Abstract: Systems and methods for providing a broadband antenna are described. The systems and methods involved providing a current sheet array. The current sheet array comprises a plurality of unit cells coupled together. Each unit cell comprises a slot and a stripline feed. The stripline feed couples to a dipole array through the slot. An electric field in the slot of a first unit cell is perpendicular to one or more of the stripline feed of the first unit cell and one or more dipoles of the first unit cell.

Abstract: A LIDAR system architecture which transmits light via an optical phased array and receives the reflected signal with a spherically shift invariant sensor. Phased arrays offer the ability to quickly scan a desired area by manipulating the electrical, or in this case—thermal, properties of an array of sensors. Similarly spherically shift invariant systems offer the ability to bring light into focus at the same location regardless of its angle of arrival.

Abstract: Embodiments of the present disclosure relate to a substrate integrated waveguide monopulse antenna. The antenna comprises a substrate having first and second opposing surfaces. A first conductor is disposed on the first surface of the substrate. A plurality of antenna elements are provided on the first surface of the substrate. A second conductor is disposed on the second surface of the substrate. A plurality of conductive via holes extend through said substrate and extend between the first and second surfaces. The via holes are arranged to form a plurality of resonant cavities with at least one resonant cavity coupled to each of the antenna elements. The substrate also comprises a plurality of hybrid couplers, and two of the plurality of resonant cavities are coupled to at least one port of the plurality of hybrid couplers. A plurality of output couplers provided on the second surface of the substrate.

Abstract: Embodiments of the present disclosure relate to a substrate integrated waveguide monopulse antenna. The antenna comprises a substrate having first and second opposing surfaces. A first conductor is disposed on the first surface of the substrate. A plurality of antenna elements are provided on the first surface of the substrate. A second conductor is disposed on the second surface of the substrate. A plurality of conductive via holes extend through said substrate and extend between the first and second surfaces. The via holes are arranged to form a plurality of resonant cavities with at least one resonant cavity coupled to each of the antenna elements. The substrate also comprises a plurality of hybrid couplers, and two of the plurality of resonant cavities are coupled to at least one port of the plurality of hybrid couplers. A plurality of output couplers provided on the second surface of the substrate.

Abstract: A directional coupler includes a substrate, an output line formed on a top of the substrate, and an input line formed on the top of the substrate and including a transmission region. The coupler also includes a lower input line formed on a bottom of the substrate below at least a portion of the transmission region, and one or more vias passing through the substrate and electrically coupling the input line and the lower input line.

Abstract: The concepts, systems and methods described herein are directed towards a connectorless radio frequency (RF) interface between an antenna and RF processor. An RF interconnect is provided having a housing having a ridged waveguide portion provided therein, an upper cavity formed in an upper portion of the housing, a lower cavity formed in a lower portion of the housing, a first suspended air stripline (SAS) transmission line disposed in the lower cavity such that at least a portion of the first SAS transmission line crossed a slot formed by the ridged waveguide and a second SAS transmission line disposed in the upper cavity such that at least a portion of the second SAS transmission line crosses the slot formed by the ridged waveguide.

Abstract: A directional coupler includes a substrate, an output line formed on a top of the substrate, and an input line formed on the top of the substrate and including a transmission region. The coupler also includes a lower input line formed on a bottom of the substrate below at least a portion of the transmission region, and one or more vias passing through the substrate and electrically coupling the input line and the lower input line.

Abstract: The concepts, systems and methods described herein are directed towards a connectorless radio frequency (RF) interface between an antenna and RF processor. An RF interconnect is provided having a housing having a ridged waveguide portion provided therein, an upper cavity formed in an upper portion of the housing, a lower cavity formed in a lower portion of the housing, a first suspended air stripline (SAS) transmission line disposed in the lower cavity such that at least a portion of the first SAS transmission line crossed a slot formed by the ridged waveguide and a second SAS transmission line disposed in the upper cavity such that at least a portion of the second SAS transmission line crosses the slot formed by the ridged waveguide.