Patents by Inventor Matthew Read

Matthew Read has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260009995
    Abstract: A nanometre scale levelling system (10) for a sample surface (20) for imaging samples comprising single molecules is disclosed. The system (10) comprises a sample surface (20) configured to hold samples comprising single molecules for imaging. The system (10) further comprises a leveller with nanometre resolution configured to adjust a level of the sample surface (20) relative to a reference plane. The leveller is configured to adjust a level of a first (40), second (50) and third (60) point on the sample surface until they are each level with the reference plane on a nanometre scale.
    Type: Application
    Filed: February 14, 2024
    Publication date: January 8, 2026
    Inventors: Andrew James Thompson, James Alan Brozik, Michael Joe Martinez, Evan Lewis Taylor, Mark Peter Rogers, Matthew Read
  • Publication number: 20250305268
    Abstract: An insert for a urinal configured in use to prevent splashback, the insert comprising a central portion for extending across a drain of a urinal, and a plurality of spaced apart outer portions extending radially outwardly from the central portion and defining gaps between adjacent outer portions, in which the central portion and each outer portion comprises: a plurality of spaced apart pebble features, in which each pebble feature comprises a mound having a domed surface; and a plurality of spacers, in which each spacer adjoins adjacent pebble features in a configuration such that each pebble feature is adjoined to at least one adjacent pebble feature, and in which openings providing a fluid flowpath are defined between the pebble features and the spacers.
    Type: Application
    Filed: March 28, 2025
    Publication date: October 2, 2025
    Inventor: Matthew Read
  • Publication number: 20240166821
    Abstract: A silsesquioxane of formula: (R1SiO1,5)x(R2SiO1,5)y(R3SiO1,5)z, wherein x?1, y?1, z?1, and x+y+z=6, 8, 10 or 12. R1 is L1-phthalimide, wherein L1 is a residue selected from the group consisting of saturated or unsaturated C1-C8 hydrocarbon radicals which may be straight, branched or cyclic; and substituted or non-substituted arylene; wherein the carbon chains of said residues optionally include one or more of the elements oxygen and nitrogen; and the phthalimide is optionally substituted by one or more halogen, C1-C6 alkyl, —COOH, —OH or —NO2. R2 is a residue selected from the group consisting of saturated or unsaturated C1-C18 hydrocarbon radicals which may be straight, branched or cyclic; wherein the carbon chains of said residues optionally include one or more oxygens and are optionally substituted by one or more halogens.
    Type: Application
    Filed: December 14, 2021
    Publication date: May 23, 2024
    Applicant: Bioenvision Technology AS
    Inventors: Morten Eikenes, Dag Høvik, Matthew Read, Tonje Haagensen, Samer Sahli, Annie Rose Knutsen, Siri Heggheim, Ivan Kotek
  • Publication number: 20160027227
    Abstract: In one example, credentialing method involving a credentialing provider and a client comprising the step of establishing one or more custom credential categories for an entity.
    Type: Application
    Filed: October 21, 2014
    Publication date: January 28, 2016
    Inventors: Garry Wayne Kyle, JR., Troy Kyle, Cale Wenmohs, Matthew Read, Vishal Yadav, Kristine Tannert, Rick Pleczko, Brittany Calderon, Wayne Washburn
  • Publication number: 20070241440
    Abstract: According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.
    Type: Application
    Filed: August 4, 2006
    Publication date: October 18, 2007
    Inventors: Dinhphuoc Hoang, Thomas Noll, Anil Agarwal, Robert Warren, Matthew Read, Anthony LoBianco