Abstract: A protective enclosure for an electronic device includes a cushioning layer and a structural layer. The cushioning layer covers the back surface and side surfaces of the installed electronic device. The structural layer is disposed over the cushioning layer and includes a back portion, a right side portion, and a left side portion. The structural layer includes a thinner region on the back portion. The thinner region has a thickness that is less than the thickness of the remainder of the back portion of the structural layer. The thinner region of the structural layer allows a section of the protective enclosure to bend away from the back surface of the electronic device during installation and removal of the electronic device from the protective enclosure.

Abstract: A protective enclosure for an electronic device includes a shell, a first cushioning layer and a second cushioning layer. The shell includes an inner and an outer surface, a retaining wall defined by a perimeter portion of the shell, the retaining wall having a top-side, a bottom-side, and left and right side wall portions. The first cushioning layer includes a front surface and a back surface, the back surface of the first cushioning layer being overmolded on the inner surface of the shell and the front surface cushioning the back portion of the electronic device. The second cushioning member includes a perimeter wall having a tope side wall, a bottom side wall, and left and right side walls, the perimeter wall being overmolded with the retaining wall of the bottom shell and adapted to form-fit over at least the perimeter portion of the electronic device.

Abstract: A protective enclosure for an electronic device includes a shell, a first cushioning layer and a second cushioning layer. The shell includes an inner and an outer surface, a retaining wall defined by a perimeter portion of the shell, the retaining wall having a top-side, a bottom-side, and left and right side wall portions. The first cushioning layer includes a front surface and a back surface, the back surface of the first cushioning layer being overmolded on the inner surface of the shell and the front surface cushioning the back portion of the electronic device. The second cushioning member includes a perimeter wall having a tope side wall, a bottom side wall, and left and right side walls, the perimeter wall being overmolded with the retaining wall of the bottom shell and adapted to form-fit over at least the perimeter portion of the electronic device.