Patents by Inventor Matthew Tapping

Matthew Tapping has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Small form-factor pluggable (SFP) transceivers
    Patent number: 10389397
    Abstract: In an exemplary embodiment, a device generally includes a housing, an external heat sink, and at least one of a thermal interface material and a thermoelectric module generally between a side of the housing and the external heat sink. At least one spring contact is coupled to the side of the housing generally between the connector and the at least one of a thermal interface material and a thermoelectric module. The at least one spring contact and the at least one of a thermal interface material and a thermoelectric module define at least a portion of a thermally-conductive heat path between the housing and the external heat sink. Graphite is wrapped around the at least one spring contact and/or a thermally-conductive and electrically-conductive material is wrapped around at least a portion of the thermal interface material.
    Type: Grant
    Filed: July 24, 2017
    Date of Patent: August 20, 2019
    Assignee: LAIRD TECHNOLOGIES, INC.
    Inventors: Björn Edgren, Karl Göran Olof Ihrefjord, Matthew Tapping, Michael Scott Poulsen, Jason L. Strader, Eugene Anthony Pruss
  • SMALL FORM-FACTOR PLUGGABLE (SFP) TRANSCEIVERS
    Publication number: 20180034492
    Abstract: In an exemplary embodiment, a device generally includes a housing, an external heat sink, and at least one of a thermal interface material and a thermoelectric module generally between a side of the housing and the external heat sink. At least one spring contact may be coupled to the side of the housing generally between the connector and the at least one of a thermal interface material and a thermoelectric module. The at least one spring contact and the at least one of a thermal interface material and a thermoelectric module may define at least a portion of a thermally-conductive heat path between the housing and the external heat sink. Graphite may be wrapped around the at least one spring contact and/or a thermally-conductive and electrically-conductive material may be wrapped around at least a portion of the thermal interface material.
    Type: Application
    Filed: July 24, 2017
    Publication date: February 1, 2018
    Inventors: Björn Edgren, Karl Göran Olof Ihrefjord, Matthew Tapping, Michael Scott Poulsen, Jason L. Strader, Eugene Anthony Pruss