Patents by Inventor Matthew W. Barlow

Matthew W. Barlow has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multiwire plate-enclosed ball-isolated single-substrate silicon-carbide-die package
    Patent number: 11723154
    Abstract: A silicon carbide die package with multiple wire access points utilizing top and bottom enclosure plate clamps housing a silicon carbide die on a printed wiring board with wire contact pads, and a set of set screws providing downward pressure from the top enclosure plate inside the center of a cylindrical isolation housing to an isolation ball positioned above a clamp discs to clamp a wire end between the clamp disc and the wire contact pad.
    Type: Grant
    Filed: February 16, 2021
    Date of Patent: August 8, 2023
    Inventors: Nicholas J. Chiolino, A. Matthew Francis, Matthew W. Barlow, Jacob Kupernik
  • Direct application additive manufacturing for conductive wafer interconnect
    Patent number: 11217659
    Abstract: An improved silicon carbide wafer using direct application conductive ink interconnects positioned on printing connection pads. The conductive ink interconnected can be routed to form a custom length resistive trace for a device after fabrication and measurement of the device.
    Type: Grant
    Filed: January 24, 2020
    Date of Patent: January 4, 2022
    Inventors: Matthew W. Barlow, Nicholas J. Chiolino, Anthony M. Francis, James A. Holmes