Abstract: An apparatus includes an electrical connector. The electrical connector is configured to electrically couple a signal transmission line to another signal transmission line. The electrical connector includes a first electrical conductor and a second electrical conductor. The first electrical conductor is disposed around a center axis. The first electrical conductor is disposed azimuthally symmetric around the center axis. The second electrical conductor is disposed around the center axis and around the first electrical conductor. The second electrical conductor is disposed azimuthally symmetric around the center axis. Faces on opposing ends of the electrical connector along the center axis are configured to mate the signal transmission line and the second electrical conductor in a first plane and the other signal transmission line and the second electrical conductor in a second plane.

Abstract: An apparatus includes an electrical connector. The electrical connector is configured to electrically couple a signal transmission line to another signal transmission line. The electrical connector includes a first electrical conductor and a second electrical conductor. The first electrical conductor is disposed around a center axis. The first electrical conductor is disposed azimuthally symmetric around the center axis. The second electrical conductor is disposed around the center axis and around the first electrical conductor. The second electrical conductor is disposed azimuthally symmetric around the center axis. Faces on opposing ends of the electrical connector along the center axis are configured to mate the signal transmission line and the second electrical conductor in a first plane and the other signal transmission line and the second electrical conductor in a second plane.

Abstract: Described is a directional coupler for forward coupling energy from an input port to a coupling port. The directional coupler has a coupling factor and an operating frequency and an operating wavelength corresponding to the operating frequency.

Abstract: Described is a directional coupler for forward coupling energy from an input port to a coupling port. The directional coupler has a coupling factor and an operating frequency and an operating wavelength corresponding to the operating frequency.

Abstract: A shift light system and method are described. The shift light system has an RGB illumination device that has configurable illumination states with one or more illumination states coupled to a processing unit wherein the one or more illumination states having one of a different color and a different color sequence that correspond to one or more states of the vehicle as indicated by the at least two vehicle generated signals.

Abstract: A signal coupling system interposed between a scanning probe and a measurement instrument provides signal communication between the scanning probe and the measurement instrument. The signal coupling system has a pre-stressed shape when the scanning probe is in a neutral position. The pre-stressed shape is designated to provide a characteristic impedance of the signal coupling system that varies linearly as a function of displacement of the scanning probe from the neutral position when the scanning probe is displaced, relative to the neutral position, over a designated range of displacements.

Abstract: An address-transparent device is disclosed that couples two networks in a semiconductor fab and communicates packets between a host on a first network and a tool on a second network. Optionally, the address-transparent device intercepts packets for local use by a data consumer that resides within or outside of the address-transparent device. The address-transparent device can intercept all or a portion of data streams. As another option, the address-transparent device reroutes packet to another destination by changing the header of the received packet.

Abstract: A signal coupling system interposed between a scanning probe and a measurement instrument provides signal communication between the scanning probe and the measurement instrument. The signal coupling system has a pre-stressed shape when the scanning probe is in a neutral position. The pre-stressed shape is designated to provide a characteristic impedance of the signal coupling system that varies linearly as a function of displacement of the scanning probe from the neutral position when the scanning probe is displaced, relative to the neutral position, over a designated range of displacements.

Abstract: A method for identifying a predetermined state of a manufacturing process by monitoring the process which involves, monitoring a plurality of variables that vary in value during the manufacturing process. The method also involves mapping as points in a hyperspace the values of each variable at a plurality of times, where the hyperspace has a number of dimensions equal to the number of variables and the number of points is equal to the plurality of times. The method also involves identifying that a manufacturing process has reached the predetermined state when one of the points reaches a closed volume in the hyperspace that is located within a predefined distance from a predefined location in the hyperspace.

Abstract: A method for identifying a predetermined state of a manufacturing process by monitoring the process which involves, monitoring a plurality of variables that vary in value during the manufacturing process. The method also involves mapping as points in a hyperspace the values of each variable at a plurality of times, where the hyperspace has a number of dimensions equal to the number of variables and the number of points is equal to the plurality of times. The method also involves identifying that a manufacturing process has reached the predetermined state when one of the points reaches a closed volume in the hyperspace that is located within a predefined distance from a predefined location in the hyperspace.

Abstract: A wafer support assembly has a first wafer support plate having a first grid pattern allowing first probe access through the first grid pattern to a first side of a wafer in the wafer support assembly and a second wafer support plate having a second grid pattern allowing second probe access through the second grid pattern to a second side of the wafer in the wafer support assembly.

Abstract: A method for process monitoring involves acquiring data samples associated with a plurality of manufacturing related variables for a plurality of outputs of a manufacturing process. The distance of each data sample relative to every other data sample is then calculated. The outputs are then grouped based on the Euclidean distances that satisfy a boundary determining criterion.

Abstract: A microwave spectroscopy probe has a center conductor between a first ground plane and a second ground plane. A dielectric member has fluid channel between the center conductor and the first ground plane.

Abstract: A method for process monitoring involves acquiring data samples associated with a plurality of manufacturing related variables for a plurality of outputs of a manufacturing process. The distance of each data sample relative to every other data sample is then calculated. The outputs are then grouped based on the Euclidean distances that satisfy a boundary determining criterion.

Abstract: A coupler assembly has first and second conductors with first and second dielectric supports extending along a coupling section and supporting the first and second conductors at a support section.

Abstract: An interconnection includes a microcircuit package having a slot, and a receiving feature. A bead ring is fitted into the receiving feature. A center conductor extends through a dielectric support disposed in the bead ring and through the slot. The center conductor forms a coaxial transmission structure in cooperation with the bead ring and the dielectric support, and forms a slab line transmission structure in cooperation with the slot.

Abstract: A slabline structure includes a first slabline having a first orientation and a second slabline having a second orientation that is rotationally offset from the first orientation. The slabline structure also includes a transition interposed between the first slabline and the second slabline.

Abstract: An address-transparent device is disclosed that couples between two network interfaces in a semiconductor fab for communicating packets between a host coupled to a first network interface and a tool coupled to a second network interface. Alternatively, the address-transparent device couples between two networks in a semiconductor fab for communicating packets between a host on a first network and a tool on a second network. In a first aspect of the invention, the address-transparent device routes packets between the first network and the second network that is independent of any protocol. The address-transparent device couples to the host through the first network and couples to the tool through the second network where the address-transparent device having a first port with no IP address and a second port with a subnet IP address.

Abstract: A coaxial connector including an outer conductor, a glass to metal seal (GMS) assembly, and a center conductor, is disclosed. The outer conductor has a tubular shape and defines longitudinal axis. Here, the center conductor and the GMS assembly are coupled before they are placed within the outer conductor. When the GMS assembly is coaxially placed within the outer conductor, the GMS assembly and the outer conductor define a variable gap enclosure. Fusing agent such as solder is placed within the variable gap enclosure. A bead is inserted into the outer conductor surrounding the center conductor and engaging the center conductor at a circumferential slot. The slide-on dielectric bead provides support for the center conductor and maintains the center conductor's position within the outer conductor and its characteristic impedance throughout.