Abstract: In one embodiment, a system includes a wafer and a plurality of contact pads positioned on the wafer. Each contact pad includes a multi-layer stud and a cap layer. The multi-layer stud includes at least a bottom layer and a top layer, the bottom layer being positioned on and extending from an upper surface of the wafer substantially in a direction perpendicular to the upper surface of the wafer, and the top layer being positioned above the bottom layer and substantially extending in the direction perpendicular to the upper surface of the wafer. The cap layer is positioned on the top layer of the multi-layer stud and extends beyond sidewalls of the multi-layer stud substantially in a direction parallel to the upper surface of the wafer. The bottom layer has a larger cross-sectional area than any layer of the multi-layer stud positioned thereabove.

Abstract: An electroplated film is deposited over a substrate with a plating frame pattern that includes a plating field defined by a plurality of individual features. By dividing the plating field into a plurality of individual features, the delamination force at any location on the plating field is greatly reduced. Thus, a film with a large stress, such as a high moment film, may be plated to a greater thickness than is possible with conventionally plated films.