Patents by Inventor Matthew T. Rosemeyer

Matthew T. Rosemeyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF MANUFACTURING A PANEL ASSEMBLY
    Publication number: 20130074343
    Abstract: A method of manufacturing a panel assembly comprises the steps of: forming a base structure including a first layer and mounting members; bending the mounting members to define a mounting surface; forming a second layer; and coupling the second layer to the first layer.
    Type: Application
    Filed: September 26, 2011
    Publication date: March 28, 2013
    Inventors: David C. Newkirk, Earl L. Rowland, Joseph H. Abel, John E. Billman, Timothy G. Schneider, Matthew T. Rosemeyer, Brian J. Hoffman
  • Wave solder apparatus and method
    Patent number: 6688511
    Abstract: A method of soldering a circuit board comprises moving a circuit board through various stations including a preheater station and a solder station.
    Type: Grant
    Filed: January 16, 2002
    Date of Patent: February 10, 2004
    Assignee: Hill-Rom Services, Inc.
    Inventors: Chris Lee Hildenbrand, Nikolaos Thomas Kostopoulos, Ernie Gipson, Matthew T. Rosemeyer, Frank W. Cleary, Michael Joseph Gosmeyer, Timothy Kieffer, Ronald A. Poggeman
  • Wave solder apparatus and method
    Publication number: 20020096556
    Abstract: A method of soldering a circuit board comprises moving a circuit board through various stations including a preheater station and a solder station.
    Type: Application
    Filed: January 16, 2002
    Publication date: July 25, 2002
    Applicant: Hill-Rom Services, Inc.
    Inventors: Chris Lee Hildenbrand, Nikolaos Thomas Kostopoulos, Ernie Gipson, Matthew T. Rosemeyer, Frank W. Cleary, Michael Joseph Gosmeyer, Timothy Kieffer, Ronald A. Poggeman
  • Wave solder apparatus and method
    Patent number: 6367677
    Abstract: A wave soldering apparatus includes a frame having a first end and wave solder equipment supported with respect to the frame. The wave solder equipment is configured to apply solder to a circuit board. A circuit board transporter is supported with respect to the frame, and is configured to receive a circuit board adjacent the first end of the frame, to move the circuit board away from the first end of the frame and over the wave solder equipment which applies solder to the circuit board, and to return the circuit board for retrieval adjacent the first end of the frame.
    Type: Grant
    Filed: September 28, 2000
    Date of Patent: April 9, 2002
    Assignee: Hill-Rom Services, Inc.
    Inventors: Chris Lee Hildenbrand, Nikolaos Thomas Kostopoulos, Ernie Gipson, Matthew T. Rosemeyer, Frank W. Cleary, Michael Joseph Gosmeyer, Timothy Kieffer, Ronald A. Poggeman