Patents by Inventor Matthew STAMPLIS

Matthew STAMPLIS has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10771722
    Abstract: An imaging device is often paired with a readout integrated circuit (ROIC), which provides processing and data transfer functionality. The circuitry of a ROIC is typically specialized to meet the requirements of an application, which limits the ROIC to a few modes of operation and restricts compatibility to only certain types of imaging devices and applications. Furthermore, the circuitry supporting the processing functionality is limited due to size constraints on the ROIC. These shortcomings can be overcome with a field programmable imaging array (FPIA), which can be implemented as an integrated circuit combining customized ROIC sensor interface circuitry with field programmable gate array (FPGA) circuitry to enable post-fabrication definition of ROIC operational modes. An FPIA chip may form part of a three-chip stack that also includes an analog sensor interface chip for analog-to-digital conversion and an imaging device.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: September 8, 2020
    Assignee: Massachusetts Institute of Technology
    Inventors: Peter J. Grossmann, Matthew Stamplis, Kate Thurmer, Brian Tyrrell, Jonathan Frechette
  • Publication number: 20190104269
    Abstract: An imaging device is often paired with a readout integrated circuit (ROIC), which provides processing and data transfer functionality. The circuitry of a ROIC is typically specialized to meet the requirements of an application, which limits the ROIC to a few modes of operation and restricts compatibility to only certain types of imaging devices and applications. Furthermore, the circuitry supporting the processing functionality is limited due to size constraints on the ROIC. These shortcomings can be overcome with a field programmable imaging array (FPIA), which can be implemented as an integrated circuit combining customized ROIC sensor interface circuitry with field programmable gate array (FPGA) circuitry to enable post-fabrication definition of ROIC operational modes. An FPIA chip may form part of a three-chip stack that also includes an analog sensor interface chip for analog-to-digital conversion and an imaging device.
    Type: Application
    Filed: September 28, 2018
    Publication date: April 4, 2019
    Applicant: Massachusetts Institute of Technology
    Inventors: Peter J. GROSSMANN, Matthew STAMPLIS, Kate THURMER, Brian TYRRELL, Jonathan FRECHETTE