Patents by Inventor Matthew W. Oonk

Matthew W. Oonk has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8288828
    Abstract: A via contact is provided to a diffusion region at a top surface of a substrate which includes a single-crystal semiconductor region. The via contact includes a first layer which consists essentially of a silicide of a first metal in contact with the diffusion region at the top surface. A dielectric region overlies the first layer, the dielectric region having an outer surface and an opening extending from the outer surface to the top surface of the substrate. A second layer lines the opening and contacts the top surface of the substrate in the opening, the second layer including a second metal which lines a sidewall of the opening and a silicide of the second metal which is self-aligned to the top surface of the substrate in the opening. A diffusion barrier layer overlies the second layer within the opening. A third layer including a third metal overlies the diffusion barrier layer and fills the opening.
    Type: Grant
    Filed: September 9, 2004
    Date of Patent: October 16, 2012
    Assignee: International Business Machines Corporation
    Inventors: Michael M. Iwatake, Kevin E. Mello, Matthew W. Oonk, Amanda L. Piper, Yun Y. Wang, Keith K. Wong
  • Patent number: 7538029
    Abstract: Silicide is protected during MC RIE etch by first forming an oxide film over the silicide and, after performing MC RIE etch, etching the oxide film. The oxide film is formed from a film of alloyed metal-silicon (M-Si) on the layer of silicide, then wet etching the metal-silicon. An ozone plasma treatment process can be an option to densify the oxide film. The oxide film may be etched by oxide RIE or wet etch, using 500:1 DHF.
    Type: Grant
    Filed: July 6, 2005
    Date of Patent: May 26, 2009
    Assignee: International Business Machines Corporation
    Inventors: Yun-Yu Wang, Christian Lavoie, Kevin E. Mello, Conal E. Murray, Matthew W. Oonk