Patents by Inventor Matthew Sharak

Matthew Sharak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low application temperature hot melt adhesive
    Patent number: 10138398
    Abstract: The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: November 27, 2018
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Yuhong Hu, Maria Xenidou, Alethea Pollock-Downer, Matthew Sharak, Maria Cristina Barbosa DeJesus
  • LOW APPLICATION TEMPERATURE HOT MELT ADHESIVE
    Publication number: 20180148615
    Abstract: The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
    Type: Application
    Filed: January 25, 2018
    Publication date: May 31, 2018
    Inventors: Yuhong Hu, Maria Xenidou, Alethea Pollock-Downer, Matthew Sharak, Maria Cristina Barbosa DeJesus
  • Low application temperature hot melt adhesive
    Patent number: 9914857
    Abstract: The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
    Type: Grant
    Filed: July 21, 2015
    Date of Patent: March 13, 2018
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Yuhong Hu, Maria Xenidou, Alethea Pollock-Downer, Matthew Sharak, Maria Cristina Barbosa DeJesus
  • LOW APPLICATION TEMPERATURE HOT MELT ADHESIVE
    Publication number: 20150322302
    Abstract: The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
    Type: Application
    Filed: July 21, 2015
    Publication date: November 12, 2015
    Inventors: Yuhong HU, Maria Xenidou, Alethea Pollock-Downer, Matthew Sharak, Maria Cristina Barbosa DeJesus
  • Low application temperature hot melt adhesive
    Patent number: 9115299
    Abstract: The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
    Type: Grant
    Filed: February 24, 2014
    Date of Patent: August 25, 2015
    Assignee: HENKEL IP & HOLDING GMBH
    Inventors: Yuhong Hu, Maria Xenidou, Alethea Pollock-Downer, Matthew Sharak, Maria Cristina Barbosa Dejesus
  • LOW APPLICATION TEMPERATURE HOT MELT ADHESIVE
    Publication number: 20140171586
    Abstract: The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
    Type: Application
    Filed: February 24, 2014
    Publication date: June 19, 2014
    Inventors: Yuhong Hu, Maria Xenidou, Alethea Pollock-Downer, Matthew Sharak, Maria Cristina Barbosa Dejesus
  • Low application temperature hot melt adhesive
    Patent number: 8702900
    Abstract: The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
    Type: Grant
    Filed: February 20, 2012
    Date of Patent: April 22, 2014
    Assignee: Henkel US IP LCC
    Inventors: Yuhong Hu, Maria Xenidou, Alethea Pollock-Downer, Matthew Sharak, M. Cristina B. DeJesus
  • Low Application Temperature Hot Melt Adhesive
    Publication number: 20120149827
    Abstract: The invention relates to a low application temperature hot melt adhesive. More specifically, the low application temperature hot melt adhesive comprises olefin copolymers with an average Melt Index greater than 5 but less than about 35 g/10 minutes at 190° C. The adhesive is particularly useful in the construction of nonwoven articles.
    Type: Application
    Filed: February 20, 2012
    Publication date: June 14, 2012
    Inventors: Yuhong Hu, Maria Xenidou, Alethea Pollock-Downer, Matthew Sharak, M. Cristina B. DeJesus
  • Low application temperature hot melt adhesive
    Publication number: 20070173153
    Abstract: A low application temperature rubber-based hot melt adhesive having properties particularly well suited for use in the construction of disposable articles has been invented. The adhesive comprises a styrene block copolymer and a type of wax in an amount effective to produce a viscosity at 120° C. of below about 10,000 centipoises, a cube flow at 130° F. (54° C.) of less than about 300%, a DSC crystallization temperature of less than about 75° C. and a storage modulus of less than about 1.0×107 dynes/cm2 at 10 rads/sec (25° C.).
    Type: Application
    Filed: March 12, 2007
    Publication date: July 26, 2007
    Inventors: Charles Paul, Matthew Sharak, Leisa Ryan, Maria Xenidou, Michael Harwell, Qiwei He
  • Hydrophilic hot melt adhesives
    Patent number: 5356963
    Abstract: A hot melt adhesive composition comprising 5 to 50% by weight hydroxypropyl cellulose, 5 to 40% by weight plasticizer of which up to 85% may be a water insoluble plasticizer; 20 to 70% by weight tackifying resin; 0 to 40% by weight polar wax; 0 to 30% by weight compatible polymer; and, 0 to 3% by weight stabilizer.
    Type: Grant
    Filed: July 16, 1993
    Date of Patent: October 18, 1994
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventors: Thomas F. Kauffman, Gary Raykovitz, Lydia Wagner, Matthew Sharak, Charles Paul