Abstract: A system for wearable authentication and management is disclosed. In particular, the system may include identifying and authenticating a user through biometric data or movement signatures specific to the wearer of a wearable device. Once the user and wearable device are authenticated, the system may activate and provision connectivity services for the wearable device, associate the device with a device ecosystem of the user, and push predefined settings to the wearable device. Additionally, the system may deliver communications that are transmitted to other devices in the device ecosystem to the wearable device while the wearable device is worn by the user. If the user no longer wears the wearable device or the wearable device is not utilized for a period of time, the system may deactivate the connectivity services for the wearable device and remove any settings pushed to the wearable device.

Abstract: A fully automated plasma sheet metal cutter that can be integrated into a HVAC coil-line and which increases the precision of cutting, decreases the time it takes to cut a particular component sheet metal part, and offers flexibility in cutting different sized and shaped holes or openings. Further, since the system is fully automated, it eliminates the error or cost attributed to a portion of the cutting process that heretofore has been associated with a manual laborer.

Abstract: A method and system for enhancing user engagement during wellness program interaction includes presenting health information to the user, collecting data and modifying the information presented to the user in enhance the user's engagement with the wellness program.

Abstract: A fully automated plasma sheet metal cutter that can be integrated into a HVAC coil-line and which increases the precision of cutting, decreases the time it takes to cut a particular component sheet metal part, and offers flexibility in cutting different sized and shaped holes or openings. Further, since the system is fully automated, it eliminates the error or cost attributed to a portion of the cutting process that heretofore has been associated with a manual laborer.

Abstract: A fully automated plasma sheet metal cutter that can be integrated into a HVAC coil-line and which increases the precision of cutting, decreases the time it takes to cut a particular component sheet metal part, and offers flexibility in cutting different sized and shaped holes or openings. Further, since the system is fully automated, it eliminates the error or cost attributed to a portion of the cutting process that heretofore has been associated with a manual laborer.

Abstract: A fully automated plasma sheet metal cutter that can be integrated into a HVAC coil-line and which increases the precision of cutting, decreases the time it takes to cut a particular component sheet metal part, and offers flexibility in cutting different sized and shaped holes or openings. Further, since the system is fully automated, it eliminates the error or cost attributed to a portion of the cutting process that heretofore has been associated with a manual laborer.

Abstract: A method and system for enhancing user engagement during wellness program interaction are disclosed.

Abstract: A method and system for assessing user engagement during wellness program interaction are disclosed.

Abstract: As an improvement to the architecture, utility, efficiency and cost associated with the procurement, setup, and operation of a power system for utilization in aerospace, military, commercial, consumer, educational and transportation platforms. A scalable, modular and intelligent power system (10) as illustrated in FIG. 1 consists of a power system (12), and a communications system (14). Power system (12) is comprised of a scalable array of ICP's (16) isolated from each other via schottky diodes (34), with the combined power out put of ICP1 through ICPx (16) resulting in a final power system output (36), with its corresponding power system ground (38). Communications system (14) is comprised of a communications processor (24) interfacing internally with each individual ICP1 through ICPx (16) via opto isolated I2C communication port (30), enabling bi-directional communications between power system (12) and the outside world via external communications portal (26).

Abstract: Tuned Electromagnetic Bandgap (EBG) devices, and a method for making and tuning tuned EBG devices are provided. The method includes the steps of providing first and second overlapping substrates, placing magnetically alignable conductive material between the substrates, and applying a magnetic field in the vicinity of the magnetically alignable conductive material to align at least some of the material into conductive vias. The method further includes the steps of physically altering via characteristics of EBG devices to tune the bandpass and resonant frequencies of the EBG devices.

Abstract: A surface mount connector and assembly including the surface mount connector is shown and described. The assembly comprises a substrate and a connector including a carrier, and at least one electrical connecting element having first and second ends, wherein at least a portion of the first end extends through the carrier to electrically adjoin and physically secure the connector to the substrate. A reinforcement medium is disposed about at least a portion of surface mount connector and said substrate.

