Abstract: A gas turbine engine includes a rotor section proximate to a combustor section, where the rotor section is subject to bowing effects due to thermal differences and heat transfer at engine shutdown. The gas turbine engine also includes a heat pipe system. The heat pipe system includes one or more heat pipes installed between an upper portion of the rotor section and a lower portion of the rotor section. The heat pipe system is operable to accept heat at a hot side of the heat pipe system at the upper portion, flow heat from the hot side to a cold side of the heat pipe system, and reject heat from the cold side of the heat pipe system at the lower portion to reduce a thermal differential between the upper portion and the lower portion at engine shutdown.

Abstract: A heat exchanger is provided including an inlet manifold and an outlet manifold arranged generally parallel to the inlet manifold and being spaced therefrom by a distance. A plurality of rows of microtubes is aligned in a substantially parallel relationship. The plurality of rows of microtubes is configured to fluidly couple the inlet manifold and the outlet manifold. Each of the plurality of rows includes a plurality of microtubes.

Abstract: A plate heat exchanger includes a plurality of main plates stacked to define a first cavity to direct a first fluid therethrough and a second cavity to direct a second fluid therethrough, the second fluid different from and kept separated from the first fluid. Each main plate has one or more peaks and one or more valleys formed therein. A ratio of wavelength between adjacent peaks or between adjacent valleys of the main plate to an amplitude between a peak and an adjacent valley of the main plate is equal to or greater than 7.0.

Abstract: Heat pump cycle provided with a fluidic loop connecting two heat exchangers. The fluidic loop is filled with an electro-caloric liquid as a heat transfer medium. Applying electric filed in one of the heat exchangers the temperature of the electro-caloric liquid is changed.

Abstract: A component includes a substrate formed from a metallic or ceramic material and a thermal barrier coating positioned on the substrate. The component also includes a ceramic reflective coating integral with the thermal barrier coating. The reflective coating includes an arrangement of features configured to reflect at a wavelength at which peak emission from a heat source occurs. A method of making a component includes positioning a thermal barrier coating on the component and determining a wavelength emitted from a heat source. The method of making a component also includes producing an arrangement of features using a metamaterial to form a reflective coating and integrating the reflective coating with the thermal barrier coating.

Abstract: A system includes an electronic device, a heat spreader with a vapor chamber attached to a bottom end of the electronic device, so that heat flows from the electronic device to the heat spreader, and a heat sink with microchannels running through it attached to a bottom end of the heat spreader, so that heat from the heat spreader flows through the heat sink and to an ambient. A method for cooling a device includes transferring heat generated by a device through a conductivity layer, spreading the heat through a heat spreader, transferring the heat from the heat spreader to a heat sink that contains microchannels, and releasing the heat from the heat sink into an ambient.

Abstract: A power system includes a first energy harvester, a second energy harvester, a power conditioning unit, and a load. The first energy harvester is configured to produce a first voltage. The second energy harvester is configured to produce a second voltage. The first voltage is greater than the second voltage. The power conditioning unit is configured to condition power produced by the second energy harvester. The power conditioning unit is powered by the first voltage. The load is configured to receive the conditioned power from the power conditioning unit.

Abstract: A thermal interface includes a first thermal component and a second thermal component. A fluid filled cushion is disposed between the first thermal component and the second thermal component, and is a thermal joint.

Abstract: The electronic control has an electric control which incorporates circuitry which will generate heat in use. A cooling channel placed in contact with at least one surface on the electric control. The cooling channel has a portion which receives an enhanced heat transfer surface. At least one electrode pair is mounted on an inlet channel portion upstream of the portion of the channel that receives the enhanced heat transfer surface. A source of current is provided for the electrode. The electrode induces an electric field in the inlet channel, to drive a dielectric fluid across the enhanced heat transfer surfaces.

Abstract: At least one cooling channel is positioned adjacent to an electronic component. The cooling channel communicates with plenums at each of two opposed axial ends. A dielectric fluid is received in the cooling channel. The cooling channel is provided with at least one electrode. A potential is applied to the at least one electrode such that an electric field magnitude at the downstream end of the channel is less than an upstream electric field magnitude, and such that a dielectrophoretic force on a bubble in the cooling channel will force it downstream.

Abstract: A cooling system has an inlet plenum and at least one cooling channel which communicates with the inlet plenum. The cooling channel passes adjacent to a component to be cooled from an upstream inlet to a downstream outlet. A pair of electrodes are positioned adjacent the inlet to create an electric field tending to resist a bubble formed in an included dielectric liquid from moving in an upstream direction due to a dielectrophoretic force. Instead, a dielectrophoretic force urges the bubble in a downstream direction.

Abstract: A system includes an electronic device, a heat spreader with a vapor chamber attached to a bottom end of the electronic device, so that heat flows from the electronic device to the heat spreader, and a heat sink with microchannels running through it attached to a bottom end of the heat spreader, so that heat from the heat spreader flows through the heat sink and to an ambient. A method for cooling a device includes transferring heat generated by a device through a conductivity layer, spreading the heat through a heat spreader, transferring the heat from the heat spreader to a heat sink that contains microchannels, and releasing the heat from the heat sink into an ambient.

Abstract: At least one cooling channel is positioned adjacent to an electronic component. The cooling channel communicates with plenums at each of two opposed axial ends. A dielectric fluid is received in the cooling channel. The cooling channel is provided with at least one electrode. A potential is applied to the at least one electrode such that an electric field magnitude at the downstream end of the channel is less than an upstream electric field magnitude, and such that a dielectrophoretic force on a bubble in the cooling channel will force it downstream.

Abstract: A cooling system has an inlet plenum and at least one cooling channel which communicates with the inlet plenum. The cooling channel passes adjacent to a component to be cooled from an upstream inlet to a downstream outlet. A pair of electrodes are positioned adjacent the inlet to create an electric field tending to resist a bubble formed in an included dielectric liquid from moving in an upstream direction due to a dielectrophoretic force. Instead, a dielectrophoretic force urges the bubble in a downstream direction.

Abstract: The electronic control has an electric control which incorporates circuitry which will generate heat in use. A cooling channel placed in contact with at least one surface on the electric control. The cooling channel has a portion which receives an enhanced heat transfer surface. At least one electrode pair is mounted on an inlet channel portion upstream of the portion of the channel that receives the enhanced heat transfer surface. A source of current is provided for the electrode. The electrode induces an electric field in the inlet channel, to drive a dielectric fluid across the enhanced heat transfer surfaces.