carbon, hydrogen, silicon, oxygen and a metal and is a copper diffusion barrier. Another aspect of the invention relates to an integrated circuit which includes a copper interconnect, a dielectric material and the copper diffusion barrier.
    Type: Application
    Filed: January 30, 2004
    Publication date: July 1, 2004
    Inventors: Chandra Venkatraman, Cyndi L Brodbeck, Matthew P Kirk
  • Publication number: 20030187496
    Abstract: An intravascular stent (26) has a surface coated with a biocompatible layer. The layer contains a diamond like nanocomposite material. This nanocomposite material comprises carbon, hydrogen, silicon and oxygen as constituent elements. The layer has a stress which is less than 150 MPa in order to ensure a high degree of flexibility and a complete expandability. This lower stress is obtained by the inclusion of relatively large amounts of Si:O bonds. In a preferable embodiment the layer with diamond like nanocomposite material covers the stent (26) for 100%. This is obtained by allowing the stent to move freely along a wire during CAVD deposition.
    Type: Application
    Filed: February 27, 2003
    Publication date: October 2, 2003
    Inventors: Matthew P Kirk, Chandra Venkatraman