Abstract: A motor vehicle having a front end, a pair of opposing front wheel wells rearward of the front end, and an air guide duct having at least one air inlet disposed forward of the front wheel wells and facing the front end of the motor vehicle. The air guide duct also has at least one air outlet opening into at least one of the front wheel wells such that incoming air from the front end of the motor vehicle is guided into at least one of the front wheel wells.

Abstract: Methods for localized thinning of wafers used in semiconductor devices and the structures formed from such methods are described. The methods thin localized areas of the backside of the semiconductor wafer to form recesses with a bi-directional channel design that is repeated within the wafer (or die) so that no straight channel line crosses the wafer (or die). The bi-directional pattern design keeps the channels from being aligned with the crystal orientation of the wafer. The recesses are then filled by a solder ball drop process by dropping proper size solder balls into the recesses and then annealing the wafer to reflow the solder balls and flatten them out. The reflow process begins to fill in the recesses from the bottom up, thereby avoiding void formation and the resulting air traps in the reflowed solder material. Other embodiments are also described.

Abstract: Methods for localized thinning of wafers used in semiconductor devices and the structures formed from such methods are described. The methods thin localized areas of the backside of the semiconductor wafer to form recesses with a bi-directional channel design that is repeated within the wafer (or die) so that no straight channel line crosses the wafer (or die). The bi-directional pattern design keeps the channels from being aligned with the crystal orientation of the wafer. The recesses are then filled by a solder ball drop process by dropping proper size solder balls into the recesses and then annealing the wafer to reflow the solder balls and flatten them out. The reflow process begins to fill in the recesses from the bottom up, thereby avoiding void formation and the resulting air traps in the reflowed solder material. Other embodiments are also described.

Abstract: Methods for localized thinning of wafers used in semiconductor devices and the structures formed from such methods are described. The methods thin localized areas of the backside of the semiconductor wafer to form recesses with a bi-directional channel design that is repeated within the wafer (or die) so that no straight channel line crosses the wafer (or die). The bi-directional pattern design keeps the channels from being aligned with the crystal orientation of the wafer. The recesses are then filled by a solder ball drop process by dropping proper size solder balls into the recesses and then annealing the wafer to reflow the solder balls and flatten them out. The reflow process begins to fill in the recesses from the bottom up, thereby avoiding void formation and the resulting air traps in the reflowed solder material. Other embodiments are also described.

Abstract: A belt fastener of non-metallic composition for use, in particular, with conveyor belts used in conjunction with metal detectors, the belt fastener including one or more top plates having bolt receiving apertures; one or more bottom plates with bolt receiving apertures in registry with the bolt receiving apertures of the top plates and bolts adapted for insertion through said apertures and through openings of a belt located between the plates to hold the fastener in place to fasten two ends of a flexible belt together. Annular flanges, about the periphery of the bolt receiving apertures, downwardly depending from the top plates and upwardly extending from the bottom plates, prevent contact between the belt and bolts while providing lateral support for the bolts. The plates and bolts are preferably manufactured of ultra high molecular weight polyethylene.