Abstract: Described herein are a polyamide composition and a molded article comprising such polyamide composition, such as a mobile electronic device component. The polyamide composition comprises a polyamide polymer, an electrically conductive material comprising carbon fibers, carbon nano-tubes, or any combination thereof, and a glass filler having tri-dimensional structures characterized by an average length of at most 500 microns, said glass filler comprising at least 20 wt % glass flakes. The polyamide composition and the molded article exhibit near-isotropic mold shrinkage, low warpage and near-isotropic CLTE (Coefficient of Linear Thermal Expansion) and are electrostatic dissipative (ESD).

Abstract: Described herein are polymer compositions (PC) including a polyamide (PA) and a poly(arylene sulfide) (PASP). The polyamide (PA) is a semi-aromatic polyamide derived from the polycondensation of an aliphatic diamine, a bis(aminoalkyl)cyclohexane, terephthalic acid, and, optionally, a cyclohexanedicarboxylic acid. It was surprisingly discovered that semi-aromatic polyamides derived from the cycloaliphatic diamine bis(aminoalkyl)cyclohexane or the specific combination of the cycloaliphatic diamine bis(aminoalkyl)cyclohexane and the cycloaliphatic dicarboxylic acid cyclohexanedicarboxylic acid provided for polymer compositions (PC) having improved retention of mechanical properties (e.g. tensile modulus and tensile strength) after aging in aqueous polyol solutions. It was also surprisingly discovered that incorporation of a nucleating agent in the polymer composition (PC) provided for significantly improved tensile strength retention after aging.

Abstract: Described herein are polymer compositions (PC) including a polyamide (PA) and a reactive impact modifier. As explained in detail below, the polyamide (PA) is a semi-aromatic polyamide derived from the polycondensation of an aliphatic diamine, a bis(aminoalkyl)cyclohexane, terephthalic acid, and, optionally, a cyclohexanedicarboxylic acid. It was surprisingly discovered that semi-aromatic polyamides derived from the cycloaliphatic diamine bis(aminoalkyl)cyclohexane or the specific combination of the cycloaliphatic diamine bis(aminoalkyl)cyclohexane and the cycloaliphatic dicarboxylic acid cyclohexanedicarboxylic acid provided for polymer compositions (PC) having improved retention of mechanical properties (e.g. tensile strength and flexural strength) after aging in aqueous solutions, relative to analogous polyamides free of the bis(aminoalkyl)cyclohexane and the cyclohexanedicarboxylic acid.

Abstract: Described herein are polymer compositions (PC) including a polyamide and carbon fiber. As explained in detail below, the polyamide (PA) is a semi-aromatic polyamide derived from the polycondensation of an aliphatic diamine, terephthalic acid, and a bis(aminoalkyl)cyclohexane or a cyclohexanedicarboxylic acid. It was surprisingly discovered that incorporation of the cycloaliphatic diamine bis(aminoalkyl)cyclohexane or the specific combination of the cycloaliphatic diamine bis(aminoalkyl)cyclohexane and the cycloaliphatic dicarboxylic acid cyclohexanedicarboxylic acid into the polyamide provided for carbon fiber filled polymer compositions (PC) having significantly improved mechanical properties (e.g. tensile modulus and strength) at elevated temperatures, as well as significantly improved retention of mechanical properties after heat aging, relative to analogous polyamides free of the bis(aminoalkyl)cyclohexane and the cyclohexanedicarboxylic acid.