Patents by Inventor Matthew Read

Matthew Read has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240166821
    Abstract: A silsesquioxane of formula: (R1SiO1,5)x(R2SiO1,5)y(R3SiO1,5)z, wherein x?1, y?1, z?1, and x+y+z=6, 8, 10 or 12. R1 is L1-phthalimide, wherein L1 is a residue selected from the group consisting of saturated or unsaturated C1-C8 hydrocarbon radicals which may be straight, branched or cyclic; and substituted or non-substituted arylene; wherein the carbon chains of said residues optionally include one or more of the elements oxygen and nitrogen; and the phthalimide is optionally substituted by one or more halogen, C1-C6 alkyl, —COOH, —OH or —NO2. R2 is a residue selected from the group consisting of saturated or unsaturated C1-C18 hydrocarbon radicals which may be straight, branched or cyclic; wherein the carbon chains of said residues optionally include one or more oxygens and are optionally substituted by one or more halogens.
    Type: Application
    Filed: December 14, 2021
    Publication date: May 23, 2024
    Applicant: Bioenvision Technology AS
    Inventors: Morten Eikenes, Dag Høvik, Matthew Read, Tonje Haagensen, Samer Sahli, Annie Rose Knutsen, Siri Heggheim, Ivan Kotek
  • Patent number: 10341225
    Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for bonding of satellite terminals. In some implementations, a first satellite terminal with a first satellite communication link determines that it is in communication with a second satellite terminal that has a second satellite communication link. The first satellite terminal receives packet data from a data source and selects first packet data for transmission over the first satellite communication link and second packet data for transmission over the second satellite communication link. The first satellite terminal transmits the first packet data over the first satellite communication link, and provides the second packet data to the second satellite terminal for transmission over the second satellite communication link.
    Type: Grant
    Filed: January 5, 2017
    Date of Patent: July 2, 2019
    Assignee: Hughes Network Systems, LLC
    Inventors: Nigel Keith Bartlett, Ronald Matthew Read
  • Publication number: 20180191604
    Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for bonding of satellite terminals. In some implementations, a first satellite terminal with a first satellite communication link determines that it is in communication with a second satellite terminal that has a second satellite communication link. The first satellite terminal receives packet data from a data source and selects first packet data for transmission over the first satellite communication link and second packet data for transmission over the second satellite communication link. The first satellite terminal transmits the first packet data over the first satellite communication link, and provides the second packet data to the second satellite terminal for transmission over the second satellite communication link.
    Type: Application
    Filed: January 5, 2017
    Publication date: July 5, 2018
    Inventors: Nigel Keith Bartlett, Ronald Matthew Read
  • Publication number: 20160027227
    Abstract: In one example, credentialing method involving a credentialing provider and a client comprising the step of establishing one or more custom credential categories for an entity.
    Type: Application
    Filed: October 21, 2014
    Publication date: January 28, 2016
    Inventors: Garry Wayne Kyle, JR., Troy Kyle, Cale Wenmohs, Matthew Read, Vishal Yadav, Kristine Tannert, Rick Pleczko, Brittany Calderon, Wayne Washburn
  • Publication number: 20070241440
    Abstract: According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.
    Type: Application
    Filed: August 4, 2006
    Publication date: October 18, 2007
    Inventors: Dinhphuoc Hoang, Thomas Noll, Anil Agarwal, Robert Warren, Matthew Read, Anthony LoBianco
  • Patent number: D522914
    Type: Grant
    Filed: October 18, 2004
    Date of Patent: June 13, 2006
    Inventor: Steven Matthew Read
  • Patent number: D576515
    Type: Grant
    Filed: August 28, 2007
    Date of Patent: September 9, 2008
    Inventor: Steven Matthew Read