Patents by Inventor Matthew Rentz

Matthew Rentz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Enclosed power clamp
    Patent number: 6755406
    Abstract: A power clamp for use in a manufacturing environment. The power clamp includes a unitized body having a bore in one end thereof The power clamp also includes a piston arranged within the bore and an end cap secured to the body on the end having the bore. The power clamp has a plurality of first links, one of the first links connected to the piston and at least one second link connected to the first link at a pivot point. A plunger is arranged within an orifice of the body and that plunger is connected to a second link. The power clamp also includes a plurality of identical pins with the pins connecting the links. The power clamp also includes a side plate connected to the body to enclose the clamp and protect it from the manufacturing environment.
    Type: Grant
    Filed: October 30, 2002
    Date of Patent: June 29, 2004
    Assignee: Delaware Capital Formation, Inc.
    Inventors: Matthew Rentz, Henry Dykstra
  • ENCLOSED POWER CLAMP
    Publication number: 20040084823
    Abstract: A power clamp for use in a manufacturing environment. The power clamp includes a unitized body having a bore in one end thereof The power clamp also includes a piston arranged within the bore and an end cap secured to the body on the end having the bore. The power clamp has a plurality of first links, one of the first links connected to the piston and at least one second link connected to the first link at a pivot point. A plunger is arranged within an orifice of the body and that plunger is connected to a second link. The power clamp also includes a plurality of identical pins with the pins connecting the links. The power clamp also includes a side plate connected to the body to enclose the clamp and protect it from the manufacturing environment.
    Type: Application
    Filed: October 30, 2002
    Publication date: May 6, 2004
    Inventors: Matthew Rentz, Henry Dykstra