Abstract: Cleaning and/or conditioning electrode surfaces can provide significant performance and operational benefits in EHD devices. In particular, conditioning of emitter electrode surfaces with silver (Ag), silver compositions or silver preparations applied in situ at successive times throughout the operating lifetime of an EHD air mover has been found to significantly reduce ozone production. Structures and techniques are described for in situ conditioning electrode surfaces and, in particular, emitter electrode surfaces of an EHD device such as an air mover or precipitator, with a conditioning material that includes silver.

Abstract: An electrohydrodynamic fluid accelerator apparatus includes a corona electrode having an axial shape and configured to receive a first voltage. The electrohydrodynamic fluid accelerator apparatus includes a collector electrode disposed coaxially around the at least one corona electrode and configured to receive a second voltage. Application of the first and second voltages on the corona electrode and the collector electrode, respectively, causes fluid proximate to the corona electrode to ionize and travel in a first direction between the corona electrode and the collector electrode, thereby causing other fluid molecules to travel in a second direction to generate a fluid stream. In at least one embodiment of the invention, the ionized fluid proximate to the emitter electrode travels in a radial direction from the corona electrode to the collector electrode, causing the other fluid molecules to travel in an axial direction to thereby generate the fluid stream.

Abstract: An apparatus for tandem cleaning of an emitter electrode and collector electrode in electrohydrodynamic fluid accelerator and precipitator devices via movement of a cleaning mechanism including respective cleaning surfaces positioned to frictionally engage the emitter electrode and collector electrode. The cleaning mechanism causes the respective cleaning surfaces to travel along a longitudinal extent of the emitter electrode and, in tandem, over a major dimension of the collector electrode to remove detrimental material from respective electrode surfaces. Alternatively, the electrodes can be transited in tandem in frictional engagement with a fixed cleaning mechanism in the same or opposite directions. A conditioning material is optionally deposited on an electrode to at least partially mitigate ozone, erosion, corrosion, oxidation, or dendrite formation on the electrodes. The conditioning material can include an ozone reducer.

Abstract: Cleaning and/or conditioning electrode surfaces can provide significant performance and operational benefits in EHD devices. In particular, conditioning of emitter electrode surfaces with silver (Ag), silver compositions or silver preparations applied in situ at successive times throughout the operating lifetime of an EHD air mover has been found to significantly reduce ozone production. Structures and techniques are described for in situ conditioning electrode surfaces and, in particular, emitter electrode surfaces of an EHD device such as an air mover or precipitator, with a conditioning material that includes silver.

Abstract: Techniques are described for integration of EHD-type air movers with electronic systems, and in particular, for limiting infiltration of ions and/or charged particulates into an internal air plenum. In some designs, it may be desirable to allow or even encourage EHD motivated air flow (whether drawn or forced) through the internal air plenum while providing a barrier to transit of ions and/or charged particulates that may be generated during EHD operation. Such a barrier may employ electrostatic forces to impede transit of ions and/or charged particulate across a vent positioned to allow air flow from or into the internal air plenum. In some cases, an electrostatic barrier may include a fluid permeable mesh or grill that spans a substantial cross-section of the vent.

Abstract: An electronic system including an enclosure and an internal air plenum within the enclosure. At least one component of the electronic system within the enclosure evolves heat and has a surface exposed to the internal air plenum. The enclosure has inlet and outlet ventilation boundaries together with an EHD air mover disposed therein to motivate airflow along a flow path between the inlet and outlet ventilation boundaries, wherein the flow path is substantially excluded from the internal air plenum by a barrier.

Abstract: An electrohydrodynamic fluid accelerator apparatus includes a corona electrode having an axial shape and configured to receive a first voltage. The electrohydrodynamic fluid accelerator apparatus includes a collector electrode disposed coaxially around the at least one corona electrode and configured to receive a second voltage. Application of the first and second voltages on the corona electrode and the collector electrode, respectively, causes fluid proximate to the corona electrode to ionize and travel in a first direction between the corona electrode and the collector electrode, thereby causing other fluid molecules to travel in a second direction to generate a fluid stream. In at least one embodiment of the invention, the ionized fluid proximate to the emitter electrode travels in a radial direction from the corona electrode to the collector electrode, causing the other fluid molecules to travel in an axial direction to thereby generate the fluid stream.

Abstract: A monolithic bail-delatch mechanism is provided for a module plugged into a cage. The bail-delatch mechanism is a single monolithic unit that includes a living hinge connecting a bail and a delatch clip. The living hinge, the bail, and the delatch clip may be made of a single injection molded plastic part. The bail may include cantilever hooks for securing the bail against the module in a latched position. The delatch clip may include a spring mechanism having two spring arms for locking the bail-delatch mechanism to the module, and a delatch fork having tines with wedges for releasing a post of the module from a latch tab of the cage.

Abstract: In one aspect, an electronic assembly includes an interconnection substrate, a component, and a discontinuity compensator. The interconnection substrate includes a signal conductor and a ground conductor. The component includes a device having a signal line and a ground conductor, a package, and a signal lead. The signal lead is electrically coupled to an internal signal path of the package and has an external portion extending from the package to the signal conductor of the interconnection substrate. The discontinuity compensator electrically couples a ground path of the package to the ground conductor of the interconnection substrate. The discontinuity compensator includes an electrically conducting planar surface that is oriented in a plane intersecting the interconnection substrate and forms with at least a substantial part of the external portion of the signal lead a transmission line structure having an impedance substantially matching the nominal impedance over the specified bandwidth.

Abstract: A fiber optic module includes a first housing insert molded with an electromagnetic interference (EMI) shield, an optoelectronic subassembly mounted in the first housing, and a second housing mounted to the first housing to enclose the optoelectronic subassembly. The EMI shield includes a conductive mesh and conductive contact fingers. The first housing includes a non-conductive housing floor, non-conductive housing sidewalls, and a non-conductive nose defining at least one connector receptacle, wherein the housing floor and the housing sidewalls are injection molded through the mesh of the EMI shield to be integral with the nose and so that the fingers at least partially surround the nose.

Abstract: Integral dielectric heatspreader for transferring heat from semiconductor devices. A semiconductor device is mounted to a thermally conductive electrically insulating substrate, which forms the integral dielectric heatspreader. The heatspreader is then mounted to a package or a lower cost substrate such as a printed circuit board. The integral dielectric heatspreader may also support integral transmission lines, resistors, capacitors, or other bulk components. Performance of the heatspreader is enhanced through the use of thermal vias on a printed circuit board.