Abstract: A universal payload may be integrated with each of a plurality of different orthopedic implants configured to replace or functionally supplement a natural joint of a body. In one aspect, a universal payload includes an electronics assembly, a housing enclosing the electronics assembly, and a payload coupling feature configured to couple to each of a plurality of different orthopedic implants. The electronics assembly includes at least one sensor and a controller having at least two joint-specific modules. Each joint-specific module is respectively configured to collect kinematic data resulting from movement of a respective specific joint sensed by the at least one sensor. In another aspect, a universal payload includes an electronics assembly comprising at least one sensor and a housing enclosing the electronics assembly. The universal payload has a payload form factor that is configured to be at least partially inserted into a payload receptacle in each of a plurality of different orthopedic implants.

Abstract: An intelligent implant includes an implantable reporting processor (IRP) and a component of a prothesis system having a receptacle. The IRP includes an antenna, an electronics assembly including a sensor, a hermetically sealed chamber containing the electronics assembly, a casing configured to house at least a portion of the electronics assembly, and a cover configured to house the antenna. The hermetically sealed chamber contains a gas. The casing and the cover abut one another to form an antenna chamber that houses the antenna and a filler. The receptacle of the component is configured to receive a portion of the IRP and to mechanically couple with the implantable reporting processor. The component of the prothesis system may be one of a tibial component or a femoral component of a knee prosthesis system, a humeral component of a shoulder prosthesis system, and a femoral component of a hip prosthesis system.

Abstract: A universal payload may be integrated with each of a plurality of different orthopedic implants configured to replace or functionally supplement a natural joint of a body. In one aspect, a universal payload includes an electronics assembly, a housing enclosing the electronics assembly, and a payload coupling feature configured to couple to each of a plurality of different orthopedic implants. The electronics assembly includes at least one sensor and a controller having at least two joint-specific modules. Each joint-specific module is respectively configured to collect kinematic data resulting from movement of a respective specific joint sensed by the at least one sensor. In another aspect, a universal payload includes an electronics assembly comprising at least one sensor and a housing enclosing the electronics assembly. The universal payload has a payload form factor that is configured to be at least partially inserted into a payload receptacle in each of a plurality of different orthopedic implants.