Abstract: A silsesquioxane of formula: (R1SiO1,5)x(R2SiO1,5)y(R3SiO1,5)z, wherein x?1, y?1, z?1, and x+y+z=6, 8, 10 or 12. R1 is L1-phthalimide, wherein L1 is a residue selected from the group consisting of saturated or unsaturated C1-C8 hydrocarbon radicals which may be straight, branched or cyclic; and substituted or non-substituted arylene; wherein the carbon chains of said residues optionally include one or more of the elements oxygen and nitrogen; and the phthalimide is optionally substituted by one or more halogen, C1-C6 alkyl, —COOH, —OH or —NO2. R2 is a residue selected from the group consisting of saturated or unsaturated C1-C18 hydrocarbon radicals which may be straight, branched or cyclic; wherein the carbon chains of said residues optionally include one or more oxygens and are optionally substituted by one or more halogens.

Abstract: An embedded device includes an Ethernet-APL interface through which to conduct communications and receive power over an Ethernet-APL network connection; an analog communication interface for establishing an analog connection with a field device/instrument; a memory; and a processor(s). The processor(s), in communication with the memory, is configured to: apply a firmware framework to implement a embedded platform without an operating system; and perform prioritized, multi-tasking of a plurality of run-to-complete tasks for monitoring and/or control of a plant or process according to the embedded platform. The tasks can include communications with at least one field device/instrument through analog connection via the analog communication interface. The communications include at least receiving measurement data from the at least one field device/instrument or outputting control data to the at least one field device/instrument. The embedded device can be a constrained edge device.

Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for bonding of satellite terminals. In some implementations, a first satellite terminal with a first satellite communication link determines that it is in communication with a second satellite terminal that has a second satellite communication link. The first satellite terminal receives packet data from a data source and selects first packet data for transmission over the first satellite communication link and second packet data for transmission over the second satellite communication link. The first satellite terminal transmits the first packet data over the first satellite communication link, and provides the second packet data to the second satellite terminal for transmission over the second satellite communication link.

Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for bonding of satellite terminals. In some implementations, a first satellite terminal with a first satellite communication link determines that it is in communication with a second satellite terminal that has a second satellite communication link. The first satellite terminal receives packet data from a data source and selects first packet data for transmission over the first satellite communication link and second packet data for transmission over the second satellite communication link. The first satellite terminal transmits the first packet data over the first satellite communication link, and provides the second packet data to the second satellite terminal for transmission over the second satellite communication link.

Abstract: In one example, credentialing method involving a credentialing provider and a client comprising the step of establishing one or more custom credential categories for an entity.

Abstract: According to one exemplary embodiment, an overmolded package includes a component situated on a substrate. The overmolded package further includes an overmold situated over the component and the substrate. The overmolded package further includes a wirebond cage situated over the substrate and in the overmold, where the wirebond cage surrounds the component, and where the wirebond cage includes a number of wirebonds. The wirebond cage forms an EMI shield around the component. According to this exemplary embodiment, the overmolded package further includes a conductive layer situated on a top surface of the overmold and connected to the wirebond cage, where the conductive layer forms an EMI shield over the component.