Patents by Inventor Matthew T. Tiersch
Matthew T. Tiersch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9708508Abstract: A composition and a method for chemical mechanical polishing. The composition includes a surfactant anion an alkyl alcohol and a diluent. The composition further includes abrasive particles and an oxidizer. The method includes providing the composition on a surface to be polished and polishing the surface by contacting the surface with a polishing pad.Type: GrantFiled: June 8, 2015Date of Patent: July 18, 2017Assignee: GLOBALFOUNDRIES Inc.Inventors: Graham M. Bates, Michael T. Brigham, Joseph K. Comeau, Jason P. Ritter, Matthew T. Tiersch, Eva A. Shah, Eric J. White
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Publication number: 20150267084Abstract: A composition and a method for chemical mechanical polishing. The composition includes a surfactant anion an alkyl alcohol and a diluent. The composition further includes abrasive particles and an oxidizer. The method includes providing the composition on a surface to be polished and polishing the surface by contacting the surface with a polishing pad.Type: ApplicationFiled: June 8, 2015Publication date: September 24, 2015Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Graham M. Bates, Michael T. Brigham, Joseph K. Comeau, Jason P. Ritter, Matthew T. Tiersch, Eva A. Shah, Eric J. White
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Patent number: 9057004Abstract: A composition and a method for chemical mechanical polishing. The composition includes a surfactant anion an alkyl alcohol and a diluent. The composition further includes abrasive particles and an oxidizer. The method includes providing the composition on a surface to be polished and polishing the surface by contacting the surface with a polishing pad.Type: GrantFiled: September 23, 2011Date of Patent: June 16, 2015Assignee: International Business Machines CorporationInventors: Graham M. Bates, Michael T. Brigham, Joseph K. Comeau, Jason P. Ritter, Matthew T. Tiersch, Eva A. Shah, Eric J. White
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Patent number: 8806740Abstract: A silicon chicklet pedestal for use in a wafer-level test probe of a wafer is provided and includes a main body, first and second opposing faces, and an array of vias formed through the main body to extend between the first and second faces, through which pairs of leads, respectively associated with each via at the first and second faces, are electrically connectable to one another.Type: GrantFiled: April 28, 2011Date of Patent: August 19, 2014Assignee: International Business Machines CorporationInventors: S. Jay Chey, Timothy C. Krywanczyk, Mohammed S. Shaikh, Matthew T. Tiersch, Cornelia Kang-I Tsang
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Patent number: 8734665Abstract: A composition and a method for chemical mechanical polishing. The composition includes a surfactant anion an alkyl alcohol, a controlled amount of chloride ion source and a diluent. The composition further includes abrasive particles and an oxidizer. The method includes providing the composition on a surface to be polished and polishing the surface by contacting the surface with a polishing pad.Type: GrantFiled: October 12, 2011Date of Patent: May 27, 2014Assignee: International Business Machines CorporationInventors: Graham M. Bates, Michael T. Brigham, Joseph K. Comeau, Jason P. Ritter, Eva A. Shah, Matthew T. Tiersch, Eric J. White
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Patent number: 8636917Abstract: A solution for forming a polishing slurry, the polishing slurry and related methods are disclosed. The solution for forming a polishing slurry may include 1H-benzotriazole (BTA) dissolved in an ionic surfactant such as a sodium alkyl sulfate solution, and perhaps a polyacrylic acid (PAA) solution. The solution can be filtered and used in a polishing slurry. This approach to solubilizing BTA results in a high BTA concentration in a polishing slurry without addition of foreign components to the slurry or increased safety hazard. In addition, the solution is easier to ship because it is very stable (e.g., can be frozen and thawed) and has less volume compared to conventional approaches. Further, the polishing slurry performance is vastly improved due to the removal of particles that can cause scratching.Type: GrantFiled: September 7, 2010Date of Patent: January 28, 2014Assignee: International Business Machines CorporationInventors: Joseph K. V. Comeau, Marina M. Katsnelson, Matthew T. Tiersch, Eric J. White
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Patent number: 8595919Abstract: A silicon chicklet pedestal for use in a wafer-level test probe of a wafer is provided and includes a main body, first and second opposing faces, and an array of vias formed through the main body to extend between the first and second faces, through which pairs of leads, respectively associated with each via at the first and second faces, are electrically connectable to one another.Type: GrantFiled: April 28, 2011Date of Patent: December 3, 2013Assignee: International Business Machines CorporationInventors: S. Jay Chey, Timothy C. Krywanczyk, Mohammed S. Shaikh, Matthew T. Tiersch, Cornelia Kang-I Tsang
