Patents by Inventor Matthew T. Gagnon

Matthew T. Gagnon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Board level shielding module
    Patent number: 7446265
    Abstract: An apparatus for providing board level shielding of Electromagnetic Interference in a printed circuit board is disclosed. The apparatus includes a plastic part, a metal conformal coating and a form-in-place Electromagnetic Interference gasket. The plastic part is configured in one or more compartments to provide an enclosure, and is attached to the printed circuit board. The metal conformal coating is applied continuously to one or more surfaces of the plastic part. The form-in-place Electromagnetic Interference gasket is applied on top of the metal conformal coating in an area of a part flange.
    Type: Grant
    Filed: April 14, 2006
    Date of Patent: November 4, 2008
    Assignee: Parker Hannifin Corporation
    Inventors: Eric G. Krohto, Lawrence J. Denefrio, Peter Jones, John C. Ariel, Matthew T. Gagnon, Douglas Nobbs, George R. Watchko, Marc E. LaRosse
  • Thermal-sprayed metallic conformal coatings used as heat spreaders
    Patent number: 6965071
    Abstract: Heat dissipation and electromagnetic interference (EMI) shielding for an electronic device having an enclosure. An interior surface of the enclosure is covered with a conformal metallic layer which, as disposed in thermal adjacency with one or more heat-generating electronic components or other sources contained within the enclosure, may provide both thermal dissipation and EMI shielding for the device. The layer may be sprayed onto the interior surface in a molten state and solidified to form a self-adherent coating.
    Type: Grant
    Filed: November 1, 2002
    Date of Patent: November 15, 2005
    Assignee: Parker-Hannifin Corporation
    Inventors: George R. Watchko, Matthew T. Gagnon, Peter W. Liu, Miksa de Sorgo, Christian V. Rodriguez, William G. Lionetta, Scott M. Oppenheim
  • Manufacture of electronics enclosure having a metallized shielding layer
    Patent number: 6763576
    Abstract: Manufacture of an electromagnetic interference (EMI) shielding cover or other enclosure part for housing circuitry of an electronic device. The enclosure part has an exterior surface and an opposing interior surface metallized with an electrically-conductive EMI shielding layer. The layer is sprayed onto the interior surface in a molten state and is solidified to form a corrosion-resistant, self-adherent coating.
    Type: Grant
    Filed: May 1, 2002
    Date of Patent: July 20, 2004
    Assignee: Parker-Hannifin Corporation
    Inventors: George R. Watchko, Brian F. Flaherty, Matthew T. Gagnon, Douglas Nobbs, Steven L. Thornton, Walter H. Dolbier, Jr., George A. Lee, James J. Sauer
  • Thermal-sprayed metallic conformal coatings used as heat spreaders
    Publication number: 20030066672
    Abstract: Heat dissipation and electromagnetic interference (EMI) shielding for an electronic device having an enclosure. An interior surface of the enclosure is covered with a conformal metallic layer which, as disposed in thermal adjacency with one or more heat-generating electronic components or other sources contained within the enclosure, may provide both thermal dissipation and EMI shielding for the device. The layer may be sprayed onto the interior surface in a molten state and solidified to form a self-adherent coating.
    Type: Application
    Filed: November 1, 2002
    Publication date: April 10, 2003
    Inventors: George R. Watchko, Matthew T. Gagnon, Peter W. Liu, Miksa de Sorgo, Christian V. Rodriguez, William G. Lionetta, Scott M. Oppenheim
  • Manufacture of electronics enclosure having a metallized shielding layer
    Publication number: 20020166682
    Abstract: Manufacture of an electromagnetic interference (EMI) shielding cover or other enclosure part for housing circuitry of an electronic device. The enclosure part has an exterior surface and an opposing interior surface metallized with an electrically-conductive EMI shielding layer. The layer is sprayed onto the interior surface in a molten state and is solidified to form a corrosion-resistant, self-adherent coating.
    Type: Application
    Filed: May 1, 2002
    Publication date: November 14, 2002
    Inventors: George R. Watchko, Brian F. Flaherty, Matthew T. Gagnon, Douglas Nobbs, Steven L. Thornton, Walter H. Dolbier, George A. Lee, James J. Sauer