Abstract: A method includes scanning a test socket after removal of a device under test to generate scan data. The scan data is compared to reference data. A presence of at least a portion of a pin in the test socket is identified based on the comparison. A test system includes a test socket, a scanner, and a control unit. The test socket is operable to receive devices under test. The scanner is operable to scan a test socket after removal of a device under test to generate scan data. The control unit is operable to compare the scan data to reference data and identify a presence of at least a portion of a pin in the test socket based on the comparison.

Abstract: A method includes scanning a test socket after removal of a device under test to generate scan data. The scan data is compared to reference data. A presence of at least a portion of a pin in the test socket is identified based on the comparison. A test system includes a test socket, a scanner, and a control unit. The test socket is operable to receive devices under test. The scanner is operable to scan a test socket after removal of a device under test to generate scan data. The control unit is operable to compare the scan data to reference data and identify a presence of at least a portion of a pin in the test socket based on the comparison.

Abstract: A method includes scanning a test socket after removal of a device under test to generate scan data. The scan data is compared to reference data. A presence of at least a portion of a pin in the test socket is identified based on the comparison. A test system includes a test socket, a scanner, and a control unit. The test socket is operable to receive devices under test. The scanner is operable to scan a test socket after removal of a device under test to generate scan data. The control unit is operable to compare the scan data to reference data and identify a presence of at least a portion of a pin in the test socket based on the comparison.

Abstract: The present invention provides a method and apparatus for comparing device and non-device structures. The method includes determining at least one characteristic parameter associated with at least one non-device structure on at least one workpiece and determining at least one characteristic parameter associated with at least one device structure on the at least one workpiece. The method also includes comparing the at least one characteristic parameter associated with the at least one non-device structure and the at least one characteristic parameter associated with at least one device structure.

Abstract: The present invention provides a method and apparatus for classifying faults. The method includes accessing wafer state data associated with at least one wafer processed by at least one processing tool and sensor tool trace data associated with the at least one processing tool and determining that at least one fault occurred based upon at least one of the wafer state data and the sensor tool trace data. The method also includes selecting, in response to determining that the at least one fault occurred, a subset of a plurality of faults based upon at least one of the wafer state data and the sensor tool trace data and selecting at least one fault from the subset of the plurality of faults based upon at least one of the wafer state data and the sensor tool trace data.

Abstract: The present invention provides a method and apparatus for dynamic adjustment of an active sensor list. The method includes providing an active sensor list indicative of at least one sensor associated with at least one processing tool, the at least one sensor being communicatively coupled to a network having an associated bandwidth, receiving information indicative of a state of at least one of the processing tools, and modifying the active sensor list based on the information indicative of the state of the at least one of the processing tools and the associated network bandwidth.

Abstract: A method for scheduling production flow includes processing a plurality of manufactured items in a process flow. Item health metrics are determined for at least a subset of the plurality of manufactured items. Tool health metrics are determined for a plurality of tools in the process flow. The manufactured items are scheduled for processing in the tools based on the item health metrics and the tool health metrics. A manufacturing system includes a plurality of tools for processing a plurality of manufactured items in a process flow, an item health monitor, a tool health monitor, and a scheduling server. The item health monitor is configured to determine item health metrics for at least a subset of the plurality of manufactured items. The tool health monitor is configured to determine tool health metrics for at least a subset of the plurality of tools. The scheduling server is configured to schedule the manufactured items for processing in the tools based on the item health metrics and the tool health metrics.

Abstract: A method includes processing a workpiece in a process flow. Workpiece state trace data is collected for the workpiece during its processing in the process flow. A quality profile of the workpiece is generated based on the workpiece state trace data. A manufacturing system includes a plurality of tools configured to process a workpiece in a process flow and a quality monitor. The quality monitor is configured to collect workpiece slate trace data for the workpiece during its processing in the process flow generate a quality profile of the workpiece based on the workpiece state trace data.

Abstract: A method for controlling a process includes processing a first workpiece in a first process tool. An output characteristic of the first workpiece is measured. A second workpiece is processed in the first process tool. A tool health metric is determined for the first process tool corresponding to the processing of the second workpiece. A control action is determined based on the measured output characteristic and the tool health metric.

Abstract: A method is described for removing a particle from a surface of a semiconductor wafer. In general, the method involves positioning an electrically conductive surface near the particle to be removed. An electrical charge is created on the electrically conductive surface. A charged particle beam is formed, wherein the charged particle beam includes particles having an electrical charge opposite the electrical charge of the electrically conductive surface. The charged particle beam is directed at the particle to be removed. When struck by the charged particle beam, the particle to be removed absorbs a portion of the charged particles of the charged particle beam and acquires an electrical charge opposite the electrical charge of the electrically conductive surface.