Abstract: A technique for manufacturing an electronic assembly uses a mold that has a first mold portion and a second mold portion. The first mold portion includes a plurality of spaced mold pins extending from an inner surface. A cavity of the first and second mold portions provides a mold cavity, when joined. A backplate is also provided that includes a plurality of support pedestals and an integrated heatsink extending from a first side of the backplate. A substrate includes a first side of an integrated circuit (IC) die mounted to a first side of the substrate. The backplate and the substrate are placed within the cavity of the second mold portion and the support pedestals are in contact with the first side of the substrate. The first and second mold portions are joined and the mold pins contact a second surface of the substrate during an overmolding process.

Abstract: A flip chip package and method for conducting heat from one or more flip chips within the package. The package includes a substrate having a first surface to which the flip chips are attached with solder connections, a second surface with solder balls electrically connected to the solder connections on the first surface, and a heat-spreading member bonded to the flip chips and to the first surface of the substrate with bond materials. The method includes reflow soldering the flip chips to the first surface of the substrate, attaching the solder balls to the second surface of the substrate, applying a bond material to the flip chips and a second bond material to the substrate, placing the heat-spreading member on the bond materials, and then applying heat to bond the heat-spreading member to the flip chips and substrate with the bond materials.

Abstract: An electronic assembly with integral thermal transient suppression includes an integrated circuit (IC) chip disposed within a cavity of an IC device package. A transient thermal suppression material (TTSM) is disposed in the cavity in thermal contact with the IC chip. A heat sink may also be provided in thermal contact with the chip. When present, the heat sink serves as a cover of the packaged IC chip and may include fins extending from an upper surface (in contact with air) and a lower surface (in thermal contact with the TTSM). The TTSM may be thought of as a phase change material that absorbs energy dissipated by the IC chip in a phase change event.

Abstract: An electronic module includes a substrate, at least one surface mounted integrated circuit (IC) component and an underfill material. The substrate includes a plurality of electrically conductive traces, formed on at least one surface of the substrate, and the component is electrically coupled to at least one of the conductive traces. The underfill material is positioned between the component and the substrate and provides at least one pedestal that supports the component during encapsulation. The underfill material, when cured, maintains the integrity of the electrical connections between the component and the conductive traces.

Abstract: Apparatus and method is disclosed for providing a safety system for power equipment comprising a machine having a lower tool, an upper tool, and a safety controller. The lower tool is electrically isolated from the reversible upper tool. A safety controller is coupled to the lower tool. A pair of electrically conductive gloves that are coupled to the safety controller are worn by an operator of the power equipment. Electrically conductive stock is held with the pair of electrically conductive gloves, the safety controller allowing the machine to operate when the electrically conductive stock contacts the lower tool.

Abstract: A heat sinkable package that includes a power device package including an active side and a non-active side is disclosed. The non-active side includes a heat sinkable surface positioned adjacent to a product case. Another embodiment of the invention is directed to a method for manufacturing a heat sinkable package. The method comprises the steps of placing at least one flip chip over a flexible circuit within a mold tool; compensating for height variances of the flip chips; and positioning an input/output on an active side of the power device package opposite a non-active side of the power device package.

Abstract: A package and packaging method that incorporates multiple surface-mounted devices mounted to the package, which in turn can be mounted onto a circuit board. The package generally includes a pair of laminate substrates that together form a chip carrier and input/output (I/O) interface structure for the devices. The devices are mounted to opposite surfaces of a first of the substrates. The second substrate is attached to the first substrate, and has an interior opening therethrough. The first and second substrates are attached to each other such that devices mounted on one surface of the first substrate are disposed within the interior opening of the second laminate substrate. A mold compound can be applied to underfill and encapsulate the devices mounted to the surfaces of the first substrate.

Abstract: A thermally enhanced electronic module includes a thermally conductive case, a self-aligning thermally conductive heat sink and an integrated circuit (IC) package. The case includes an aperture sized for receiving a portion of the heat sink. The IC package includes a first surface and a second surface, opposite the first surface, and is mounted to a substrate with the first surface of the IC package facing the substrate. The second surface of the IC package is in thermal contact with the heat sink, when the heat sink is positioned in the aperture and secured to the case.