Patents by Inventor Matthew S. Fitzpatrick

Matthew S. Fitzpatrick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Vertical mount transient voltage suppressor array
    Patent number: 8638535
    Abstract: A system comprises a package with top and bottom surfaces, a plurality of high-power transient voltage suppressors arranged within the package, and a robust lead frame. Each of the transient voltage suppressors has first and second major surfaces substantially perpendicular to the top and bottom surfaces of the package. The lead frame comprises leads connected to the major surfaces of the transient voltage suppressors. Each of the leads has a thickness greater than about 0.015 inches (or 0.381 mm) in a mounting portion, in order to dissipate heat from the transient voltage suppressors and to resist vibration-induced stress on the package.
    Type: Grant
    Filed: January 10, 2011
    Date of Patent: January 28, 2014
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Kevin P. Roy, Richard A. Poisson, Jay W. Kokas, Edward John Marotta, Robert C. Hoeckele, Luke T. Orsini, Marc S. McCloud, Matthew S. Fitzpatrick
  • Vertically mounted multi-hybrid module and heat sink
    Patent number: 8542490
    Abstract: A multi-hybrid module includes a plurality of hybrid assemblies that are perpendicularly mounted with respect to a plane of a circuit board. The hybrid assemblies are mounted on opposing sides of a heat sink. The heat sink has a first column disposed at a first end, a second column disposed at a second opposing end, and a generally flat center wall extending between the first column and the second column to which the hybrid assemblies are mounted. During operation the hybrid assemblies are mounted on edge perpendicular with respect to the circuit board to minimize an area profile of the multi-hybrid module on the circuit board.
    Type: Grant
    Filed: June 16, 2011
    Date of Patent: September 24, 2013
    Assignee: Hamilton Sundstrand Corporation
    Inventors: Jay W. Kokas, Kevin P. Roy, Judy Schwartz, Michael Maynard, John D. Pennell, Matthew S. Fitzpatrick, Richard M. Speziale
  • VERTICALLY MOUNTED MULTI-HYBRID MODULE AND HEAT SINK
    Publication number: 20120320530
    Abstract: A multi-hybrid module includes a plurality of hybrid assemblies that are perpendicularly mounted with respect to a plane of a circuit board. The hybrid assemblies are mounted on opposing sides of a heat sink. The heat sink has a first column disposed at a first end, a second column disposed at a second opposing end, and a generally flat center wall extending between the first column and the second column to which the hybrid assemblies are mounted. During operation the hybrid assemblies are mounted on edge perpendicular with respect to the circuit board to minimize an area profile of the multi-hybrid module on the circuit board.
    Type: Application
    Filed: June 16, 2011
    Publication date: December 20, 2012
    Applicant: HAMILTON SUNDSTRAND CORPORATION
    Inventors: Jay W. Kokas, Kevin P. Roy, Judy Schwartz, Michael Maynard, John D. Pennell, Matthew S. Fitzpatrick, Richard M. Speziale
  • VERTICAL MOUNT TRANSIENT VOLTAGE SUPPRESSOR ARRAY
    Publication number: 20120176716
    Abstract: A system comprises a package with top and bottom surfaces, a plurality of high-power transient voltage suppressors arranged within the package, and a robust lead frame. Each of the transient voltage suppressors has first and second major surfaces substantially perpendicular to the top and bottom surfaces of the package. The lead frame comprises leads connected to the major surfaces of the transient voltage suppressors. Each of the leads has a thickness greater than about 0.015 inches (or 0.381 mm) in a mounting portion, in order to dissipate heat from the transient voltage suppressors and to resist vibration-induced stress on the package.
    Type: Application
    Filed: January 10, 2011
    Publication date: July 12, 2012
    Applicant: HAMILTON SUNDSTRAND CORPORATION
    Inventors: Kevin P. Roy, Richard A. Poisson, Jay W. Kokas, Edward John Marotta, Robert C. Hoeckele, Luke T. Orsini, Marc S. McCloud, Matthew S. Fitzpatrick