Abstract: A wafer carrier includes a base including a generally planar bottom surface and a top surface that includes a plurality of platforms extending above the top surface. The wafer carrier includes a thermal cover defining a plurality of pockets. The thermal cover is configured to be coupled to the base by at least one fastener and the plurality of pockets are arranged such that each pocket of the plurality of pockets is aligned with a corresponding platform of the plurality of the platforms when the thermal cover is supported by a plurality of first pedestals that extend from the top surface of the base. A plurality of second pedestals are located along the plurality of platforms for supporting the one or more wafers, wherein each platform includes at least one second pedestal that extends from a top surface of the platform for supporting one wafer.

Abstract: The instant invention is a method and apparatus for the measurement, with low uncertainty, of the six degrees of freedom of a first structure relative to a second structure. The apparatus is comprised of compact, rigid, thermally stable structures. The invention uses linear displacement transducers which have no active pointing to maintain a desired orientation of the linear displacement transducers with other parts of the measurement system.

Abstract: The instant invention is a method and apparatus for the measurement, with low uncertainty, of the six degrees of freedom of a first structure relative to a second structure. The apparatus is comprised of compact, rigid, thermally stable structures. The invention uses linear displacement transducers which have no active pointing to maintain a desired orientation of the linear displacement transducers with other parts of the measurement system.