Patents by Inventor Matthew Stanton Whitlock

Matthew Stanton Whitlock has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230005771
    Abstract: Introduced here is a wafer separator configured to carry a semiconductor wafer with improved efficiency, protection, and reduced costs when utilized in the handling, transport, or storage of semiconductor components. The wafer separator may include a circular ring having an outer edge defining a periphery of the circular ring. The circular ring may include an inner edge defining a central opening of the circular ring. The wafer separator may include a first-right angled recess for receiving a semiconductor wafer that extends downward from a top surface of the circular ring. The wafer separator may also include a second right-angled recess for maintaining a gap beneath the semiconductor wafer when the semiconductor wafer is set within the first right-angled recess. In some embodiments, the wafer separator also includes interlock components for connecting the wafer separator to adjacent wafer separators.
    Type: Application
    Filed: February 18, 2022
    Publication date: January 5, 2023
    Inventors: Sunna Chung, Ryan Park, Jin Chae, Matthew Stanton Whitlock, Jonathan Kevin Lie, Athens Okoren
  • Publication number: 20220384226
    Abstract: Introduced here are carrier assemblies designed to address the limitations of conventional carrier trays. A carrier assembly can comprise a primary injection-molded component having a deck area for receiving semiconductor components and a secondary injection-molded component that is secured to the deck area of the primary injection-molded component. For example, the secondary injection-molded component may be overmolded on the deck area of the primary injection-molded component. The secondary injection-molded component may have a tacky upper surface that facilitates securement of the semiconductor components to the primary injection-molded component.
    Type: Application
    Filed: August 12, 2022
    Publication date: December 1, 2022
    Inventors: Sunna Chung, Matthew Stanton Whitlock, Athens Okoren, Brent Dae Hermsmeier
  • Publication number: 20220013390
    Abstract: Introduced here are carrier assemblies that include a rigid tray having a deck area with a patterned surface of cavities for receiving semiconductor components. The cavities can be designed to accommodate semiconductor components of different form factors (e.g., having different shapes, sizes, etc.). Moreover, an adhesive film can be affixed to the deck area to ensure that the semiconductor components are securely held against the top surface of the rigid tray. In some instances the adhesive film substantially conforms to the deck area, while in other instances the adhesive film extends across the opening of each cavity located in the deck area. Semiconductor component(s) can be secured to the carrier assembly based on the adhesiveness provided by the adhesive film, mechanical force provided the cavities, electrostatic force provided by the cavities, or any combination thereof.
    Type: Application
    Filed: September 24, 2021
    Publication date: January 13, 2022
    Inventors: Jonathan Kevin Lie, Matthew Stanton Whitlock, Brent Dae Hermsmeier