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Publication number: 20130092651Abstract: A composition and a method for chemical mechanical polishing. The composition includes a surfactant anion an alkyl alcohol, a controlled amount of chloride ion source and a diluent. The composition further includes abrasive particles and an oxidizer. The method includes providing the composition on a surface to be polished and polishing the surface by contacting the surface with a polishing pad.Type: ApplicationFiled: October 12, 2011Publication date: April 18, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Graham M. Bates, Michael T. Brigham, Joseph K. Comeau, Jason P. Ritter, Eva A. Shah, Matthew T. Tiersch, Eric J. White
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Publication number: 20130078811Abstract: A composition and a method for chemical mechanical polishing. The composition includes a surfactant anion an alkyl alcohol and a diluent. The composition further includes abrasive particles and an oxidizer. The method includes providing the composition on a surface to be polished and polishing the surface by contacting the surface with a polishing pad.Type: ApplicationFiled: September 23, 2011Publication date: March 28, 2013Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Graham M. Bates, Michael T. Brigham, Joseph K. Comeau, Jason P. Ritter, Matthew T. Tiersch, Eva A. Shah, Eric J. White
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Patent number: 8328892Abstract: A solution for forming a polishing slurry, the polishing slurry and related methods are disclosed. The solution for forming a polishing slurry may include 1 H-benzotriazole (BTA) dissolved in an ionic surfactant such as a sodium alkyl sulfate solution, and perhaps a polyacrylic acid (PAA) solution. The solution can be filtered and used in a polishing slurry. This approach to solubilizing BTA results in a high BTA concentration in a polishing slurry without addition of foreign components to the slurry or increased safety hazard. In addition, the solution is easier to ship because it is very stable (e.g., can be frozen and thawed) and has less volume compared to conventional approaches. Further, the polishing slurry performance is vastly improved due to the removal of particles that can cause scratching.Type: GrantFiled: October 31, 2007Date of Patent: December 11, 2012Assignee: International Business Machines CorporationInventors: Joseph K. V. Comeau, Marina M. Katsnelson, Matthew T. Tiersch, Eric J. White
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Patent number: 8088690Abstract: The instant invention is a method of polishing a substrate including contacting a substrate having at least one metal layer including copper with a chemical-mechanical polishing composition. The CMP composition includes an abrasive, a surfactant, an oxidizer, an organic acid including polyacrylic acid or polymethacrylic acid, a corrosion inhibitor, and a liquid carrier. A portion of the copper in the metal layer is abraded to polish the substrate. A second CMP composition contacts the abraded substrate, the second acrylate free composition including an abrasive, a surfactant, an oxidizer, and a corrosion inhibitor, and a liquid carrier. Any dendrites that may have formed on the substrate are removed through abrasion.Type: GrantFiled: March 31, 2009Date of Patent: January 3, 2012Assignee: International Business Machines CorporationInventors: Thomas L. McDevitt, Graham M. Bates, Eva A. Shah, Matthew T. Tiersch, Eric J. White
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Publication number: 20110199108Abstract: A silicon chicklet pedestal for use in a wafer-level test probe of a wafer is provided and includes a main body, first and second opposing faces, and an array of vias formed through the main body to extend between the first and second faces, through which pairs of leads, respectively associated with each via at the first and second faces, are electrically connectable to one another.Type: ApplicationFiled: April 28, 2011Publication date: August 18, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: S. Jay Chey, Timothy C. Krywanczyk, Mohammed S. Shaikh, Matthew T. Tiersch, Cornelia Tsang
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Publication number: 20110199109Abstract: A silicon chicklet pedestal for use in a wafer-level test probe of a wafer is provided and includes a main body, first and second opposing faces, and an array of vias formed through the main body to extend between the first and second faces, through which pairs of leads, respectively associated with each via at the first and second faces, are electrically connectable to one another.Type: ApplicationFiled: April 28, 2011Publication date: August 18, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: S. Jay Chey, Timothy C. Krywanczyk, Mohammed S. Shaikh, Matthew T. Tiersch, Cornelia Tsang
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Patent number: 7987591Abstract: A silicon chicklet pedestal for use in a wafer-level test probe of a wafer is provided and includes a main body, first and second opposing faces, and an array of vias formed through the main body to extend between the first and second faces, through which pairs of leads, respectively associated with each via at the first and second faces, are electrically connectable to one another.Type: GrantFiled: August 13, 2009Date of Patent: August 2, 2011Assignee: International Business Machines CorporationInventors: S. Jay Chey, Timothy C. Krywanczyk, Mohammed S. Shaikh, Matthew T. Tiersch, Cornelia Kang-I Tsang
