Patents by Inventor Matthew Stephen Angyal

Matthew Stephen Angyal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11663391
    Abstract: Aspects of the invention include systems and methods for implementing a CMOS circuit design that uses a sea-of-gates fill methodology to provide latch-up avoidance. A non-limiting example computer-implemented method includes identifying a fill cell in the circuit design. The fill cell can include a power rail, a ground rail, and a field-effect transistor (FET) electrically coupled to the power rail through a via. The method can include disconnecting the via from the power rail and moving the via to a disconnected node in the fill cell. Moving the via decouples a source or drain of the fill cell from a well of the fill cell, preventing latch-up while maintaining via and metal shape density.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: May 30, 2023
    Assignee: International Business Machines Corporation
    Inventors: David Wolpert, Ryan Michael Kruse, Leon Sigal, Richard Edward Serton, Matthew Stephen Angyal, Terence Hook, Richard Andre Wachnik
  • Publication number: 20230062945
    Abstract: Aspects of the invention include systems and methods for implementing a CMOS circuit design that uses a sea-of-gates fill methodology to provide latch-up avoidance. A non-limiting example computer-implemented method includes identifying a fill cell in the circuit design. The fill cell can include a power rail, a ground rail, and a field-effect transistor (FET) electrically coupled to the power rail through a via. The method can include disconnecting the via from the power rail and moving the via to a disconnected node in the fill cell. Moving the via decouples a source or drain of the fill cell from a well of the fill cell, preventing latch-up while maintaining via and metal shape density.
    Type: Application
    Filed: August 25, 2021
    Publication date: March 2, 2023
    Inventors: David Wolpert, Ryan Michael Kruse, Leon Sigal, Richard Edward Serton, Matthew Stephen Angyal, Terence Hook, Richard Andre Wachnik
  • Publication number: 20220406769
    Abstract: A structure is provided that includes a first active circuit in which at least one of areas surrounding the first active circuit includes an active circuit-containing region. A second active circuit is spaced apart from the first active circuit. The second active circuit includes a circuit mimic fill area present in at least one of the areas surrounding the second active circuit. The circuit mimic fill area substantially matches the active circuit-containing region that is adjacent to the first active circuit. The circuit mimic fill area is located on an equivalent side of the second active circuit as the active circuit-containing region that is present adjacent the first active circuit. The use of the circuit mimic fill mitigates the effects over medium range and beyond distances that cause device failure.
    Type: Application
    Filed: June 22, 2021
    Publication date: December 22, 2022
    Inventors: Dureseti Chidambarrao, Matthew Stephen Angyal, Noah Zamdmer, Varadarajan Vidya, James Strom, Grant P. Kesselring, Erik Unterborn
  • Patent number: 7480605
    Abstract: Techniques are disclosed for determination of parameter variability for one or more given interconnects of a plurality of interconnects in a simulated semiconductor circuit. The simulated semiconductor circuit is defined at least in part by a plurality of input parameters. From a distribution of first values of a given input parameter, a plurality of the first values are determined to use when calculating a corresponding plurality of second values for each of one or more output parameters. By using at least the determined plurality of first values for the given input parameter and selected values for other input parameters in the plurality of input parameters, the corresponding plurality of second values are calculated for each of the one or more output parameters. The one or more output parameters correspond to the one or more given interconnects. Each of the second values corresponds to one of the determined plurality of first values.
    Type: Grant
    Filed: January 18, 2005
    Date of Patent: January 20, 2009
    Assignee: International Business Machines Corporation
    Inventors: Matthew Stephen Angyal, Alina Deutsch, Ibrahim M. Elfadel, Zhichao Zhang
  • Publication number: 20080221849
    Abstract: Disclosed herein are methods and apparatus that automatically generate an electric circuit model from process parameters used to specify a semiconductor fabrication procedure, wherein at least one of the process parameters is specified as a statistical distribution. The methods and apparatus convert the process parameters into an electric circuit model. The electric circuit model is specified in terms of electric parameters, wherein at least one of the electric parameters is specified in terms of a statistical distribution. The methods and apparatus thus allow a process engineer whose expertise may not extend to state-of-the-art circuit modeling to develop insight into the effect of process parameter selection on the performance of the resulting electric circuit. The resulting insight is further enhanced since at least one of the electric parameters is specified in terms of a statistical distribution.
    Type: Application
    Filed: March 9, 2007
    Publication date: September 11, 2008
    Inventors: Matthew Stephen Angyal, Ibrahim M. Elfadel, Yidnek Mekonnen