Abstract: A universal payload may be integrated with each of a plurality of different orthopedic implants configured to replace or functionally supplement a natural joint of a body. In one aspect, a universal payload includes an electronics assembly, a housing enclosing the electronics assembly, and a payload coupling feature configured to couple to each of a plurality of different orthopedic implants. The electronics assembly includes at least one sensor and a controller having at least two joint-specific modules. Each joint-specific module is respectively configured to collect kinematic data resulting from movement of a respective specific joint sensed by the at least one sensor. In another aspect, a universal payload includes an electronics assembly comprising at least one sensor and a housing enclosing the electronics assembly. The universal payload has a payload form factor that is configured to be at least partially inserted into a payload receptacle in each of a plurality of different orthopedic implants.