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Publication number: 20110037489Abstract: A silicon chicklet pedestal for use in a wafer-level test probe of a wafer is provided and includes a main body, first and second opposing faces, and an array of vias formed through the main body to extend between the first and second faces, through which pairs of leads, respectively associated with each via at the first and second faces, are electrically connectable to one another.Type: ApplicationFiled: August 13, 2009Publication date: February 17, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: S. Jay Chey, Timothy C. Krywanczyk, Mohammed S. Shaikh, Matthew T. Tiersch, Cornelia Tsang
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Publication number: 20100327219Abstract: A solution for forming a polishing slurry, the polishing slurry and related methods are disclosed. The solution for forming a polishing slurry may include 1H-benzotriazole (BTA) dissolved in an ionic surfactant such as a sodium alkyl sulfate solution, and perhaps a polyacrylic acid (PAA) solution. The solution can be filtered and used in a polishing slurry. This approach to solubilizing BTA results in a high BTA concentration in a polishing slurry without addition of foreign components to the slurry or increased safety hazard. In addition, the solution is easier to ship because it is very stable (e.g., can be frozen and thawed) and has less volume compared to conventional approaches. Further, the polishing slurry performance is vastly improved due to the removal of particles that can cause scratching.Type: ApplicationFiled: September 7, 2010Publication date: December 30, 2010Inventors: Joseph K. V. Comeau, Marina M. Katsnelson, Matthew T. Tiersch, Eric J. White
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Patent number: 7824568Abstract: A solution for forming a polishing slurry, the polishing slurry and related methods are disclosed. The solution for forming a polishing slurry may include 1H-benzotriazole (BTA) dissolved in an ionic surfactant such as a sodium alkyl sulfate solution, and perhaps a polyacrylic acid (PAA) solution. The solution can be filtered and used in a polishing slurry. This approach to solubilizing BTA results in a high BTA concentration in a polishing slurry without addition of foreign components to the slurry or increased safety hazard. In addition, the solution is easier to ship because it is very stable (e.g., can be frozen and thawed) and has less volume compared to conventional approaches. Further, the polishing slurry performance is vastly improved due to the removal of particles that can cause scratching.Type: GrantFiled: August 17, 2006Date of Patent: November 2, 2010Assignee: International Business Machines CorporationInventors: Joseph K. V. Comeau, Marina M. Katsnelson, Matthew T. Tiersch, Eric J. White
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Publication number: 20100248479Abstract: The instant invention is a method of polishing a substrate including contacting a substrate having at least one metal layer including copper with a chemical-mechanical polishing composition. The CMP composition includes an abrasive, a surfactant, an oxidizer, an organic acid including polyacrylic acid or polymethacrylic acid, a corrosion inhibitor, and a liquid carrier. A portion of the copper in the metal layer is abraded to polish the substrate. A second CMP composition contacts the abraded substrate, the second acrylate free composition including an abrasive, a surfactant, an oxidizer, and a corrosion inhibitor, and a liquid carrier. Any dendrites that may have formed on the substrate are removed through abrasion.Type: ApplicationFiled: March 31, 2009Publication date: September 30, 2010Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Thomas L. McDevitt, Graham M. Bates, Eva A. Shah, Matthew T. Tiersch, Eric J. White
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Publication number: 20080042099Abstract: A solution for forming a polishing slurry, the polishing slurry and related methods are disclosed. The solution for forming a polishing slurry may include 1 H-benzotriazole (BTA) dissolved in an ionic surfactant such as a sodium alkyl sulfate solution, and perhaps a polyacrylic acid (PAA) solution. The solution can be filtered and used in a polishing slurry. This approach to solubilizing BTA results in a high BTA concentration in a polishing slurry without addition of foreign components to the slurry or increased safety hazard. In addition, the solution is easier to ship because it is very stable (e.g., can be frozen and thawed) and has less volume compared to conventional approaches. Further, the polishing slurry performance is vastly improved due to the removal of particles that can cause scratching.Type: ApplicationFiled: August 17, 2006Publication date: February 21, 2008Inventors: Joseph K. V. Comeau, Marina M. Katsnelson, Matthew T. Tiersch, Eric J. White
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Patent number: 6355565Abstract: A ferric nitrate-alumina based slurry useful for Chemical-Mechanical-Polishing of tungsten metallurgy and silica based oxides on semiconductor substrates in which the suspension and stability of abrasive material in the slurry is essentially stable. The slurry formulation is balanced to provide low residue of foreign material after polishing and due to its reduced ferric nitrate concentration will be less corrosive than prior art slurries. The recipe for the slurry includes of a 30% wt silica suspension, about 800 ml of 40% by wt ferric nonahydrate, liters and enough 70% wt nitric acid to adjust the pH of the slurry to about 1.2 to 1.4.Type: GrantFiled: July 12, 2001Date of Patent: March 12, 2002Assignee: International Business Machines CorporationInventors: Paul M. Feeney, Timothy C. Krywanczyk, Lawrence D. David, Matthew T. Tiersch, Eric J. White