Patents by Inventor Matthew Sargent

Matthew Sargent has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Vertical soldering technology for 3D circuit assembly
    Patent number: 11501982
    Abstract: A circuit assembly with an electrical connection between two individual Printed Circuit Boards (PCBs) or Circuit Card Assemblies (CCAs) that are vertically stacked with a connection formed entirely of solder and with a gap in between surfaces that components may occupy. Coalescing solder paste merges between the surfaces when it is in a liquid state to form a solder bridge. The resultant assembly can be encapsulated to form a solid monolithic electronic assembly to improve robustness and allow the assembly to better withstand compressive forces.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: November 15, 2022
    Assignee: The United States of Americas as Represented by the Secretary of the Army
    Inventors: Stephen Redington, Christopher Macrae, Matthew Sargent