Patents by Inventor Matthew R. Angle

Matthew R. Angle has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low-area, low-power neural recording circuit, and method of training the same
    Patent number: 11974848
    Abstract: A sensor circuit that is capable of sensing of neural action potentials is disclosed. The circuit can be designed to minimize power dissipation and total silicon area so that it can be incorporated into a massively parallel sensor array and ultimately implanted in the body (e.g. into the brain) in a safe manner. The circuit can also be designed to be tunable such that it can be optimized in silico prior to fabrication, and can be optimized through the use of controllable current sources after fabrication.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: May 7, 2024
    Assignees: CAELESTE CVBA, PARADROMICS, INC.
    Inventors: Matthew R. Angle, Robert Edgington, Aamir Ahmed Khan, Bart Dierickx, Peng Gao, Amir Babaiefishani, Ahmed Abdelmoneem, Bert Luyssaert, Jean Pierre Vermeiren
  • Method of producing patterned microwire bundles
    Patent number: 11401620
    Abstract: Systems and methods for manufacturing and processing microwires for use as microelectrodes are disclosed. The disclosed techniques provide methods for creating microelectrode bundles with different organizations and patterns. Systems and methods of the present disclosure also provide methods for electrochemically modifying bundles of microelectrode ends.
    Type: Grant
    Filed: September 26, 2019
    Date of Patent: August 2, 2022
    Assignees: PARADROMICS, INC., THE BOARD OF TRUSTEES OF THE LELAND STANFORD JUNIOR UNIVERSITY
    Inventors: Yifan Kong, Matthew R. Angle, Mina-Elraheb Hanna, Abdulmalik Obaid, Nicholas Melosh
  • PATTERNED MICROWIRE BUNDLES AND METHODS OF PRODUCING THE SAME
    Publication number: 20200056299
    Abstract: Systems and methods for manufacturing and processing microwires for use as microelectrodes are disclosed. The disclosed techniques provide methods for creating microelectrode bundles with different organizations and patterns. Systems and methods of the present disclosure also provide methods for electrochemically modifying bundles of microelectrode ends.
    Type: Application
    Filed: September 26, 2019
    Publication date: February 20, 2020
    Inventors: Yifan Kong, Matthew R. Angle, Mina-Elraheb Hanna, Abdulmalik Obaid, Nicholas Melosh
  • LOW-AREA, LOW-POWER NEURAL RECORDING CIRCUIT, AND METHOD OF TRAINING THE SAME
    Publication number: 20200046240
    Abstract: A sensor circuit that is capable of sensing of neural action potentials is disclosed. The circuit can be designed to minimize power dissipation and total silicon area so that it can be incorporated into a massively parallel sensor array and ultimately implanted in the body (e.g. into the brain) in a safe manner. The circuit can also be designed to be tunable such that it can be optimized in silico prior to fabrication, and can be optimized through the use of controllable current sources after fabrication.
    Type: Application
    Filed: October 2, 2019
    Publication date: February 13, 2020
    Inventors: Matthew R. Angle, Robert Edgington, Aamir Ahmed Khan, Bart Dierickx, Peng Gao, Amir Babaiefishani, Ahmed Abdelmoneem, Bert Luyssaert, Jean Pierre Vermeiren
  • Neural-interface probe and methods of packaging the same
    Patent number: 10327655
    Abstract: A neural-interface probe is provided. The probe may comprise a chip, a wire bundle substrate, and an encapsulant material. The chip may comprise a plurality of bond pads. The wire bundle substrate may comprise a plurality of wires extending through the substrate. The plurality of wires may comprise: (1) a proximal portion connected to the plurality of bond pads to thereby couple the chip to the substrate, and (2) a flexible distal portion configured to interface with neural matter. The encapsulant material may be disposed at least between the chip and the wire bundle substrate.
    Type: Grant
    Filed: April 7, 2017
    Date of Patent: June 25, 2019
    Assignee: Paradromics, Inc.
    Inventors: Matthew R. Angle, Yifan Kong
  • NEURAL-INTERFACE PROBE AND METHODS OF PACKAGING THE SAME
    Publication number: 20170290521
    Abstract: A neural-interface probe is provided. The probe may comprise a chip, a wire bundle substrate, and an encapsulant material. The chip may comprise a plurality of bond pads. The wire bundle substrate may comprise a plurality of wires extending through the substrate. The plurality of wires may comprise: (1) a proximal portion connected to the plurality of bond pads to thereby couple the chip to the substrate, and (2) a flexible distal portion configured to interface with neural matter. The encapsulant material may be disposed at least between the chip and the wire bundle substrate.
    Type: Application
    Filed: April 7, 2017
    Publication date: October 12, 2017
    Inventors: Matthew R. Angle, Yifan Kong